Method for mounting integrated circuit chips on a mini-board

DETAILED DESCRIPTION The present invention allows an integrated circuit chip die or dice to be easily mounted onto a printed circuit board substrate.
The present invention accomplishes this by mounting the chip die onto a planar substrate of small size relative to the printed circuit board of the electronic system.
The use of the small planar substrate has many advantages over direct mounted COB technology as will be more fully described hereinafter.
A small circuit board (hereinafter a "Mini-Board") or other small assembly device (usually made of fiberglass or other traditional circuit board materials; or which may be made of ceramics, glass, silicon or other rigid materials; or which may be made of mylar or other stiffened flexible materials) may be utilized to mount one or more integrated circuit chip die face up, face down or a combination of both.
The chip dice may be mounted on one side of the Mini-Board or on both sides.
Conventional wire bonding or tape automated bonding (TAB) may be utilized to electrically connect the conductors of the Mini-Board to a face up integrated circuit chip die having exposed connection pads.
Solder bump attachment technology may be utilized to attach a face down chip to the Mini-Board conductors.
An object of the present invention is to more easily attach integrated circuit dice to conventional printed circuit boards having a coarser conductor pattern than the integrated circuit chip die connection pads.
Another object is an apparatus and method to more easily test integrated circuit assemblies before integrating them into the printed circuit board of a finished product.
Still another object is an apparatus and method to more easily test integrated circuit assemblies after integrating them into the printed circuit board of a finished product.
A further object of the invention is to adjust the pitch of the Mini-Board interconnections so as to match the conductor pitch of a system circuit board with the more narrow connection pads of the integrated circuit chip die