Precision spray processes for direct write electronic components |
| OF THE INVENTION In accordance with the present invention, there are provided methods for direct ... |
|
Multiple beams and nozzles to increase deposition rate |
| OF THE INVENTION A schematic of the preferred embodiment of this invention is given in FIG. 1, ... |
|
Optical memory device and a method for manufacturing thereof |
| It is a major object of the present invention to provide a novel method of manufacturing an optical ... |
|
Integrated circuit structure having a flip-chip mounted photoreceiver |
| In accordance with the present invention, an IC package structure includes a photoreceiver flip-... |
|
High-density electronic package, and method for making same |
| What is claimed is: 1. An electronic package having contacts adapted to be attached to a substrate, ... |
|
Forming structures from CAD solid models |
| The present invention pertains generally to a class of material deposition processes that use a ... |
|
Interposer and methods for fabricating same |
| OF THE INVENTION The Interposer FIGS. 1, 1A, 1B, and 2 depict an exemplary interposer 100 of the ... |
|
Energy beam patterning of protective layers for semiconductor devices |
| According to the present invention, a method for forming resist or other protective patterns on a ... |
|
|
Method for photographically improving the resolution of screen printed photopolymer images
| Details |
Inventors: Sullivan, Donald F.;
Assignee:
Primary Examiner:
Assistant Examiner:
Attorney, Agent or Firm:
A process is described for improving the quality of images which have been formed by screen printing a liquid photo curable photopolymer. Images formed by screen printing, especially heavy coatings such as solder masks on printed wiring boards, inherently have indistinct boundaries, and may have feathered edges and photopolymer smears. These indistinct boundaries are removed and the resolution improved by a process which utilizes the oxygen inhibition effect characteristic of selected photopolymers. Thus, a screen printed image can be 0.001 inches thick at the center of a line, tapering off to 0.0001 inch thick smears, and these smears may be eliminated by irradiating the entire image with a moderate amount light energy, which cures the thick image portion and leaves a liquid boundary layer on the order of 0.0001 inch thick due to the oxygen effect. When washed with a mild solvent the liquid layer is removed, including the smears, leaving the thick image portion undisturbed. In a preferred embodiment a phototransparency is interposed over and out of contact with the images and then irradiated with non-collimated UV light so as to harden the thicker image sections while indistinct boundary areas are shielded by opaque phototransparency areas. Light undercutting due to the use of non-collimated light does not polymerize the smears because of the oxygen-inhibition effect and the thinness of the smears, and thus only the undersirable smears will be inhibited and left in the liquid state for removal to improve the resolution. |
|
DETAILED DESCRIPTION I claim: 1. The process of improving resolution of printed photopolymer patterns of low resolution because of smears at the pattern edges, comprising the steps of: printing on a substrate surface a pattern of photopolymer with an oxygen inhibited characteristic that leaves the surface in liquid form to a predetermined depth when photoexposed in the presence of air with a predetermined amount of radiation energy, wherein the printing leaves a low resolution pattern with smears of substantially reduced thickness from that of the polymer thickness of the pattern appearing at edge portions of the pattern, photoexposing the polymer pattern with the surface in contact with air to radiation of such energy that the smears are left in liquid form while polymerizing at least a substantial thickness of the polymer defining the pattern to adhere to the substrate and resist solvency to a predetermined solvent that will remove the liquid form smears of the polymer, and removing the liquid form smears with said solvent in a development step thereby to increase the resolution of the remaining polymerized pattern. 2. The process defined in claim 1 including the further steps of: photoexposing the entire pattern and smear surface with said photoexposing step to leave the surface of the pattern in liquid form to said predetermined depth, and removing the liquid polymer from the pattern surface with the development step removing the smears. 3. The process defined in claim 1 including the further step of: photoexposing the polymer pattern in said photoexposing step through a phototransparency separated from the polymer pattern by an air gap and registering a desired photopattern over the screen printed pattern having smear areas blocked from radiation by opaque portions of the phototransparency with sufficient radiation energy to polymerize the desired pattern throughout the depth of the polymer while leaving smears at the edges of the desired pattern in liquid form for removal in the development step
|
| Related patents |
|
|
High resolution printed circuits formed in photopolymer pattern indentations overlaying printed wiring board substrates
I claim: 1. The process of producing high resolution closely spaced printed circuits on a substrate which may have surface irregularities, comprising the steps of: ...
|
|
|
Method of manufacturing a three-dimensional plastic article
Briefly, according to the invention, there is provided a method for producing a three dimensional plastic article having an insert. The three dimensional plastic article ...
|
|
|
Method of forming a three-dimensional printed circuit assembly
Briefly, according to the invention, there is provided a method of making a three-dimensional printed circuit assembly. A substrate is first formed from a photoactive ...
|
|
|
Multilayer circuit board having microporous layers and method for making same
Referring to FIG. 1, the first step in constructing a representative single-sided printed wiring board (PWB) using mass seeding is to hot-roller laminate a layer 10 of ...
|
|
|
Method for mounting integrated circuit chips on a mini-board
The present invention allows an integrated circuit chip die or dice to be easily mounted onto a printed circuit board substrate. The present invention accomplishes this ...
|
|
|
Method and apparatus for testing unpackaged semiconductor dice
In accordance with the present invention, an improved method and apparatus for testing unpackaged semiconductor dice are provided. The method includes forming an ...
|
|
|
Method of combining metal and ceramic inserts into stereolithography components
In accordance with the teachings of the present invention, a stereolithography process for developing a part is disclosed in which inserts of a non-photopolymer material ...
|
|
|
Semiconductor device
OF THE PREFERRED EMBODIMENTS Preferred embodiments of the present invention will now be explained in detail with reference to the drawings. FIG. 1 and FIG. 2 show the ...
|
|
|
Optical memory device and a method for manufacturing thereof
It is a major object of the present invention to provide a novel method of manufacturing an optical memory device, particularly such a method which is suitable for mass ...
|
|
|
Semiconductor package and manufacturing method thereof
The present invention was carried out to solve these problems. That is, an object of the present invention is to provide a semiconductor package which is thin, compact ...
|
|
|