 Structure for an optical switch on a substrate |
| FIG. 1 shows an embodiment of optical cross-connect system 100 in accordance with the invention. T... |
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| Micro-electro-mechanical-system (MEMS) mirror device and methods for fabricating the same |
| A micro-electro-mechanical-system (MEMS) mirror device is disclosed. The MEMS mirror device ... |
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| Semiconductor device |
| Objects of the Invention It is an object of the present invention to provide a semiconductor device ... |
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| Method of manufacturing spatial light modulator and electronic device employing it |
| It is the object of the present invention to provide a spatial light modulator equipped with ... |
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| Distributed constant element using a magnetic thin film |
| As described above, the development and practicability of a magnetic thin-film device are delayed. I... |
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| Charge coupled device package |
| OF THE PREFERRED EMBODIMENT FIG. 4 shows a printed circuit interconnection frame of the present ... |
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| Magnetic element, magnetic read head, magnetic storage device, magnetic memory device |
| It is therefore an object of the present invention to provide a new and improved magnetic element ... |
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| Method for modifying switching field characteristics of magnetic tunnel junctions |
| Reference is now made to FIG. 1, which illustrates an MRAM device 10 including a resistive cross ... |
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| Buffered-layer memory cell |
| The present invention provides a CMR memory device structure that can be reliably programmed using ... |
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Method of fabricating a microelectronic device package with an integral window
| Details |
Inventors: Peterson, Kenneth A.; Watson, Robert D.;
Assignee: Sandia Corporation (Albuquerque, NM)
Primary Examiner: Fahmy; Wael
Assistant Examiner: Kebede; Brook
Attorney, Agent or Firm: Watson; Robert D.
A method of fabricating a microelectronic device package with an integral window for providing optical access through an aperture in the package. The package is made of a multilayered insulating material, e.g., a low-temperature cofired ceramic (LTCC) or high-temperature cofired ceramic (HTCC). The window is inserted in-between personalized layers of ceramic green tape during stackup and registration. Then, during baking and firing, the integral window is simultaneously bonded to the sintered ceramic layers of the densified package. Next, the microelectronic device is flip-chip bonded to cofired thick-film metallized traces on the package, where the light-sensitive side is optically accessible through the window. Finally, a cover lid is attached to the opposite side of the package. The result is a compact, low-profile package, flip-chip bonded, hermetically-sealed package having an integral window. |
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DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method of fabricating a package having an integral window, for packaging at least one microelectronic device.
The present invention also relates to a method of packaging at least one microelectronic device inside a package having an integral window.
The present invention also relates to a method of packaging MEMS devices wherein the MEMS device is released after mounting, but before attaching the window.
It should be noted that the examples of the present invention shown in the figures are sometimes illustrated with the window facing down, which is the preferred orientation during flip-chip bonding.
However, those skilled in the art will understand that the completed package can be oriented for use with the window facing upwards.
It should also be noted that all of the figures show only a single microelectronic device, illustrated as a microelectronic device, or as a pair of chips or devices.
It is intended that the method of the present invention should be understood by those skilled in the art that the present invention can be applied equally to fabricating a package for packaging a plurality of chips in a one-dimensional or a two-dimensional array, as in a multi-chip module (MCM), including multiple windowed-compartments, including having a window on either side of the package.
FIG.
3 shows a schematic cross-section view of a first example of a package 8 for packaging at least one microelectronic device according to the present invention, comprising an package 10 of electrically insulating plates.
Package 10 of FIG.
3 comprises a first plate 16, having a first surface 20, an opposing second surface 18, and a first aperture 22 through plate 16.
Plate 16 also has an electrically conductive metallized trace 24 disposed on surface 18.
Plate 16 further comprises a window 26 bonded to plate 16, for providing optical access to a microelectronic device 100 that would be inserted inside package 10.
In FIG.
3, package 10 further comprises a second plate 30, which has a third surface 34, an opposing fourth surface 32, and a second aperture 36 through plate 30 for providing access to insert a microelectronic device into package 10
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MEMS 
