Method of forming a three-dimensional printed circuit assembly

DETAILED DESCRIPTION Briefly, according to the invention, there is provided a method of making a three-dimensional printed circuit assembly.
A substrate is first formed from a photoactive polymer that is capable of altering its physical state when exposed to a radiant beam.
At this point, the substrate is only partially cured.
A conductive circuit pattern is then formed on the partially cured substrate.
The substrate is then molded to create a three-dimensional structure, and then further cured to cause the photoactive polymer to harden completely.
In an alternate embodiment of the invention, a method of making a radio having a three-dimensional printed circuit board is presented.
A three-dimensional printed circuit board is created by forming a substrate by means of stereolithography, the substrate being only partially cured.
A conductive circuit pattern is formed on the substrate.
The substrate is shaped to provide three-dimensional features by heating and softening it to cause it to assume the shape of a mold form.
The substrate is cured further to cause it to harden into the desired shape, and is then populated with components to create a portion of the radio circuitry.