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Method of manufacturing a three-dimensional plastic article
| Details |
Inventors: Reiff, David E.; Dorinski, Dale W.; Hunt, Stephen D.;
Assignee: Motorola, Inc. (Schaumburg, IL)
Primary Examiner: Tentoni; Leo B.
Assistant Examiner:
Attorney, Agent or Firm: Dorinski; Dale W.
A method for producing a three dimensional plastic article having an insert. The three dimensional plastic article (20) is formed by exposing a liquid photopolymer or other material (14) capable of selective solidification or curing to a source of energy (10), preferably a laser beam (30). A portion of the three dimensional plastic article is formed by selectively exposing portions of the surface (12) of the liquid photopolymer to the laser beam. The insert (26) is placed onto the partially formed article (20), and the remainder of the article is formed by selectively exposing additional portions of the surface (16) of the liquid polymer to the laser beam, creating successive layers, whereupon a plurality of the layers form the three dimensional article (20). The insert (26) becomes an integral part of the completed three-dimensional article. |
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DETAILED DESCRIPTION Briefly, according to the invention, there is provided a method for producing a three dimensional plastic article having an insert.
The three dimensional plastic article is formed by exposing a medium capable of selective physical transformation to a source of synergistic stimulation, such as a laser beam.
A portion of the three dimensional plastic article is formed by selectively exposing portions of the surface of the medium to the laser beam.
The insert is placed onto the partially formed article such that the insert is fixtured in the article, and the remainder of the article is formed by selectively exposing further portions of the surface of the medium to the laser beam, whereupon the insert is captivated and becomes a part of the three dimensional article.
In a further embodiment of the invention, there is provided a method of producing a chip carrier.
A computer-based model of the chip carrier is made, and a support structure is formed by selectively exposing the surface of a liquid photopolymer to a laser beam of ultraviolet light.
A substrate having an integrated circuit electrically and mechanically attached to the substrate is located on the support structure.
The remaining layers of the chip carrier are formed by selectively exposing the surface of the material to the beam of ultraviolet light, and recoating the chip carrier and exposing the photopolymer so as to form a plurality of successive layers that create a chip carrier having an integrated circuit substantially contained within the carrier.
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MEMS 
