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Method of fabricating solar cell with integrated interconnect
OF THE INVENTION Referring to FIGS. 1 and 2 of the drawing, a solar cell embodying the present invention is generally designated as 10, and is fabricated from a ...
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Polyimide composition and method for protecting photoreactive cells
OF THE INVENTION Referring now in more detail and by reference characters to the drawing, there is shown a solar cell having a polyimide coating as hereinafter ...
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Solar cell with combined metallization and process for producing the same
It is an object of the present invention to provide an improved process for producing front and rear side contacts of silicon solar cells which allows simple production ...
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Method for forming a dielectric layer
The present invention was made in view of the above problems. Therefore, a feature of the present invention is directed toward providing a method of forming a void-free ...
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Plasma etching method with enhanced anisotropic property and apparatus thereof
We claim: 1. A method of etching a substrate interconnection layer of material selected from the group consisting of aluminum alloy, polysilicon, tungsten and tungsten ...
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Bromine and iodine etch process for silicon and silicides
Objects In view of the above discussion, it is one object of the present invention to provide a silicon etch process that is suitable for reproducibly forming deep ...
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Apparatus and related method for the removal of labels and foil tags adhering to containers, in particular, to bottles
The present invention relates to an apparatus for the removal of labels and foil tags adhering to containers, in particular, to bottles of varying heights, and the ...
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Method for producing contact structures in solar cells
What is claimed is: 1. A process for fabricating contact structures in solar cells, which have at least one first layer or first sequence of layers over a second layer ...
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Semiconductor element having a p-zone on the anode side and an adjacent, weakly doped n-base zone
It is the object of the invention to provide a semiconductor element having a p-zone on the anode side and an adjacent weakly doped n-zone which combines improved ...
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Integrated circuit devices with solderable lead frame
The present invention embodies a packaged device with a lead frame, a lead frame and an article of manufacture comprising a base metal, a layer of nickel on the base ...
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