|
|
Method of manufacturing a printed circuit assembly
OF THE PREFERRED EMBODIMENTS The invention incorporates two primary aspects. The first deals with controlling the separation between opposing printed circuit layers in ...
|
|
|
Monolithic pin diode and method for its manufacture
The present invention resides in a diode that is fabricated in a monolithic semiconductor device and that exhibits desirable PIN diode characteristics. A key feature of ...
|
|
|
Face-down bonding pin diode
The present invention aims to provide a diode device, having both electrodes provided on the same surface thereof, which can be face-down bonded to a circuit board. In ...
|
|
|
Memory card
According to studies made by the present inventors it has turned out that the following problems are involved in the memory cards of such a conventional structure as ...
|
|
|
High-frequency hybrid semiconductor integrated circuit structure including multiple coupling substrate and thermal dissipator
It is therefore an object of the present invention to provide a high-frequency semiconductor hybrid integrated circuit having an excellent high-frequency characteristics,...
|
|
|
Hybrid IC
A hybrid IC of the invention includes: a substrate; at least one inductor formed on the substrate; a semiconductor chip mounted on the substrate by flip-chip bonding; at ...
|
|
|
Resin-sealed electronic apparatus for use in internal combustion engines
It is therefore a primary objective of the present invention to provide a new and improved electronic apparatus capable of achieving enhanced durability (long life-time) ...
|
|
|
Two-dimensional image pickup apparatus
In view of the above described circumstances, it is therefore an object of the present invention to provide a small, down-sized image pickup apparatus that is free from ...
|
|
|
Color filter with resist material in scribe lines
A method for processing a semiconductor substrate comprises the steps of: providing a substrate having a plurality of scribe lines having a step height and arranged to ...
|
|
|
Method and apparatus for preparing a plurality of dice in wafers
Methods and apparatuses for modulating an optical beam in an optical device are disclosed. In the following description numerous specific details are set forth in order ...
|