Micro-electro mechanical device made from mono-crystalline silicon and method of manufacture therefore

DETAILED DESCRIPTION It is therefore one object of the present invention to provide an improved micro-electro-mechanical device and method of manufacture therefore with a monolithic unitary structure of micro-sensors and integrated circuits; It is another object of the present invention to provide an improved micro-electro-mechanical device and method of manufacture therefore which allows for the fabrication of the suspended microstructures by dry etching; It is another object of the present invention to provide an improved micro-electro-mechanical device which has low temperature processing, thereby allowing for the use of wafers with pre-selected integrated circuits as a substrate; It is yet another object of the present invention to provide an improved micro-electro-mechanical device which allows for large proof mass from thick, low stress, mono-crystalline-silicon film for high sensitivity.
The above and other objects are achieved as is now described.
A micro-electro-mechanical device with a suspended structure is formed from mono-crystalline silicon, bonded to a substrate wafer with an organic adhesive layer, wherein part of the organic adhesive layer serves as support and spacer and the rest of the organic adhesive layer serves as a sacrificial layer.
The fabrication is completed with a monolithic surface micro-machining technique and said sacrificed organic adhesive layer is removed by a dry etch means.