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Semiconductor device and method of fabricating same
It is an object of the present invention to provide a method of fabricating TFTs in which the foregoing problems have been mitigated. One embodiment of the present ...
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Trench isolation for micromechanical devices
In order to achieve the foregoing and to overcome the problems inherent in prior electrical isolation schemes, the present invention is directed to a beam-level ...
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Method of making diode having reflective layer
OF THE INVENTION Reference will now be made in detail to the present invention, examples of which are illustrated in the accompanying drawings. In order to fabricate GaN...
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Electrode structures
The method is based on the enhancement of material removal rates that are obtained when materials are exposed to a directed ion beam at oblique ion incidence. The ...
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Wafer bonding hermetic encapsulation
One object of the present invention is to provide a method for encapsulation which does not rely on encapsulation of an electronic device in a resin. Another object of ...
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Etch control seal for dissolved wafer micromachining process
An embodiment of the present invention modifies a dissolved wafer micromachining process by providing an etch control seal around the perimeter of a heavily doped ...
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Dry etch process control using electrically biased stop junctions
Microelectromechanical systems (MEMS) are microdevices widely used as advanced sensors, microfluidic controls, or micromachines. Advanced MEMS sensors can be found in ...
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Method of formation of thin bonded ultra-thin wafers
As the demand for high performance and diverse applications increases, semiconductor devices must be made with thinner layers that have more abrupt transitions between ...
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Method of anodic wafer bonding
The present invention comprises an improved process for protecting fragile microelectronic and microelectromechanical (MEM) structures on a low conductivity substrate ...
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Dissolved wafer fabrication process and associated microelectromechanical device having a support substrate with spacing mesas
As set forth below, the method for forming a MEMS device and the associated MEMS device of the present invention overcome the deficiencies identified with conventional ...
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