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MEMS

Microactuator-with-an-improved-semiconductor-substrate-and-method-of-forming-the-same

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Strongly complex coupled DFB laser series

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OF THE PREFERRED EMBODIMENT Referring to FIGS. 1, 2 and 3, a flip chip package for micromachined ...

Pre-release plastic packaging of MEMS and IMEMS devices

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Silicon-controlled rectifier structures on silicon-on insulator with shallow trench isolation

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Microactuator with an improved semiconductor substrate and method of forming the same

Details

Inventors: Suzuki, Kenichiro;
Assignee: NEC Corporation (Tokyo, JP)
Primary Examiner: Chaudhuri; Olik
Assistant Examiner: Ha; Nathan W.
Attorney, Agent or Firm: Young & Thompson

The present invention provides semiconductor substrate for a microactuator having at least a movable part and a stator, wherein the semiconductor substrate has a plurality of semiconductor tapered projections being unitary formed with the semiconductor substrate and being in contact with only part of the stator, and at least a recessed portion defined in plane shape by the semiconductor tapered projections so that the recessed portion extends under entire bottom surfaces of the movable part and under partial bottom surfaces of the stator.

DETAILED DESCRIPTION Accordingly, it is an object of the present invention to provide a novel microactuator free from the above problems.
It is a further object of the present invention to provide a novel microactuator which is free from any accidental adhesion between a movable part or a movable electrode and a substrate surface during fabrication processes for the microactuator.
It is a still further object of the present invention to provide a novel microactuator which is free from any accidental adhesion between a movable part or a movable electrode and a substrate surface during operations of the microactuator.
It is yet a further object of the present invention to provide a novel microactuator which is improved in operational stability.
It is a further more object of the present invention to provide a novel substrate structure of a microactuator free from the above problems.
It is still more object of the present invention to provide a novel substrate structure of a microactuator which is free from any accidental adhesion between a movable part or a movable electrode and a substrate surface during fabrication processes for the microactuator.
It is moreover object of the present invention to provide a novel substrate structure of a microactuator which is free from any accidental adhesion between a movable part or a movable electrode and a substrate surface during operations of the microactuator.
It is another object of the present invention to provide a novel substrate structure of a microactuator which is improved to operational stability.
It is still another object of the present invention to provide a novel method of fabricating a microactuator free from the above problems.
It is yet another object of the present invention to provide a novel method of fabricating a microactuator which is free from any accidental adhesion between a movable part or a movable electrode and a substrate surface during fabrication processes for the microactuator.
It is further another object of the present invention to provide a novel method of fabricating a microactuator which is free from any accidental adhesion between a movable part or a movable electrode and a substrate surface during operations of the microactuator

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