Micromechanical acceleration sensor

DETAILED DESCRIPTION The object of the invention is to provide a capacitive acceleration sensor in order to avoid the disadvantages stated above.
According to the invention there is a micromechanical acceleration sensor consisting of a first semiconductor wafer and a second semiconductor wafer, where on the first semiconductor wafer at least a first electrode is provided to create a variable capacitance and the second semiconductor wafer has a movable second electrode, and where on the first semiconductor wafer there is a microelectronic evaluation unit.
The advantages of the invention are that the manufacture of the evaluation electronics and the micromechanical sensor can take place separately and with the technology that is optimal in either case, and that the end product is still a single chip.
Because the chips on which the evaluation electronics is integrated provide hermetic encapsulation of the sensor, there is no need for an expensive hermetically sealed housing.
Additionally, the fundamental design of the sensor according to the invention results in a very high dynamic response.
An embodiment example of the invention is described in detail below and portrayed in the Figures.