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 Multicolor-color sensor

Details
Inventors: Stiebig, Helmut; Knipp, Dietmar; Folsch, Joachim; Wagner, Heribert;
Assignee: Forschungszentrum Julich GmbH (Julich, DE)
Primary Examiner: Ngo ; Ngan V.
Assistant Examiner:
Attorney, Agent or Firm: Dubno; Herbert

A multicolor sensor with a plurality of diode functions comprising a succession of layers with p and n doped layers. A microcrystalline layer is thus constructed from at least one of the internal contacts for contacting. According to the invention, pin, nip, npin and/or pnip structures are provided to form the diode functions.

DETAILED DESCRIPTION What is claimed is: 1.
A four-contact multicolor sensor comprising: a transparent front contact turned toward an incident light source; a first diode function of microcrystalline or amorphous silicon following said transparent front contact and structured to absorb short wavelengths of said incident light; a second diode function of microcrystalline or amorphous silicon following said first diode function and structured to absorb intermediate wavelengths of said incident light; a third diode function of microcrystalline or amorphous silicon following said second diode function and structured to absorb long wavelengths of said incident light, said first, second and third diode functions being integrated into a stack with further contacts between said first diode function and said second diode function and between said second diode function and said third diode function, each of said diode functions including a p-i-n or n-i-p sequence; and a back contact following said third diode function whereby three color signals can be read out in parallel across said contacts.
2.
The four-contact multicolor sensors defined in claim 1 whereby the diode functions are separated from one another by n/p or p/n heterotransitions at which only one charge carrier type is collected or injected by a respective one of said contacts.
3.
The sensor defined in claim 1 wherein a TCO layer forms each of said further contacts.
4.
The sensor defined in claim 1 wherein a pin/nip, pin and/or pip structure forms the diode functions.
5.
The sensor defined in claim 1, further comprising a further nonmicrocrystalline or amorphous layer.
6.
The sensor defined in claim 5 wherein the additional layer is a ZnO layer.
7.
The sensor defined in claim 1 wherein at least one of said further contacts is formed by a microcrystalline layer.
8.
The sensor defined in claim 1 wherein said first diode function is responsive to blue, said second diode function is responsive to green and said third diode function is responsive to red and said sensor is a RGD sensor for a pixel in a two-dimensional array of stacks of said first, second and third diode functions



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