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Optical-component-package

Optical mirror system with multi-axis rotational control

An optical mirror system with multi-axis rotational control is disclosed. The mirror system ...

Structure for an optical switch on a substrate

FIG. 1 shows an embodiment of optical cross-connect system 100 in accordance with the invention. T...

Micro-electro-mechanical-system (MEMS) mirror device and methods for fabricating the same

A micro-electro-mechanical-system (MEMS) mirror device is disclosed. The MEMS mirror device ...

Semiconductor device

Objects of the Invention It is an object of the present invention to provide a semiconductor device ...

Method of manufacturing spatial light modulator and electronic device employing it

It is the object of the present invention to provide a spatial light modulator equipped with ...

Inductor with cobalt/nickel core for integrated circuit structure with high inductance and high Q-factor

In accordance with the invention, an integrated circuit structure is provided with an inductor ...

Distributed constant element using a magnetic thin film

As described above, the development and practicability of a magnetic thin-film device are delayed. I...

Charge coupled device package

OF THE PREFERRED EMBODIMENT FIG. 4 shows a printed circuit interconnection frame of the present ...

Magnetic element, magnetic read head, magnetic storage device, magnetic memory device

It is therefore an object of the present invention to provide a new and improved magnetic element ...

Method for modifying switching field characteristics of magnetic tunnel junctions

Reference is now made to FIG. 1, which illustrates an MRAM device 10 including a resistive cross ...

Optical component package

Details

Inventors: Butrie, Timothy; Dautartas, Mindaugas Fernand; Scrak, Shaun P.;
Assignee: Lucent Technologies Inc. (Murray Hill, NJ)
Primary Examiner: Ostrowski; David
Assistant Examiner:
Attorney, Agent or Firm:

Disclosed is an optical package which is economical to manufacture. An optical component, such as a PIN photodiode, is bonded to a substrate such as silicon with no metallization on its side surfaces. The resulting assembly is solder bonded to the bottom surface of the package so that a side surface of the substrate is adjacent to the bottom surface with essentially no solder therebetween.

DETAILED DESCRIPTION The invention is an optical package including an optical component assembly comprising a substrate and an optical component bonded to a major surface of the substrate.
The substrate includes at least one side adjacent to the major surface which is free of metalization contacting the component.
The side is solder bonded to a bottom surface of the package with essentially no solder between the side and the bottom surface.

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