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Passivated organic device having alternating layers of polymer and dielectric
| Details |
Inventors: Harvey, III, Thomas B.; Shi, Song Q.; So, Franky;
Assignee: Motorola, Inc. (Schaumburg, IL)
Primary Examiner: O'Shea; Sandra L.
Assistant Examiner: Patel; Vip
Attorney, Agent or Firm: Parsons; Eugene A.
A method of passivating organic devices positioned on a supporting transparent plastic substrate including the steps of overcoating the plastic substrate with a multi-layer overcoating, composed of alternating layers of a transparent polymer film and a transparent dielectric material, forming an organic device on the overcoated transparent plastic substrate and sealing the organic device formed on the overcoated plastic substrate. The polymer film layer used in overcoating the plastic substrate acts as a means of improving the barrier properties of the multi-layer overcoating and the dielectric material acts as a physical barrier to atmospheric elements which can corrode the organic device and are a detriment to the reliability of organic LEDs. |
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DETAILED DESCRIPTION The above problems and others are at least partially solved and the above purposes and others are realized in a method of forming organic devices positioned on a supporting transparent plastic substrate including the step of depositing a multi-layer overcoating on the plastic substrate.
The multi-layer overcoating is composed of thin alternating layers of a robust transparent polymer film and a transparent inorganic material such as silicon monoxide, silicon oxide, silicon dioxide or silicon nitride, which are deposited on at least one planar surface of the plastic substrate.
The multi-layer overcoating is deposited on at least one planar surface of the plastic substrate and the organic LED is formed thereon.
Alternatively, the multi-layer overcoating is deposited on all planar surfaces of the plastic substrate thereby encapsulating the plastic substrate in the alternating layers of the transparent inorganic material and the polymer film prior to forming the organic LED thereon.
This multi-layer overcoating serves to reduce and eliminate the diffusion of oxygen and moisture through the plastic substrate, thereby damaging the organic LED formed thereon.
In a preferred embodiment the polymer film layer and the inorganic dielectric material layer each rely on a different mechanism for protection against permeation of oxygen and moisture through the plastic substrate.
The polymer film layer is used as a means of improving the barrier properties of the multi-layer overcoating and aids in slowing the diffusion of moisture and oxygen through the plastic substrate.
It is preferably formed from a transparent polymer chosen from a group of fluorinated polymers, parylenes, and cyclotenes.
The transparent dielectric layer is used as a physical barrier to stop the diffusion of moisture and oxygen through the plastic substrate.
It is preferably formed from a transparent dielectric layer of silicon monoxide, silicon oxide, silicon dioxide or silicon nitride.
In combination, the polymer film layer and the transparent dielectric layer serve to provide a barrier to oxygen and moisture, thereby protecting against damage to the organic LEDs
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MEMS 
