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Chemical treatment of low-k dielectric films
OF THE INVENTION The present invention will be described in connection with the formation of multiple level metal conductors in an integrated circuit, and specifically ...
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Optical semiconductor device and method of fabricating the same
It is, therefore, a principal object of the present invention to provide an optical semiconductor device having a buried heterostructure with a flat surface and a method ...
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Ultrasonic image sensing array with acoustical backing
In order to achieve most if not all of the foregoing objects, there is provided in accordance with a first aspect of the present invention, an ultrasonic sensing array ...
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Process for vapor phase epitaxy of compound semiconductor
Accordingly, an object of the present invention is mainly to resolve the above mentioned problems and to provide a process for vapor phase epitaxy of a compound ...
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Pendeoepitaxial gallium nitride semiconductor layers on silcon carbide substrates
It is therefore an object of the present invention to provide improved methods of fabricating gallium nitride semiconductor layers, and improved gallium nitride layers ...
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Control of juction depth and channel length using generated interstitial gradients to oppose dopant diffusion
I have provided a process for utilizing implant damage-induced interstitial gradients to inhibit dopant diffusion in crystalline silicon, thereby retaining shallow ...
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Solid-state image-sensing device and method for producing the same
Accordingly, it is an object of the present invention to provide a solid-state image-sensing device designed so that photoelectric conversion efficiency in sensor parts ...
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Bipolar structure with two base-emitter junctions in the same circuit
The invention relates to bipolar transistors using Si-Ge material. A feature of the invention is the presences of two types of bipolar SiGe transistor in the same ...
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Flip chip package with warpage control
To achieve the foregoing, the present invention provides a semiconductor flip chip package with warpage control and fabrication methods for such packages. The packages ...
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Solid-state imaging device
It is an object of the present invention to overcome the problems in the prior art and to provide photoelectric conversion devices and image sensor arrays comprised ...
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