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Precision spray processes for direct write electronic components
| Details |
Inventors: Miller, W. Doyle; Keicher, David M.; Essien, Marcelino;
Assignee: Optomec Design Company (Albuquerque, NM)
Primary Examiner: Meeks; Timothy
Assistant Examiner: Kolb; Jennifer
Attorney, Agent or Firm: Gray; Cary
This invention combines the precision spray process with in-flight laser treatment in order to produce direct write electronic components. In addition to these components, the process can lay down lines of conductive, inductive, and resistive materials. This development has the potential to change the approach to electronics packaging. This process is revolutionary in that components can be directly produced on small structures, thus removing the need for printed circuit boards. |
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DETAILED DESCRIPTION OF THE INVENTION In accordance with the present invention, there are provided methods for direct material deposition on a substrate, said methods comprising: (a) passing one or more feedstocks through a laser beam under conditions sufficient to convert substantially all of said feedstock(s) into a depositable form, and (b) depositing said depositable feedstock(s) on said substrate, wherein said laser beam is generated by at least one laser, each operating at a power in the range of about 1 mW up to about 1 kW.
In accordance with another embodiment of the present invention, there are provided methods for direct material deposition on a substrate, said methods comprising: (a) passing one or more finely divided feedstocks through one or more laser beams under conditions sufficient to convert substantially all of said feedstock(s) into a depositable form, and (b) depositing said depositable feedstock(s) on said substrate, wherein said finely divided feedstock comprises feedstock particles of less than about 40 .
mu.
m in diameter.
In accordance with still another embodiment of the present invention there are provided methods for direct material deposition on a substrate, said methods comprising: (a) passing one or more feedstocks through one or more laser beams under conditions sufficient to convert substantially all of said feedstock into a depositable form, and (b) depositing said depositable feedstock on said substrate, wherein said method is capable of achieving a fine line resolution of less than about 250 .
mu.
m.
Typically, resolutions achieved in the practice of the present invention fall in the range of about 0.
1 .
mu.
m up to about 250 .
mu.
m.
In a presently preferred embodiment, resolution of less than about 25 .
mu.
m is obtained.
In accordance with yet another embodiment of the present invention, there are provided methods for direct material deposition on a substrate, said methods comprising: (a) passing one or more feedstocks from a feedstock source through one or more laser beams under conditions sufficient to both convert substantially all of said feedstock(s) into a depositable form, and to guide said feedstock(s) into one or more hollow fibers disposed between said feedstock source and said substrate, and (b) depositing said depositable feedstock(s) on said substrate
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MEMS 
