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Probe look ahead: testing parts not currently under a probehead
| Details |
Inventors: Lunde, Aron T.;
Assignee: Micron Technology, Inc. (Boise, ID)
Primary Examiner: Clark; S. V.
Assistant Examiner:
Attorney, Agent or Firm: Whyte Hirschboeck Dudek SC
A semiconductor substrate, probe card, and methods for stressing and testing dies on a semiconductor substrate are provided. The semiconductor substrate, typically a semiconductor wafer, comprises dies disposed thereon and a redistribution layer (RDL) for routing signals from a test circuit into dies on the substrate that are not currently under probe. The RDL includes look-ahead contacts associated with a first die set that are electrically connected by traces to dies of a second die set. Upon contact of elements of the probe tester with the look-ahead contacts, required Vcc power, GND ground potential and signals from the probe tester are routed through the traces to the die of the die set not currently under probe. The dies can comprise a built-in self-stress (BISS) circuit and/or a built-in self-test (BIST) circuit for implementing a stress or test sequence. The look-ahead contacts allow for overlapping or substantially simultaneously stressing and/or testing dies of dies of a die set currently under probe and dies of a second die set located prior to or after the current probe head position (i.e., not under probe). |
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DETAILED DESCRIPTION The present invention provides a semiconductor substrate, a probe card, and a method for stressing and/or testing dies on a semiconductor substrate.
In one aspect, the invention provides a semiconductor substrate structured for testing and/or stressing a semiconductor die.
In one embodiment according to the invention, the semiconductor substrate, typically a semiconductor wafer, comprises dies disposed thereon and a metal layer (redistribution layer (RDL)) for re-routing the requisite power, ground, and signals from a test system into dies on the wafer substrate that are not in contact with probe elements of the test system.
The RDL layer enables a path into a die from a location other than the original die pad currently being probed.
The semiconductor substrate can comprise a plurality of die sets, and each die can comprise one or more pads for contact with an element (e.
g.
, probe pin) of a probe card.
Two or more look-ahead pads or contacts (probe contacts) are associated with each die set in addition to the pads on the dies themselves.
The look-ahead contacts can be positioned on the semiconductor substrate or on a die itself, such that when the pads of the dies of a die set are probed, the look-ahead contacts associated with that die set are also probed.
Each look-ahead contact is electrically connected through a trace to a contact (pad) that is electrically connected to at least one die of a die set not currently being probed.
A look-ahead contact can be electrically connected to one or more dies of a die set.
When the look-ahead contact is probed, the requisite power, ground, and signals from a test system are routed through the traces to the die(s) of the die set not currently being probed.
For example, the look-ahead contacts can include a power supply voltage (Vcc) contact and a ground potential (GND) contact and any number of signal contacts for receiving signals from an external source.
The number of signal contacts can vary from one to as many as can be accommodated in a particular application
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