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Details
Inventors: Sandhu, Gurtej; Lee, Roger; Keller, Dennis; Doan, Trung T.; Hineman, Max F.; Earl, Ren;
Assignee: Micron Technology, Inc. (Boise, ID)
Primary Examiner: Elms; Richard
Assistant Examiner: Smith; Brad
Attorney, Agent or Firm: Dickstein Shapiro Morin & Oshinsky LLP

A method of fabricating a MRAM structure and the resulting structure. The MRAM structure of the invention has the pinned layer recessed within a trench with the upper magnetic layer positioned over it. The method of MRAM fabrication utilizes a spacer processing technique, whereby the upper magnetic layer of the MRAM stack structure is formed between the region defined by the spacers, thereby allowing for self-alignment of the upper magnetic layer over the underlying pinned magnetic layer.

DETAILED DESCRIPTION This invention pertains to a method of fabricating an MRAM structure and the resulting structure.
The MRAM structure of the invention has the pinned layer recessed within a trench with an upper unpinned magnetic layer positioned over it.
The method of fabrication utilizes a spacer placed within an etched insulator opening to reduce the opening size.
The upper magnetic layer of the MRAM stack structure is formed within the smaller size region defined by spacers, thereby allowing for accurate placement and self-alignment of the upper magnetic layer over the underlying pinned magnetic layer.
This process is repeatable to form multiple MRAM device layers for heightened levels of vertical integration.
These and other feature and advantages of the invention will be more clearly understood from the following detailed description, which is provided with reference to the accompanying drawings.



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