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 Semiconductor element having a p-zone on the anode side and an adjacent, weakly doped n-base zone

Details
Inventors: Schlangenotto, Heinrich; Sommer, Karl H.;
Assignee: eupec Europaische Gesellschaft fur Leistungshalbleiter mbH & Co. KG (Warstein-Belecke, DE)
Primary Examiner: Hille; Rolf
Assistant Examiner: Saadat; Mahshid
Attorney, Agent or Firm: Spencer & Frank

A semiconductor element having a p-zone on the anode side and an adjacent weakly doped n-zone which forms a blocking pn-junction with the p-zone, particularly a fast rectifier diode and a fast thyristor. To realize improved recovery behavior during commutation and good forward conduction and blocking characteristics in such components, the semiconductor element is configured in such a manner that the p-zone on the anode side includes an electron sink formed by a pn-junction formed of this zone and the adjacent n-zone; moreover, the thickness and the doping concentration of the region of the anode-side p-zone between the electron sink (S) and the pn-junction are selected in such a manner that the region of high injected charge carrier concentration under forward load extends close to the electron sink while, under a forward blocking load, the space charge zone in the p-zone does not extend to the electron sink.

DETAILED DESCRIPTION It is the object of the invention to provide a semiconductor element having a p-zone on the anode side and an adjacent weakly doped n-zone which combines improved recovery behavior upon commutation with good forward conduction characteristics and a low reverse current and can be easily manufactured industrially for a broad range of currents and voltages.
In accordance with the present invention, the above objects are achieved by providing a semiconductor component having a weakly doped continuous interior p-zone which is provided on its surface with an ohmic contact layer and which is adjacent to a weakly doped n-base zone adjacent to which is arranged a highly doped n.
sup.
+ -zone, and wherein highly doped p+-surface zones are arranged entirely within partial regions of the weakly doped p-zone.
Further features of the invention are set forth in the claims.
The advantages realized by the invention are that, in the semiconductor element, the reverse current peak is greatly reduced and the drop in reverse current after the maximum is a flat curve.
The reverse current is reduced so that the semiconductor element ca be used for higher operating temperatures.
Moreover, the semiconductor element can be manufactured in large quantities and with large surfaces without costly irradiation procedures and without the masking accuracy required for field effect components.
The invention will be described in greater detail below with reference to embodiments which are illustrated schematically in the drawing figures.



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