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Integrated circuit devices with solderable lead frame
The present invention embodies a packaged device with a lead frame, a lead frame and an article of manufacture comprising a base metal, a layer of nickel on the base ...
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Production method for integrated angular speed sensor device
In one aspect, the present invention provides a motion-sensing device that is a vibrating-type, integrated angular speed sensor and a production method that results in a ...
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Photovoltaic cells for converting light energy to electric energy and photoelectric battery
It is a principal object of the present invention to reduce the shadowing area of the semiconductor wafer surface caused by the current collecting contacts and, thus, to ...
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Electronic scale reduction technique
OF THE PREFERRED EMBODIMENTS Referring now to FIG. 1, this shows a sandwich-like assembly 10 of support sheet 11, flat spiral wire coil 12 and cover sheet 13. In this ...
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Lightweight solar module and method of fabrication
The present invention is directed to an improved solar cell module, comprising a substrate and a first solar cell supported by the substrate, with the first solar cell ...
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Solid state image sensing device
Accordingly, the object of the present invention is to provide a solid state image sensing device which can prevent the punch through from being generated during the ...
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Device for one-sided etching of a semiconductor wafer
We claim: 1. An etching box type device for one-sided etching of a semiconductor wafer, said device comprising a trough-shaped basic body; a lid hermetically sealing ...
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