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Solid-state-image-sensor-with-groove-situated-transfer-elements

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Solid-state image sensor with groove-situated transfer elements

Details

Inventors: Kimata, Masafumi;
Assignee: Mitsubishi Denki Kabushiki Kaisha (Tokyo, JP)
Primary Examiner: Nelms; David C.
Assistant Examiner: Shami; Khaled
Attorney, Agent or Firm: Lowe, Price, LeBlanc, Becker & Shur

Grooves 8a are formed on a main surface of a semiconductor substrate 8 and a vertical charge transfer element is formed on a side wall of each groove 8a. As a result, the areas occupied by the vertical charge transfer elements on the main surface of the semiconductor substrate 8 are substantially zero, whereby the areas occupied by Schottky barrier photo sensors 1 can be increased.

DETAILED DESCRIPTION The present invention has been accomplished to overcome the above-described disadvantages and it is an object of the present invention to provide a solid-state image sensor in which the areas occupied by the portions other than the photo sensors on the surface of a semiconductor substrate are considerably decreased in the design of picture elements, which makes it possible to improve a fill factor (a proportion of the areas of the photo sensors to the areas of the picture elements).
Briefly stated, in the present invention, grooves are formed on a semiconductor substrate and vertical charge transfer elements are formed in side walls of the grooves.
According to the present invention, the areas occupied by the vertical charge transfer elements on the plane surface of the semiconductor substrate become substantially zero.
Consequently, a spacing between the respective sensitive portions of the picture elements can be decreased to a width of each of the above-mentioned grooves and thus a solid-state image sensor having a large opening proportion can be obtained.
These objects and other objects, features, aspects and advantages of the present invention will become more apparent from the following detailed description of the present invention when taken in conjunction with the accompanying drawings.

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