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Solid state imaging device, method of making the same and imaging unit including the same
| Details |
Inventors: Miyazaki, Keishi; Kudo, Yasuhito; Sasaki, Kimihide;
Assignee: Sharp Kabushiki Kaisha (Tokyo, JP)
Primary Examiner: Loke; Steven
Assistant Examiner:
Attorney, Agent or Firm: Conlin; David G., Tucker; David A., Edwards & Angell, LLP
A solid state imaging device includes a package substrate and a solid state imaging element on the package substrate. The package substrate has a mounting plane on which the solid state imaging element is mounted. The package substrate has two reference planes having the same height as the mounting plane, the reference planes projecting in two opposite directions from the mounting plane. The reference planes respectively have at least one pair of positioning reference holes formed therein, such that the centers of the respective pairs of holes are away from the center of an imaging plane of the solid state imaging element by the same distance. The imaging device is produced by fixing the imaging element on the mounting plane of the package substrate such that the center of the imaging element is aligned with the center of a phantom line diagonally connecting the center of one of the positioning reference holes in one of the reference planes with the center of one of the reference holes in the other of the reference planes. A solid state imaging unit utilizing the imaging device includes a lens mirror cylinder unit having pin members engaging diagonally opposed ones of each of the at least one pair of positioning reference holes, a reference plane corresponding to the reference planes of the package substrate and an optical lens having an optical axis that passes through the center of a phantom line connecting the centers of the pin members and the center of the imaging element. |
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DETAILED DESCRIPTION According to one aspect of the invention, a solid state imaging device includes a package substrate; and a solid state imaging element mounted on the package substrate.
The package substrate has a mounting plane on which the solid state imaging element is mounted.
The package substrate has two reference planes having the same height as the mounting plane, the reference planes projecting in two opposite directions from the mounting plane.
The reference planes respectively have at least one pair of positioning reference holes therein, such that the centers of the pair of holes are away from the center of an imaging plane of the solid state imaging element by the same distance.
In one embodiment of the invention, the at least one pair of positioning reference holes formed in the reference plane are tapered so as to expand toward the side of the imaging plane of the solid state imaging element.
In one embodiment of the invention, the package substrate has a recessed portion having the mounting plane in a bottom portion thereof.
The solid state imaging element is mounted on the mounting plane.
Internal leads accommodated in the recessed portion are connected to electrodes of the solid state imaging element via thin metal lines, and are also connected to external leads.
A transparent cap member is mounted so as to cover the recessed portion.
According to another aspect of the invention, in a method for producing the above-described solid state imaging device is provided.
For mounting the solid state imaging element on the mounting plane of the package substrate, the center of the imaging plane is matched to the center of a phantom line connecting the centers of the at least one pair of reference holes, and thus solid state imaging element is fixed on the mounting plane.
According to still another aspect of the invention, a solid state imaging unit includes the above-described solid state imaging device, and a lens mirror cylinder unit.
The lens mirror cylinder unit includes pin members respectively engageable with the at least one pair of positioning reference holes, a positioning reference plane corresponding to the reference planes of the solid state imaging device, and an optical lens provided such that an optical axis thereof passes through the center of a phantom line connecting the centers of the pin members
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MEMS 
