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Image sensor
The present invention, therefore, has been made in consideration of the above situation, and has as its object to provide the structure of an image sensor capable of ...
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Sog with moisture resistant protective capping layer
I claim: 1. A method of planarizing a semiconductor wafer having interconnect tracks metal of formed thereon, comprising applying a layer of inorganic spin-on glass to ...
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Method for using disposable hard mask for gate critical dimension control
A principal object of the present invention is to provide an effective and very manufacturable method of providing a necking-free and uniform critical dimension width ...
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Multi-element micro gyro
OF SPECIFIC EMBODIMENTS FIGS. 1 and 2 are isometric views showing a micro-gyro device. FIG. 1 shows first and second elements in the micro-gyro, which are movable ...
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Blazed grating light valve
The present invention is a light modulator. The light modulator includes elongated elements arranged parallel to each other and suspended above a substrate. The light ...
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Method and apparatus for detecting wafer flaw
An object of the present invention is to provide a detecting apparatus that can sift the abnormal wafer out immediately and quickly before wafer polishing beforehand so ...
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Method of forming an isolation oxide for silicon-on-insulator technology
OF THE DRAWINGS A method of forming an isolation oxide on a silicon-on-insulator (SOI) substrate includes disposing a mask layer over a region of a silicon layer of the ...
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Combined trench isolation and inlaid process for integrated circuit formation
OF THE PRESENT INVENTION Generally, the present invention is an improved method for manufacturing an integrated circuit (IC) having both trench isolation and MOS ...
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Method of forming trench isolation
In view of the problems with the prior art described above, the present invention aims at providing means for accomplishing planarization of regions, where a plurality ...
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Apparatus and method for forming controlled deep trench top isolation layers
OF PREFERRED EMBODIMENTS This disclosure relates to semiconductor devices and more particularly, to an apparatus and method for forming deep trench isolation layers for ...
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