Stereolithographically fabricated conductive elements, semiconductor device components and assemblies including such conductive elements, and methods

DETAILED DESCRIPTION The present invention includes stereolithographically fabricated conductive elements.
Accordingly, the conductive elements of the present invention may have one or more layers of conductive material.
In multi-layer embodiments, the conductive elements have a plurality of superimposed, contiguous, mutually adhered layers of conductive material.
Any known conductive material may be used to form the conductive elements of the present invention.
Exemplary conductive materials include, without limitation electrically conductive thermoplastic elastomers and metals.
The invention also includes semiconductor device assemblies with one or more semiconductor devices that are electrically connected to one or more other semiconductor device components, such as carrier substrates, leads, or other semiconductor devices, by way of the conductive elements of the present invention.
These conductive elements are substantially carried upon the semiconductor device and the component to which the semiconductor device is connected.
For example, when used to connect one semiconductor die to another semiconductor die, a conductive element of the present invention contacts a bond pad of the first semiconductor die, extends across a portion of the active surface of the first semiconductor die towards the second semiconductor die, over the active surface of the second semiconductor die, and contacts a corresponding bond pad of the second semiconductor die.
As another example, when the conductive elements of the present invention are used to connect a semiconductor die to a carrier substrate, one end of a conductive element may contact a contact (e.
g.
, a bond pad) of the semiconductor die, extend over an active surface of the semiconductor die, down a peripheral edge thereof, over a surface of the carrier substrate, and contact a contact pad of the carrier substrate at a second end of the conductive element.
In another aspect, the present invention includes a printed circuit board with a substrate that carries one or more stereolithographically fabricated conductive traces