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Stereolithographically fabricated conductive elements, semiconductor device components and assemblies including such conductive elements, and methods
| Details |
Inventors: Williams, Vernon M.;
Assignee: Micron Technology, Inc. (Boise, ID)
Primary Examiner: Nelms; David
Assistant Examiner: Dang; Phuc T.
Attorney, Agent or Firm: TraskBritt
Stereolithographically fabricated conductive elements and semiconductor device components and assemblies including these conductive elements. The conductive elements may include multiple superimposed, contiguous, mutually adhered layers of a conductive material, such as a thermoplastic conductive elastomer or a metal. In semiconductor device assemblies, the stereolithographically fabricated conductive elements may electrically connect semiconductor device components to one another. The conductive elements may alternatively comprise conductive traces or vias of circuit boards or interposers. A stereolithographic method for fabricating the conductive elements may include use of a machine vision system with at least one camera operably associated with a computer controlling a stereolithographic application of material so that the system may recognize the position, orientation, and features of a semiconductor device assembly, semiconductor die, or other substrate on which the conductive element is to be fabricated. |
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DETAILED DESCRIPTION The present invention includes stereolithographically fabricated intermediate conductive elements.
Accordingly, the intermediate conductive elements of the present invention may have one or more layers of conductive material.
In multilayer embodiments, the intermediate conductive elements have a plurality of superimposed, contiguous, mutually adhered layers of conductive material.
Any known conductive material may be used to form the intermediate conductive elements of the present invention.
Exemplary conductive materials include, without limitation, electrically conductive thermoplastic elastomers and metals.
The invention also includes semiconductor device assemblies with one or more semiconductor devices that are electrically connected to one or more other semiconductor device components, such as carrier substrates, leads, or other semiconductor devices, by way of the intermediate conductive elements of the present invention.
These intermediate conductive elements are substantially carried upon the semiconductor device and the component to which the semiconductor device is connected.
For example, when used to connect one semiconductor die to another semiconductor die, an intermediate conductive element of the present invention contacts a bond pad of the first semiconductor die, extends across a portion of the active surface of the first semiconductor die towards the second semiconductor die, extends over the active surface of the second semiconductor die, and contacts a corresponding bond pad of the second semiconductor die.
As another example, when the intermediate conductive elements of the present invention are used to connect a semiconductor die to a carrier substrate, one end of an intermediate conductive element may contact a contact (e.
g.
, a bond pad) of the semiconductor die, extend over an active surface of the semiconductor die, down a peripheral edge thereof, and over a surface of the carrier substrate, and contact a contact pad of the carrier substrate at a second end of the intermediate conductive element
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MEMS 
