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Supercritical phase wafer drying/cleaning system
| Details |
Inventors: Farmer, Robert B.; Jones, Bernard D.; Gupta, Kedar P.; Jafri, Ijaz H.; Dispensa, Derek M.;
Assignee: G.T. Equipment Technologies, Inc. ()
Primary Examiner: Wilson; Pamela A.
Assistant Examiner:
Attorney, Agent or Firm: Maine; Vernon C., Asmus; Scott J.
An apparatus and method for drying a microelectronic structure on wafer substrate using supercritical phase gas techniques and a unique pressure vessel locking mechanism. There is lid and a base with an open cavity to contain at least one microelectronic structure on wafer substrate. Clamping the lid to the base uses locking clamp rings with open jaws large to partially enclose the edge of the vessel. The clamp rings are supported symmetrically about the sides of the vessel. The rings are adjusted between an open position where the rings are clear of the vessel and a locking position where the jaws partially enclose the vessel. The jaws and the vessel share a tapered cam plate and roller system configured to bring the rings into vertically compressive locking engagement on the pressure vessel when the rings are moved into locking position. Mechanical interlocks provide security against back pressure opening the rings. The invention includes the necessary mechanisms and systems for manual or automatic closing and clamping the vessel, controlling pressure in the cavity, controlling temperature in the cavity, flowing process fluid through the cavity, venting the cavity, unclamping the pressure vessel, and removing the lid. |
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DETAILED DESCRIPTION The invention, in it's simplest form, is an apparatus and method for the drying of microelectronic structures on wafer substrates using supercritical phase drying techniques.
It is an object of the invention to provide an apparatus for drying a microelectronic structure on wafer substrate, consisting of a pressure vessel with a lid and a base with an open cavity, where the cavity is of uniform diameter and constant depth sufficient to contain at least one microelectronic structure on wafer substrate, and the vessel when closed has the lid emplaced on the base.
The apparatus would include a way for placing the lid on the base, and a way for clamping the lid to the base using at least two locking clamp rings linked by a drive mechanism.
Each ring would have an open jaw sufficiently large to partially enclose an edge of the vessel when closed.
The rings would be supported symmetrically about the circumference of the vessel and oriented with the jaws facing the vessel.
The rings would be collectively movable by a force on the drive mechanism between an open position where the rings are clear of the vessel and a locking position where the jaws partially enclose the vessel.
The jaws and the vessel would have a tapered cam plate and roller system configured to bring the rings into vertically compressive locking engagement on the pressure vessel when the rings are moved into the locking position.
The apparatus would also have a way for controlling pressure in the cavity, a way for controlling temperature in the cavity, a way for flowing process fluid through the cavity, a way for venting the cavity, a way to unclamp the pressure vessel, and a way to remove the lid from the base.
It is a further object to provide for clamping the lid to the base with two locking clamp rings, their jaws configured with internal upper and lower rollers, and the vessel configured with top and bottom tapered cam plates.
The rollers would be configured to contact respective cam plates and bring the rings into vertically compressive locking engagement on the pressure vessel when the rings are moved into locking position
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MEMS 
