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Tunable nanomasks for pattern transfer and nanocluster array formation
It should be noted that all references cited in this Detailed Description are incorporated herein by reference, in their entirety. In accordance with the present ...
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Flip-chip light emitting diode and fabricating method thereof
One aspect of the present invention is to provide a flip-chip LED with the superiority of the flip-chip structure, and to efficiently increase the light output intensity ...
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Method for photographically improving the resolution of screen printed photopolymer images
I claim: 1. The process of improving resolution of printed photopolymer patterns of low resolution because of smears at the pattern edges, comprising the steps of: ...
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High resolution printed circuits formed in photopolymer pattern indentations overlaying printed wiring board substrates
I claim: 1. The process of producing high resolution closely spaced printed circuits on a substrate which may have surface irregularities, comprising the steps of: ...
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Method of manufacturing a three-dimensional plastic article
Briefly, according to the invention, there is provided a method for producing a three dimensional plastic article having an insert. The three dimensional plastic article ...
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Method of forming a three-dimensional printed circuit assembly
Briefly, according to the invention, there is provided a method of making a three-dimensional printed circuit assembly. A substrate is first formed from a photoactive ...
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Multilayer circuit board having microporous layers and method for making same
Referring to FIG. 1, the first step in constructing a representative single-sided printed wiring board (PWB) using mass seeding is to hot-roller laminate a layer 10 of ...
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Method for mounting integrated circuit chips on a mini-board
The present invention allows an integrated circuit chip die or dice to be easily mounted onto a printed circuit board substrate. The present invention accomplishes this ...
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Method and apparatus for testing unpackaged semiconductor dice
In accordance with the present invention, an improved method and apparatus for testing unpackaged semiconductor dice are provided. The method includes forming an ...
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Method of combining metal and ceramic inserts into stereolithography components
In accordance with the teachings of the present invention, a stereolithography process for developing a part is disclosed in which inserts of a non-photopolymer material ...
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