Home | Links | Contact Us | More About Intellectual Property | Bookmark
Search patents:
Home MEMS Vapor-phase-deposition

 Method and apparatus for preparing a plurality of dice in wafers
Methods and apparatuses for modulating an optical beam in an optical device are disclosed. In the ...


 Microchannel system for fluid delivery
The realization of a buried flow channel in silicon in accordance with the present invention, ...


 Solid state ink jet print head and method of manufacture
Ink jet printing mechanisms use pens that shoot droplets of colorant onto a printable surface to ...


 Wafer level contact sheet and method of assembly
The present invention relates to a system and method for performing reliability screening on semi-...


 Packaging micromechanical devices
Referring to FIG. 1, a 3.times.3 micromechanical mirror array is shown by way of example of a MEMS ...


 Gate stack for high performance sub-micron CMOS devices
A principle objective of the invention is to provide a gate electrode structure having sub-micron ...


 Sensitivity control for nanotube sensors
In accordance with one aspect of the present invention an electronic system for detecting analytes ...


 Method of etching crystalline material with etchant injection inlet
The present invention has been accomplished in view of the various points as described above, and ...


 Selective formation of porous silicon
OF THE INVENTION The invention is based on forming a latent pattern in the surface of a silicon ...


 Method of producing buried porous silicon-geramanium layers in monocrystalline silicon lattices
The ability to synthesize Si based materials with new optical, photonic and electronic properties ...


 Vapor phase deposition

Details
Inventors: Wang, Yuchun;
Assignee: The Regents of the University of California (Oakland, CA)
Primary Examiner: Meeks; Timothy
Assistant Examiner:
Attorney, Agent or Firm: Fish & Richardson P.C.

A method and apparatus for performing vapor phase deposition to form a monolayer coating on the surface of an article. A liquid coating reagent is provided in a flow passageway extending into the process chamber. A carrier gas is flowed through the flow passageway to form a gas mixture including a vaporized coating reagent. The gas mixture is directed into the process chamber to contact the article. The vaporized coating reagent is deposited onto the article to form a coating thereon.

DETAILED DESCRIPTION What is claimed is: 1.
A method of forming a coating on a surface of an article, comprising: placing a porous article between an upper housing portion and a lower housing portion of a process chamber, the article spanning a cross-section of the process chamber; joining the upper housing portion and the lower housing portion; introducing a liquid coating reagent into a flow passageway extending into the process chamber; flowing a carrier gas through the flow passageway to produce a gas mixture including a vaporized coating reagent and the carrier gas; directing the gas mixture into the process chamber to contact the surface of the article and form the coating thereon; and exhausting the gas mixture from the process chamber.
2.
The method of claim 1, further including: flowing the carrier gas through the flow passageway before introducing the liquid coating reagent into the flow passageway and measuring the flow rate of the carrier gas to provide a first flow rate; as the gas mixture is exhausted from the process chamber, measuring its flow rate to provide a second flow rate; and comparing the first flow rate to the second flow rate to determine if the coating procedure has been performed properly.
3.
A method of forming a coating on a surface of an article, comprising: placing a porous article between an upper housing portion and a lower housing portion of a process chamber, the article extending across a cross-section of the process chamber; flowing a carrier gas through a flow passageway extending into the process chamber and measuring the flow rate of the carrier gas exiting the process chamber to provide a first flow rate; introducing a liquid coating reagent into the flow passageway extending into the process chamber; flowing the carrier gas through the flow passageway to produce a gas mixture including a vaporized coating reagent and the carrier gas; directing the gas mixture into the process chamber to contact the surface of the article and form the coating thereon; exhausting the gas mixture from the process chamber and measuring its flow rate to provide a second flow rate; and comparing the first flow rate to the second flow rate to determine if the coating procedure has been performed properly


Related patents
  Method of producing photovoltaic element
In view of the above-described problems, an object of the present invention is to provide a method of producing a photovoltaic element, more particularly a thin-film ...
  Method of manufacturing a printed circuit assembly
OF THE PREFERRED EMBODIMENTS The invention incorporates two primary aspects. The first deals with controlling the separation between opposing printed circuit layers in ...
  Monolithic pin diode and method for its manufacture
The present invention resides in a diode that is fabricated in a monolithic semiconductor device and that exhibits desirable PIN diode characteristics. A key feature of ...
  Face-down bonding pin diode
The present invention aims to provide a diode device, having both electrodes provided on the same surface thereof, which can be face-down bonded to a circuit board. In ...
  Memory card
According to studies made by the present inventors it has turned out that the following problems are involved in the memory cards of such a conventional structure as ...
  High-frequency hybrid semiconductor integrated circuit structure including multiple coupling substrate and thermal dissipator
It is therefore an object of the present invention to provide a high-frequency semiconductor hybrid integrated circuit having an excellent high-frequency characteristics,...
  Hybrid IC
A hybrid IC of the invention includes: a substrate; at least one inductor formed on the substrate; a semiconductor chip mounted on the substrate by flip-chip bonding; at ...
  Resin-sealed electronic apparatus for use in internal combustion engines
It is therefore a primary objective of the present invention to provide a new and improved electronic apparatus capable of achieving enhanced durability (long life-time) ...
  Two-dimensional image pickup apparatus
In view of the above described circumstances, it is therefore an object of the present invention to provide a small, down-sized image pickup apparatus that is free from ...
  Color filter with resist material in scribe lines
A method for processing a semiconductor substrate comprises the steps of: providing a substrate having a plurality of scribe lines having a step height and arranged to ...

0.004

Archive: All patents - Links

Copyright (c)2006 Eipa-patents.org - All rights reserved