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Wafer bonding hermetic encapsulation
| Details |
Inventors: Enquist, Paul M.; Tong, Qin-Yi; Fountain, Jr., Gaius Gillman; Markunas, Robert;
Assignee: Ziptronix (Research Triangle Park, NC)
Primary Examiner: Elms; Richard
Assistant Examiner: Menz; Douglas
Attorney, Agent or Firm: Oblon, Spivak, McClelland, Maier & Neustadt, P.C.
A method for providing encapsulation of an electronic device which obtains an encapsulating member configured to enclose the electronic device, prepares a surface of the encapsulating member for non-adhesive direct bonding, prepares a surface of a device carrier including the electronic device for non-adhesive direct bonding, and bonds the prepared surface of the encapsulating member to the prepared surface of the device carrier to form an encapsulation of the electronic device. As such, an encapsulated electronic device results which includes the device carrier having a first bonding region encompassing the electronic device, includes the encapsulating member having at least one relief preventing contact between the electronic device and the encapsulating member and having a second bonding region bonded to the first bonding region of the device carrier, and includes a non-adhesive direct bond formed between the first and second bonding regions thereby to form an encapsulation of the electronic device. The encapsulated electronic device can be an electronic or optoelectronic device. |
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DETAILED DESCRIPTION One object of the present invention is to provide a method for encapsulation which does not rely on encapsulation of an electronic device in a resin.
Another object of the present invention is to provide a method for encapsulation which does not rely on adhesive bonding to provide sealing of an internal relief containing the electronic device.
Another object of the present invention is to provide a method for encapsulation which does not require the fabrication of microheaters to produce localized heating.
Still another object of the invention is to provide a reliable low-temperature method for encapsulation of an electronic device.
A further object of the present invention is to provide a low cost and reliable method for encapsulation of an electronic device.
Still another object of the present invention is to provide simultaneous encapsulation of all devices on a device carrier containing the electronic devices.
Still another object of the present invention is to hermetically encapsulate MEMS devices.
Still another object of the present invention is to provide an encapsulation that results in minimum strain when exposed to temperature variations.
A further object of the present invention is to provide encapsulation that does not adversely affect the effectiveness of getters or other chemistry within the encapsulation.
Still another object of the present invention is to encapsulate MEMS early in the fabrication cycle.
Still another object of the invention is to improve the yield of MEMS devices by encapsulating MEMS devices at wafer scale early in the fabrication cycle.
Still another object of the invention is to provide an encapsulation that provides structural support for a MEMS device.
These and other objects of the present invention are achieved according to the present invention by a method which obtains an encapsulating member configured to enclose the electronic device, prepares a surface of the encapsulating member for non-adhesive direct bonding, prepares a surface of a device carrier including the electronic device for non-adhesive direct bonding and bonds, at or near room temperature, the prepared surface of the encapsulating member to the prepared surface of the device carrier to form an encapsulation of the electronic device
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