Thermal sprayed electrodes
The above-discussed and other drawbacks and deficiencies of the prior art are overcome or alleviated by the method of the present invention, wherein thermal spray of active material feedstocks is used... Read More
Inventors: Ye, Hui; Strock, Christopher; Xiao, Tongsan; Strutt, Peter R.; Reisner, David E.;, Assignee: U.S. Nanocorp. (North Haven, CT) |
Inorganic dopants, inks and related nanotechnology
This invention includes several methods of making non-stoichiometric submicron and nanostructured materials and devices from both stoichiometric and non-stoichiometric precursors. This invention also ... Read More
Inventors: Yadav, Tapesh; Alexander, John;, Assignee: NanoProducts Corporation (Longmont, CO) |
Method of manufacturing semiconductor device
OF THE INVENTION Embodiments of the present invention will be described hereinafter, by referring to the accompanying drawings. In each of the embodiments, a high dielectric constant material contain... Read More
Inventors: Inumiya, Seiji; Eguchi, Kazuhiro;, Assignee: Kabushiki Kaisha Toshiba (Tokyo, JP) |
MOS FET camera chip and methods of manufacture and operation thereof
An object of this invention is to provide an integrated circuit which functions as an image detector which employs two transistors in a photosensor pixel array with reduced parasitics. Another object ... Read More
Inventors: Liang, Jie; Wee, Siang-Tze;, Assignee: TriTech Microelectronics, Ltd. (Singapore, SG) |
MRAM device fabricated using chemical mechanical polishing
The present invention provides a method of forming an MRAM cell which minimizes the occurrence of electrical shorts during fabrication. In an exemplary embodiment of the present invention, a first con... Read More
Inventors: Yates, Donald L.; Mercaldi, Garry A.;, Assignee: Micron Technology, Inc. (Boise, ID) |
Rear entry photodiode with three contacts
OF PREFERRED EMBODIMENT Referring initially to FIG. 1, one form of a semiconductor photodiode of the present invention is generally designated as 10. Photodiode 10 includes a substrate 12 of a semi-i... Read More
Inventors: Webb, Paul P.; Appert, John R.; Enstrom, Ronald E.;, Assignee: General Electric Company (Schenectady, NY) |
High frequency analog transistors method of fabrication and circuit implementation
The present invention relates generally to the manufacture of integrated circuits and more specifically to complementary bipolar transistors having high Early voltage, high frequency performance, and ... Read More
Inventors: Davis, Christopher K.; Bajor, George; Beasom, James D.; Crandell, Thomas L.; Jung, Taewon; Rivoli, Anthony L.;, Assignee: Harris Corporation (Melbourne, FL) |
Semiconductor structure and method of manufacture
OF THE DRAWINGS FIGS. 1-20 are highly enlarged transparent oblique isometric views of a semiconductor structure 10 having shielding structures in which electrical devices are manufactured. In accorda... Read More
Inventors: Lim, Ik-Sung; Morgan, David G.; Joardar, Kuntal;, Assignee: Motorola, Inc. (Schaumburg, IL) |
Method of fabricating a complementary bipolar junction transistor
The present invention is therefore directed to a method of fabricating a complementary bipolar junction transistor, which substantially overcomes one or more of the problems due to the limitations and... Read More
Inventors: Nam, Dong-kyun; Bae, Sung-ryoul;, Assignee: Samsung Electronics Co., Ltd. (Gyeonggi-do, KR) |
Design and fabrication of broadband surface-micromachined micro-electro-mechanical switches for microwave and millimeter-wave applications
The present invention relates to a method of design and fabrication of a micro-electro-mechanical switch. Two different fundamental switch structures are discussed and three different fabrication sequ... Read More
Inventors: Loo, Robert Y.; Schmitz, Adele; Brown, Julia; Lynch, Jonathan; Choudhury, Debabani; Foschaar, James; Hyman, Daniel J.; Warneke, Brett; Lam, Juan; Hsu, Tsung-Yuan; Lee, Jae; Mehregany, Mehran;, Assignee: Hughes Electronics Corporation (El Segundo, CA); Rosemont Aerospace, Inc. (Burnsville, MN) |
Micro-electromechanical system device
OF THE DRAWINGS FIG. 3 illustrates an initial stage in the manufacture of a MEMS device 100. What is shown in FIG. 3 is a cross-sectional side view of a packaging substrate 110 having surfaces 111 an... Read More
Inventors: Huang, Jenn-Hwa; Coffman, Samuel L.; Sun, Xi-Qing; Xu, Ji-Hai; Parsey, Jr., John Michael;, Assignee: Motorola, Inc. (Schaumburg, IL) |
Optically controlled MEM switches
The present invention alleviates the above-noted problem of providing control lines for an array MEM switches, and provides other benefits as well. In particular, it provides a mechanism for controlli... Read More
Inventors: Hsu, Tsung-Yuan; Loo, Robert Y.; Tangonan, Greg; Lam, Juan F.;, Assignee: HRL Laboratories, LLC (Malibu, CA) |
Process for high yield fabrication of MEMS devices
The present invention provides a MEMS fabrication process that minimizes the thickness of the silicon device layers and the required etch times, provides exceptionally precise layer to layer alignment... Read More
Inventors: Tsai, Chialun;, Assignee: Rockwell Scientific Licensing, LLC (Thousand Oaks, CA) |
Optical device, laser beam source, laser apparatus and method of producing optical device
The invention claimed is: 1. A method for producing an optical element, comprising: a step of forming a proton exchange layer in an LiNb.sub.xTa.sub.1-xO.sub.3 (0.ltoreq.X.ltoreq.1) substrate; a high-... Read More
Inventors: Yamamoto, Kazuhisa; Mizuuchi, Kiminori; Kitaoka, Yasuo; Kato, Makoto;, Assignee: Matsushita Electric Industrial Co., Ltd. (Osaka, JP) |
High aperture LCD with insulating color filters overlapping bus lines on active substrate
OF CERTAIN EMBODIMENTS OF THIS INVENTION Referring now more particularly to the accompanying drawings in which like reference numerals indicate like is parts throughout the several views. FIG. 1 is a... Read More
Inventors: Zhong, John Z. Z.; den Boer, Willem;, Assignee: LG. Philips LCD Co., Ltd. (Seoul, KR) |
High aperture LCD with insulating color filters overlapping bus lines on active substrate
OF CERTAIN EMBODIMENTS OF THIS INVENTION Referring now more particularly to the accompanying drawings in which like reference numerals indicate like parts throughout the several views. FIG. 1 is a to... Read More
Inventors: Zhong, John Z. Z.; den Boer, Willem;, Assignee: LG.Philips LCD Co., Ltd. (Seoul, KR) |
Method for integrating thermistor
The present invention introduces a new temperature sensing device and method for making such device. The device is a highly sensitive thermistor that is easy to fabricate and can be readily incorpora... Read More
Inventors: Casey, Jon A.; Ferrante, William J.; Kiewra, Edward W.; Radens, Carl J.; Tonti, William R.;, Assignee: International Business Machines Corporation (Armonk, NY) |
Liquid crystal display device provided with auxiliary circuitry for reducing electrical resistance
The present invention has been made to solve the above problems, and an object of the invention is therefore to reduce, without increasing the capacitance, the electric resistance of wiring lines to w... Read More
Inventors: Koyama, Jun; Ohtani, Hisashi; Ogata, Yasushi; Yamazaki, Shunpei;, Assignee: Semiconductor Energy Laboratory, Inc. (Kanagawa-Ken, JP) |
Semiconductor memory device including Shadow RAM
It is an object of the invention to provide a semiconductor memory apparatus for preventing an increase in a cell area of a memory cell of a Shadow RAM and achieving high capacity formation of a stora... Read More
Inventors: Nakura, Takeshi; Miwa, Tohru;, Assignee: NEC Electronics Corporation (Kanagawa, JP) |
Probe look ahead: testing parts not currently under a probehead
The present invention provides a semiconductor substrate, a probe card, and a method for stressing and/or testing dies on a semiconductor substrate. In one aspect, the invention provides a semiconduct... Read More
Inventors: Lunde, Aron T.;, Assignee: Micron Technology, Inc. (Boise, ID) |
Light emitting device
The first object of the present invention is to provide a light emitting device including at least two well layers made of nitride compound semiconductor emitting different color light due to differen... Read More
Inventors: Yamada, Motokazu;, Assignee: Nichia Corporation (Tokushima, JP) |
Method of manufacturing a semiconductor light emitting device, semiconductor light emitting device, method of manufacturing a semiconductor device, semiconductor device, method of manufacturing a device, and device
OF THE PRESENTLY PREFERRED EMBODIMENTS Explained below are embodiments of the invention with reference to the drawings. In all figures illustrating the embodiments, identical or equivalent components... Read More
Inventors: Asatsuma, Tsunenori; Tomiya, Shigetaka; Tamamura, Koshi; Tojo, Tsuyoshi; Goto, Osamu; Motoki, Kensaku;, Assignee: Sony Corporation (Tokyo, JP) Sumitomo Electric Industries, Ltd. (Osaka, JP) |
Image sensor or LCD including switching pin diodes
OF CERTAIN EMBODIMENTS OF THIS INVENTION Referring now more particularly to the accompanying drawings in which like reference numerals indicate like parts throughout the several views. FIGS. 3(a) to ... Read More
Inventors: Gu, Tieer;, Assignee: Ois Optical Imaging Systems, Inc. () |
Photoconductor-on-active-pixel (POAP) sensor utilizing equal-potential pixel electrodes
The active pixel sensor of the invention includes, in one embodiment, a solid state radiation detection unit comprising a crystalline semiconductor substrate, a plurality of complementary metal oxide ... Read More
Inventors: Chao, Calvin; Hsieh, Tzu-Chiang;, Assignee: e-Phocus, Inc. (San Jose, CA) |
Off substrate flip-chip apparatus
OF THE INVENTION The latching off-chip arrangement of the present invention enables the prerelease of for example MEMS modules into a state that is accessible and convenient for ensuing processing su... Read More
Inventors: Michalicek, Mark A.;, Assignee: The United States of America as represented by the Secretary of the Air Force (Washington, DC) N/A ( |
Correlating optical motion detector
In accordance with the present invention, an optical motion detector is comprised of a single chip having an array of photodiodes and means for focusing an image onto the chip. The chip also includes ... Read More
Inventors: Tanner, John E.; Mead, Carver A.;, Assignee: California Institute of Technology (Pasadena, CA) |
CCD output signal processing circuit for use in an image pick-up device
It is an object of the present invention to provide a CCD output signal generating circuit for generating a CCD output signal in which various kinds of noise components are efficiently eliminated. Thi... Read More
Inventors: Matsunaga, Yoshiyuki;, Assignee: Kabushiki Kaisha Toshiba (JP) |
Semiconductor device having a charge transfer device, MOSFETs, and bipolar transistors--all formed in a single semiconductor substrate
Accordingly it is the object of this invention to provide semiconductor device which comprises a charge transfer device, bipolar transistors, and and MOSFETs, all formed in a single semiconductor subs... Read More
Inventors: Taguchi, Minoru;, Assignee: Kabushiki Kaisha Toshiba (Kawasaki, JP) |
Semiconductor integrated circuit and method of making the same
It is an object of the present invention to provide a semiconductor integrated circuit device in which CCD type, bipolar type, and MOS type integrated circuits are provided in one semiconductor chip t... Read More
Inventors: Taguchi, Minoru; Mochizuki, Hiroshi;, Assignee: Kabushiki Kaisha Toshiba (Kawasaki, JP) |
Solid state imaging device
An object of the present invention is to provide a solid state imaging device having a conventional microlens capable of realizing a high sensitivity. In order to achieve the above-described object, a... Read More
Inventors: Matsumoto, Kazuya;, Assignee: Olympus Optical Co., Ltd. (Tokyo, JP) |
MEMS 
