Thin film piezoelectric element, method of manufacturing the same, and actuator
The present invention aims to improve the reproducibility of the shape of piezoelectric elements in etching, to prevent failures, e.g. short circuits between the electrodes sandwiching a piezoelectric... Read More
Inventors: Uchiyama, Hirokazu; Yanagi, Terumi;, Assignee: Matsushita Electric Industrial Co., Ltd. (Osaka, JP) |
Apparatus for stress relieving liquid crystal displays
What is claimed is: 1. A pressure tolerant liquid crystal device comprising: a first unitary substrate and a second unitary substrate spaced from said first unitary substrate: a display aperture porti... Read More
Inventors: Hoyt, Clifford C.;, Assignee: Cambridge Research & Instrumentation Inc. (Cambridge, MA) |
Flat display device
OF THE INVENTION Semitransmission liquid crystal display devices according to preferred embodiments of the present invention will now be described with reference to the accompanying drawing. The basi... Read More
Inventors: Hisatake, Yuzo; Nakamura, Takashi; Oono, Atsuko;, Assignee: Kabushiki Kaisha Toshiba (Kawasaki, JP) |
Method for making an all-silicon capacitive pressure sensor
It is an object of this invention to provide an improved method for fabricating an all-silicon monolithic capacitive pressure sensor. It is another object of this invention that such a method entails ... Read More
Inventors: Sparks, Douglas Ray; Baney, William J.; Staller, Steven Edward; Chilcott, Dan Wesley; Siekkinen, James Werstler;, Assignee: Delco Electronics Corporation (Kokomo, IN) |
Microfabricated ultrasonic immersion transducer
It is an object of the present invention to provide an immersion microfabricated ultrasonic transducer. It is a further object of the present invention to provide a method of fabricating microfabricat... Read More
Inventors: Ladabaum, Igal; Khuri-Yakub, Butrus Thomas; Soh, Hyongsok;, Assignee: The Board of Trustees of the Leland Stanford Junior University (Palo Alto, CA) |
Method for making a wafer-pair having sealed chambers
We claim: 1. A method for making a wafer-pair having deposited layer plugged sealed chambers, comprising: growing a thermal layer on a first side of a first silicon wafer; depositing a nitride layer o... Read More
Inventors: Wood, R. Andrew; Ridley, Jeffrey A.; Higashi, Robert E.;, Assignee: Honeywell Inc. (Minneapolis, MN) |
Method to produce germanium layers
It is an object of the invention to provide an improved method for producing germanium or other layers of large area. In a first aspect, the present invention provides a method of producing a layer of... Read More
Inventors: Seifert, Werner;, Assignee: BTG International Limited (London, GB) |
Method of crystallizing amorphous material with a moving energy beam
We claim: 1. A method of converting solid amorphous material to a more crystalline state comprising the steps of: (a) heating a portion of said material with energy from an energy beam to bring such p... Read More
Inventors: Fan, John C. C.; Zieger, Herbert J.;, Assignee: Massachusetts Institute of Technology (Cambridge, MA) |
Method for fabricating semiconductor device and method for producing liquid crystal display apparatus
A method for fabricating a semiconductor device according to the invention includes the steps of forming a semiconductor film containing silicon, implanting impurity elements to the semiconductor film... Read More
Inventors: Yoshinouchi, Atsushi; Hosoda, Takeshi; Yamamoto, Tomohiko;, Assignee: Sharp Kabushiki Kaisha (Osaka, JP) |
Laser processing method of semiconductor device
However, it is very difficult for only the laser annealing to produce a crystalline silicon film having such a large mobility as is required for a liquid crystal display device. Therefore, it has conv... Read More
Inventors: Tanaka, Koichiro; Yamaguchi, Naoaki;, Assignee: Semiconductor Energy Laboratory Co., Ltd. (Kanagawa-ken, JP) |
Method for producing insulated gate thin film semiconductor device
The object of the present invention is to prevent such the deterioration, and to provide a method for producing an insulated gate semiconductor device having less deterioration. According to a first a... Read More
Inventors: Kusumoto, Naoto; Yamazaki, Shunpei;, Assignee: Semiconductor Energy Laboratory Co., Ltd. (JP) |
Transparent solar cell and method of fabrication
The present invention provides improved devices such as transparent solar cells and optical filters. It also provides improved methods for forming those devices. In contrast with devices and methods p... Read More
Inventors: Campbell, James P.;, Assignee: Xoptix, Inc. (Woodland Hills, CA) |
Laser heat treatment method, laser heat treatment apparatus, and semiconductor device
A laser heat treatment method according to one aspect of the present invention comprises the steps of: forming a laser beam generated from a pulse laser source having a wavelength of 350 nm to 800 nm ... Read More
Inventors: Ogawa, Tetsuya; Tokioka, Hidetada; Sato, Yukio; Inoue, Mitsuo; Sasagawa, Tomohiro; Miyasaka, Mitsutoshi;, Assignee: Mitsubishi Denki Kabushiki Kaisha (Tokyo, JP); Seiko Epson Corporation (Tokyo, JP) |
Method of manufacturing capacitor in semiconductor devices
Accordingly, the present invention is contrived to substantially obviate one or more problems due to limitations and disadvantages of the related art, and an object of the present invention is to prov... Read More
Inventors: Choi, Jae Sung;, Assignee: Hynix Semiconductor Inc. (Ichon-Shi, KR) |
Micromachined device packaged to reduce stiction
It is an object of the present invention to provide methods for reducing stiction of surfaces of a packaged die. It is another object of the present invention to provide apparatus for packaging a die ... Read More
Inventors: Martin, John R.; Zhao, Yang;, Assignee: Analog Devices, Inc. (Norwood, MA) |
Surface treatment for micromachining
According to the present invention a surface treatment for micromachining contains 0.1 to 8 weight percent of hydrogen fluoride and more than 40 weight percent to not more than 47 weight percent of am... Read More
Inventors: Kikuyama, Hirohisa; Miyashita, Masayuki; Yabune, Tatsuhiro; Ohmi, Tadahiro;, Assignee: Stella Chemifa Kabushiki Kaisha (Osaka-fu, JP) |
Method of drying passivated micromachines by dewetting from a liquid-based process
A method of fabricating a micromachine includes the step of constructing a low surface energy film on the micromachine. The micromachine is then rinsed with a rinse liquid that has a high surface ener... Read More
Inventors: Houston, Michael R.; Howe, Roger T.; Maboudian, Roya; Srinivasan, Uthara;, Assignee: Regents of the University of California (Oakland, CA) |
Post-etch treatment of plasma-etched feature surfaces to prevent corrosion
We have discovered a post-etch treatment for plasma-etched, metal-comprising feature surfaces which significantly reduces or eliminates surface corrosion of the etched feature. As a part of the post e... Read More
Inventors: Ye, Yan; Zhao, Xiaoye; Hsieh, Chang-Lin; Deng, Xian-Can; Tu, Wen-Chiang; Chu, Chung-Fu; Ma, Diana Xiaobing;, Assignee: Applied Materials, Inc. (Santa Clara, CA) |
Method for processing a plurality of micro-machined mirror assemblies
It is an object of the invention to provide optical data storage systems with flying heads that have a steerable micro-machined mirror with a mirror flatness (on the order of less than .lambda./10 whe... Read More
Inventors: Drake, Joseph D.; Jerman, John H.; Jackson, Kathy J.;, Assignee: Seagate Technology, Inc. (Scotts Valley, CA) |
Vapor phase deposition
What is claimed is: 1. A method of forming a coating on a surface of an article, comprising: placing a porous article between an upper housing portion and a lower housing portion of a process chamber,... Read More
Inventors: Wang, Yuchun;, Assignee: The Regents of the University of California (Oakland, CA) |
Method of producing photovoltaic element
In view of the above-described problems, an object of the present invention is to provide a method of producing a photovoltaic element, more particularly a thin-film solar cell having good characteris... Read More
Inventors: Shimoda, Hiroshi;, Assignee: Canon Kabushiki Kaisha (Tokyo, JP) |
Method of manufacturing a printed circuit assembly
OF THE PREFERRED EMBODIMENTS The invention incorporates two primary aspects. The first deals with controlling the separation between opposing printed circuit layers in a printed circuit assembly. The... Read More
Inventors: Pommer, Richard J.;, Assignee: AlliedSignal Inc. (Morristown, NJ) |
Monolithic pin diode and method for its manufacture
The present invention resides in a diode that is fabricated in a monolithic semiconductor device and that exhibits desirable PIN diode characteristics. A key feature of the device is that it includes ... Read More
Inventors: Richards, John G.;, Assignee: FEI Microwave, Inc. (Sunnyvale, CA) |
Face-down bonding pin diode
The present invention aims to provide a diode device, having both electrodes provided on the same surface thereof, which can be face-down bonded to a circuit board. In order to achieve the above objec... Read More
Inventors: Kasahara, Takeshi;, Assignee: Toko Kabushiki Kaisha (Tokyo-To, JP) |
Memory card
According to studies made by the present inventors it has turned out that the following problems are involved in the memory cards of such a conventional structure as described above. Firstly, in the m... Read More
Inventors: Kanemoto, Kouichi; Masuda, Masachika;, Assignee: Renesas Technology Corp. (Tokyo, JP) |
High-frequency hybrid semiconductor integrated circuit structure including multiple coupling substrate and thermal dissipator
It is therefore an object of the present invention to provide a high-frequency semiconductor hybrid integrated circuit having an excellent high-frequency characteristics, saving labor in the manufactu... Read More
Inventors: Komuro, Katsuya;, Assignee: Mitsubishi Denki Kabushiki Kaisha (Tokyo, JP) |
Hybrid IC
A hybrid IC of the invention includes: a substrate; at least one inductor formed on the substrate; a semiconductor chip mounted on the substrate by flip-chip bonding; at least one terminal formed in a... Read More
Inventors: Nakatsuka, Tadayoshi; Itoh, Junji; Yamamoto, Shinji; Nishitsuji, Mitsuru;, Assignee: Matsushita Electric Industrial Co., Ltd. (Kadoma, JP) |
Resin-sealed electronic apparatus for use in internal combustion engines
It is therefore a primary objective of the present invention to provide a new and improved electronic apparatus capable of achieving enhanced durability (long life-time) at soldered portions of a powe... Read More
Inventors: Kaminaga, Toshiaki; Fukatsu, Katsuaki; Kobayashi, Ryoichi;, Assignee: Hitachi, Ltd. (Tokyo, JP); Hitachi Car Engineering Co., Ltd. (Hitachinaka, JP) |
Two-dimensional image pickup apparatus
In view of the above described circumstances, it is therefore an object of the present invention to provide a small, down-sized image pickup apparatus that is free from the above identified problems. ... Read More
Inventors: Hata, Fumio;, Assignee: Canon Kabushiki Kaisha (Tokyo, JP) |
Color filter with resist material in scribe lines
A method for processing a semiconductor substrate comprises the steps of: providing a substrate having a plurality of scribe lines having a step height and arranged to form at least one filter region ... Read More
Inventors: Weng, Fu-Tien; Hsiao, Yu-Kung; Hsu, Hung-Jen; Dai, Yi-Ming; Kuo, Chin-Chen; Tseng, Te-Fu;, Assignee: Taiwan Semiconductor Manufacturing Co., Ltd. (Hsin-Chu, TW) |
MEMS 
