Pre-release plastic packaging of MEMS and IMEMS devices
OF THE INVENTION The present invention relates to a method for activating at least one sensitive area of a microelectronic device, comprising the steps of providing a microelectronic device having at... Read More
Inventors: Peterson, Kenneth A.; Conley, William R.;, Assignee: Sandia Corporation (Albuquerque, NM) |
Encapsulated microelectromechanical (MEMS) devices
The above and other needs are met by the present invention which, in one embodiment, provides a method of encapsulating microelectromechanical (MEMS) structures formed on a substrate prior to packagin... Read More
Inventors: Wood, Robert L.; Dudley, Bruce W.;, Assignee: JDS Uniphase Corporation (San Jose, CA) |
Silicon-controlled rectifier structures on silicon-on insulator with shallow trench isolation
A principal object of the present invention is to provide an effective and very manufacturable method of forming a SCR ESD device on a SOI substrate. A further object of the present invention is to pr... Read More
Inventors: Yu, Ta Lee;, Assignee: Taiwan Semicondcutor Manufacturing Co., Ltd. (Hsinchu, TW) |
Optoelectronic integrated circuit
Referring now to FIGS. 2 and 3, there are shown a cross-sectional and top view respectively, of portions of an optoelectronic integrated circuit 11 in accordance with the invention. The integrated ci... Read More
Inventors: Kahen, Keith B.; Rajeswaran, Gopalan;, Assignee: Eastman Kodak Company (Rochester, NY) |
High frequency semiconductor device having optical guide package structure
Accordingly, it is an object of the present invention to provide a semiconductor device which has overcome the above mentioned defect of the conventional one. Another object of the present invention i... Read More
Inventors: Suzuki, Katsuhiko;, Assignee: NEC Corporation (Tokyo, JP) |
Method and apparatus for determining a sampling plan based on process and equipment state information
One aspect of the present invention is seen in a processing line including a process tool, a metrology tool, a tool state monitor, and a sampling controller. The processing tool is configured to proce... Read More
Inventors: Sonderman, Thomas J.; Pasadyn, Alexander J.; Bode, Christopher A.;, Assignee: Advanced Micro Devices, Inc. (Austin, TX) |
Optical coupler
What is claimed is: 1. Apparatus comprising: a. a photo-emissive body mounted on a first beam, b. a photo-responsive body mounted on a second beam electrically isolated from said first beam and spaced... Read More
Inventors: Paxton, Jr., Grady W.; Howeth, Bobby W.; Mehal, Edward W.; Cashion, William F.; Cashion, Charles M.;, Assignee: |
Method of fabricating flip-chip on leads devices and resulting assemblies
The present invention relates to an apparatus and method for attaching a semiconductor die to a lead frame. More particularly, the present invention relates to employing a "flip-chip" arrayed bond pad... Read More
Inventors: Wark, James M.;, Assignee: Micron Technology, Inc. (Boise, ID) |
Method of making integrated circuit package having adhesive bead supporting planar lid above planar substrate
The present invention includes a package enclosing one or more integrated circuit die, and a method for making such a package. The package is useful, for example, in SAW, EPROM and CCD applications. A... Read More
Inventors: Glenn, Thomas P.; Hollaway, Roy D.; Panczak, Anthony E.;, Assignee: Amkor Technology, Inc. (Chandler, AZ) |
Semiconductor chip assembly
The present invention provides a semiconductor chip package employing differing CTE characteristics and modulus of elasticity (or simply "modulus") for certain of the elements within the package itsel... Read More
Inventors: Mitchell, Craig; Warner, Mike; Behlen, Jim;, Assignee: Tessera, Inc (San Jose, CA) |
Monolithic wavelength meter and photodetector using a wavelength dependent reflector
FIG. 1 shows a preferred embodiment of a wavelength meter and photodetector 10 according to the invention. Wavelength meter and photodetector 10 has a top photodiode 12 and a bottom photodiode 14. To... Read More
Inventors: Nabiev, Rashit F.; Chang-Hasnain, Constance J.; Eng, Lars E.; Lau, Kam-Yin;, Assignee: The Board of Trustees of the Leland Stanford Junior University (Stanford, CA); The Regents of the University of California (Berkeley, CA) |
Base of optoelectronic device
For overcoming the conventional problems described in the aforementioned background, one object of the present invention is to provide a base of an optoelectronic device, so as to efficiently emitting... Read More
Inventors: Lin, Ming-Der; Wang, Kwang-Ru;, Assignee: Highlink Technology Corporation (Hsinchu, TW) |
Photosensitive device of the type with amplification of the signal at the photosensitive dots
The present invention concerns a solid-state type of device, the photosensitive dots of which are arranged in a novel way enabling an amplification of the signal at each photosensitive dot without sho... Read More
Inventors: Berger, Jean-Luc;, Assignee: Thomson-CSF (Puteaux, FR) |
CVD organic polymer film for advanced gate patterning
OF PREFERRED EMBODIMENTS In the following description of preferred embodiments, reference is made to the accompanying drawings which form a part hereof, and in which are shown by way of illustration ... Read More
Inventors: You, Lu; Plat, Marina V.; Yang, Chih Yuh; Bell, Scott A.; Huang, Richard J.; Lyons, Christopher F.; Chang, Mark S.; Wright, Marilyn I.;, Assignee: Advanced Micro Devices, Inc. (Sunnyvale, CA) |
MEMS structure having a blocked-sacrificial layer support/anchor and a fabrication method of the same
In order to solve the above problems, the present invention has been developed to provide a MEMS structure and associated fabrication method wherein the fixing portion fixed to the substrate and the f... Read More
Inventors: Lee, Eun-sung; Lee, Moon-chul; Kim, Hyun-ok;, Assignee: Samsung Electronics Co., Ltd. (Gyunggi-do, KR) |
Laser apparatus and method for measuring stress in a thin film using multiple wavelengths
In accordance with the present invention, an apparatus and a method for measuring the radius of curvature of a surface using two or more laser beams of various wavelengths are provided. The present in... Read More
Inventors: Blech, Ilan A.; Hirsch, Dov E.;, Assignee: Tencor Instruments, Inc. (Mountian View, CA) |
Method for fabricating five-level microelectromechanical structures and microelectromechanical transmission formed
The present invention relates to a method for forming microelectromechanical (MEM) structures or devices using five layers or levels of polysilicon, and to a MEM apparatus (i.e. a device) formed by th... Read More
Inventors: Rodgers, M. Steven; Sniegowski, Jeffry J.; Miller, Samuel L.; McWhorter, Paul J.;, Assignee: Sandia Corporation (Albuquerque, NM) |
Self positioning, passive MEMS mirror structures
A MEMS structure is provided including a substrate. Within the substrate is deposited a spring comprising of material initially fixed to the substrate along a length of the spring. The material formin... Read More
Inventors: Biegelsen, David K.;, Assignee: Xerox Corporation (Stamford, CT) |
Gap tuning for surface micromachined structures in an epitaxial reactor
According to an exemplary embodiment of the present invention, a method for precisely controlling the gap between micromechanical elements on a device, or "gap tuning," begins with a partially formed ... Read More
Inventors: Partridge, Aaron; Lutz, Markus;, Assignee: Robert Bosch GmbH (Stuttgart, DE) |
Elastic surface wave element
It is an object of the present invention to provide an elastic surface wave element which prevents mixture of foreign substances thereto to improve the reliability thereof and allows a peripheral circ... Read More
Inventors: Takoshima, Takehiro;, Assignee: Alps Electric Co., Ltd. (JP) |
Surface acoustic wave device and method of manufacture
The goal of the present invention is to solve problems caused by using conventional assembly methods, and to achieve a compact and low height surface acoustic wave device, and at the same time, to off... Read More
Inventors: Onishi, Keiji; Seki, Shun-ichi; Taguchi, Yutaka; Eda, Kazuo;, Assignee: Matsushita Electric Industrial Co., Ltd. (Osaka, JP) |
Surface acoustic wave device package and method
OF THE PREFERRED EMBODIMENT As used herein, the term "surface acoustic wave (SAW) device" refers to devices such as Rayleigh wave filters, surface skimming bulk wave filters and other devices employi... Read More
Inventors: Anderson, Michael J.; Kennison, Gregory; Christensen, Jeffrey E.; Johnson, Gary C.; Aday, Jon G.;, Assignee: CTS Corporation (Elkhart, IN) |
Surface acoustic wave device mounted with a resin film and method of making same
What is claimed is: 1. A surface acoustic wave device, comprising: a piezoelectric substrate provided with interdigital transducers and surface wave propagation areas, both being formed on a functiona... Read More
Inventors: Funada, Yoshitsugu; Tanioka, Michinobu;, Assignee: NEC Corporation (Tokyo, JP) |
Low-cost method of forming a color imager
OF THE INVENTION FIG. 2 shows a cross-sectional view that illustrates an example of a color imager 200 in accordance with the present invention. As described in greater detail below, color imager 200... Read More
Inventors: Hopper, Peter J.; Drury, Robert; Lindorfer, Philipp; Vashchenko, Vladislav;, Assignee: Eastman Kodak Company (Rochester, NY) |
Parallel optical interconnect
The present invention is an optical interconnect for coupling multiple optical fibers to an optoelectronic device array. In a first embodiment of the invention, the optical interconnect comprises a mu... Read More
Inventors: Swirhun, Stanley E.; Uchida, Toshi K.;, Assignee: Photonics Research Incorporated (Bloomfield, CO) |
Parallel optical interconnect
The present invention is an optical interconnect for coupling multiple optical fibers to an optoelectronic device array. In a first embodiment of the invention, the optical interconnect comprises a mu... Read More
Inventors: Swirhun, Stanley E.; Uchida, Toshi K.;, Assignee: Vixel Corporation (Broomfield, CO) |
Vertical cavity surface emitting laser array packaging
An optical data transmission package is provided that has a housing for transmitting optical signals that are generated inside of the housing of said package through an optical coupling connector that... Read More
Inventors: Sauter, Gerald Francis; Stevens, Rick Clevie; Thorson, Kevin Jerome;, Assignee: Lockheed Martin Corporation (Bethesda, MD) |
Fiber optic connector
An object, therefore, of the invention is to provide a new and improved connector assembly, such as a fiber optic fanout connector, of the character described. In the exemplary embodiment of the inven... Read More
Inventors: Grois, Igor; Kim, Byung; Marrapode, Thomas R.; Matasek, Jeffrey A.;, Assignee: Molex Incorporated (Lisle, IL) |
Hybrid active and electronic circuit with evanescent coupling
The present invention is directed to a method for forming a hybrid active electronic and optical circuit using a lithography mask. The hybrid active electronic and optical circuit comprising an active... Read More
Inventors: Deliwala, Shrenik; Patel, Vipulkumar;, Assignee: SiOptical, Inc. (Allentown, PA) |
Manufacturing method for the miniaturization of silicon bulk-machined pressure sensors
The objective of the present invention is to provide a manufacturing method which is able to miniaturize the size of a silicon bulk-machined micro pressure sensor, and the structure of the micro press... Read More
Inventors: Yang, Lung-Jieh; Chang, Yih-Min;, Assignee: Chang; Yih-Min (Kaohsiung, TW) |
MEMS 
