Method for fabricating a semiconductor device
According to one aspect of the invention, a method for fabricating a semiconductor device including an active region obtained by utilizing a silicon semiconductor film having crystallinity is provided... Read More
Inventors: Makita, Naoki; Miyamoto, Tadayoshi; Shibuya, Tsukasa;, Assignee: Sharp Kabushiki Kaisha (Osaka, JP) |
Semiconductor device and manufacturing method for the same
An object of the present invention is to form a thin film semiconductor layer having a very low content of elements such as nickel by employing heat crystallization in a low temperature process. The p... Read More
Inventors: Hayakawa, Masahiko;, Assignee: Semiconductor Energy Laboratory Co., Ltd. (Kanagawa-ken, JP) |
Method of crystallizing an amorphous film
Accordingly, the present invention is directed to a method for crystallizing an amorphous film that substantially obviates one or more of the problems due to limitations and disadvantages of the relat... Read More
Inventors: Jang, Jin; Yoon, Soo-Young; Oh, Jae-Young;, Assignee: LG. Philips LCD Co., Ltd. (Seoul, KR) |
Semiconductor light-emitting device and method for manufacturing thereof
Accordingly, an object of the present invention is to provide a semiconductor light-emitting device, as well as a method for manufacture thereof, which can be reduced in ineffective current with a sim... Read More
Inventors: Sasaki, Kazuaki; Nakamura, Junichi; Ohyama, Shouichi;, Assignee: Sharp Kabushiki Kaisha (Osaka, JP) |
Light-emitting device
In view of the above, the present invention has an object to provide a light-emitting device in which the number of thin film transistors provided in each of pixels is restricted to two, and uneven lu... Read More
Inventors: Yamazaki, Shunpei; Koyama, Jun; Osada, Mai;, Assignee: Semiconductor Energy Laboratory Co., Ltd. (Kanagawa-ken, JP) |
Process for direct integration of a thin-film silicon p-n junction diode with a magnetic tunnel junction
It is an object of the present invention to provide a non-linear element (switch) between two metal conductors in an electric circuit that is fabricated directly onto one of the metal conductors. A fu... Read More
Inventors: Toet, Daniel; Sigmon, Thomas W.;, Assignee: The Regents of the University of California (Oakland, CA) |
Modular mattress apparatus
The present invention relates to a mattress for supporting a body. More particularly, the present invention relates to a modular foam mattress apparatus which provides a pressure reduction surface for... Read More
Inventors: Henley, Alan W.; Stolpmann, James R.;, Assignee: Hill-Rom Services, Inc. (Wilmington, DE) |
Semiconductor device and method of producing the same
OF THE INVENTION (First Embodiment) Referring to FIG. 1(a) to FIG. 1(d), the following description will discuss a semiconductor device according to a first embodiment of the present invention, and a ... Read More
Inventors: Aoi, Nobuo;, Assignee: Matsushita Electric Industrial Co., Ltd. (Osaka, JP) |
Method of making circuit devices comprising a dielectric layer of siloxane-caprolactone
Referring to FIG. 1, there is shown schematically a ceramic substrate 10 upon which it is desired to form a hybrid integrated circuit by supporting and interconnecting a plurality of semiconductor ch... Read More
Inventors: Brown, Paula J.; Fang, Treliant; Ors, Jose A.; Raju, Venkataram R.; Shah, Akshay V.;, Assignee: AT&T Bell Laboratories (Murray Hill, NJ) |
Multi-ceramic layer switch circuit
The present invention, accordingly, advantageously provides a switch circuit, and associated method, of minimal insertion loss. The present invention further advantageously provides a switch circuit f... Read More
Inventors: Agahi-Kesheh, Darioush; Huang, Rong-Fong; Kommrusch, Richard S.;, Assignee: Motorola, Inc. (Schaumburg, IL) |
Micromechanical microwave switching
The present invention provides micromechanical microwave switches and arrays of switches with membranes and flaps supported on at least two sides. The invention has advantages including switches with ... Read More
Inventors: Goldsmith, Charles; Kanack, Bradley M.; Lin, Tsen-Hwang; Norvell, Bill R.; Pang, Lily Y.; Powers, Jr., Billy; Rhoads, Charles; Seymour, David;, Assignee: Texas Instruments Incorporated (Dallas, TX) |
Micro-electromechanical die module with planarized thick film layer
It is an object of the present invention to provide an improved micro-electromechanical device having two silicon substrates bonded together by an intermediate thick film layer of patterned polymeric ... Read More
Inventors: Burke, Cathie J.; Hawkins, William G.; Hermanson, Herman A.; Ferringer, Michael C.; Fisher, Almon P.; Atkinson, Diane;, Assignee: Xerox Corporation (Stanford, CT) |
Method for fabricating a printed circuit board by curing under superatmospheric pressure
OF A PREFERRED EMBODIMENT According to the present invention, a method is provided for fabricating a multilayer printed circuit board in which a first resin layer is deposited onto a substrate. The f... Read More
Inventors: Magera, Yaroslaw Antin; Simons, Everett Furber;, Assignee: Motorola, Inc. (Schaumburg, IL) |
Process for producing a ceramic multilayer substrate
To produce a ceramic multilayer substrate, unfired, green ceramic foils are used. The green ceramic foils are made of ceramic particles, an inorganic binder and an organic binder. Suitable materials ... Read More
Inventors: Goebel, Ulrich; Roethlingshoefer, Walter;, Assignee: Robert Bosch GmbH (Stuttgart, DE) |
Micromachined electrostatic vertical actuator
It is an object of the present invention to provide a micromachined vertical actuator. A further object of the invention is to provide a micromachined electrostatic vertical actuator for optical phase... Read More
Inventors: Lee, Abraham P.; Sommargren, Gary E.; McConaghy, Charles F.; Krulevitch, Peter A.;, Assignee: The Regents of the University of California (Oakland, CA) |
Low-voltage long life electrostatic microelectromechanical system switches for radio-frequency applications
To address the above concerns, the present invention provides for a flexible longitudinal beam of predetermined design and a means for introducing a longitudinal force on the flexible longitudinal bea... Read More
Inventors: Wang, Johnson J. H.; Thompson, Gregory T.;, Assignee: Wang Electro-Opto Corporation (Marietta, GA) |
Method and apparatus for an improved single pole double throw micro-electrical mechanical switch
The need in the art is addressed by the single pole, double throw MEM design and method of the present invention. The inventive switch includes a first contact providing a first terminal of the switch... Read More
Inventors: McMillan, Lee A.; Streeter, Robert D.;, Assignee: Raytheon Company (Lexington, MA) |
Method for manufacturing an integral thin-film metal resistor
According to the present invention, there is provided a method for manufacturing a microelectronic assembly to have a resistor, and particularly a metal resistive film, with desirable processing and d... Read More
Inventors: Dunn, Gregory J.; Savic, Jovica; Beuhler, Allyson;, Assignee: Motorola, Inc. (Schaumburg, IL) |
MEMS switch
The basic layout of the switch is shown in FIGS. 1A, 1B and 2. These switches are described in Elliott R. Brown, "RF-MEMS Switches for Reconfigurable Integrated Circuits," IEEE Transactions on Microw... Read More
Inventors: Valas, Sam;, Assignee: California Institute of Technology (Pasadena, CA) |
Semiconductor device
OF THE INVENTION The construction and the manufacturing method of a semiconductor device of the present invention will now be described in detail with reference to the accompanying drawings showing p... Read More
Inventors: Tahara, Iwao; Mihara, Ichiro; Aoki, Yutaka;, Assignee: Oki Electric Industry Co., Ltd. (Tokyo, JP); Casio Computer Co., Ltd. (Tokyo, JP) |
Transflective liquid crystal display device and manufacturing method for the same
Accordingly, the present invention is directed to a transflective liquid crystal display device and a method of manufacturing the reflective liquid crystal display device that substantially obviates o... Read More
Inventors: Ha, Kyoung-Su; Yi, Jong-Hoon;, Assignee: LG Phillips LCD Co., Ltd. (Seoul, KR) |
Manufacturing method for semiconductor device
A semiconductor device is usually produced in a clean room. In a clean room, filters are used for removing dirt, dust, contaminants, or the like from the outside air which is taken into the room. Cont... Read More
Inventors: Asami, Taketomi; Ichijo, Mitsuhiro; Toriumi, Satoshi; Ohtsuki, Takashi; Yamazaki, Shunpei;, Assignee: Semiconductor Energy Laboratory Co., Ltd. (Kanagawa-ken, JP) |
Semiconductor package, method of manufacturing the same, and semiconductor device
An object of the present invention is to provide a semiconductor package capable of containing a capacitor portion for exerting a decoupling effect without inhibiting formation of a low-profile packag... Read More
Inventors: Iijima, Takahiro; Rokugawa, Akio; Shimizu, Noriyoshi;, Assignee: Shinko Electric Industries Co., Ltd. (Nagano, JP) |
Color separation prism with adjustable path lengths
OF THE INVENTION Those of ordinary skill in the art will realize that the following description of the present invention is illustrative only and not in any way limiting. Other embodiments of the inv... Read More
Inventors: Slagle, Timothy M.; Lyon, Richard F.; Ruda, Mitchell C.; Stuhlinger, Tilman W.;, Assignee: Foveon, Inc. (Santa Clara, CA) |
Image sensing apparatus and reading apparatus
The present invention has been made to solve the above problem, and has as its object to provide an image sensing apparatus and, more specifically, an image sensing apparatus which, in a contact image... Read More
Inventors: Koizumi, Kazuhisa;, Assignee: Canon Kabushiki Kaisha (Tokyo, JP) |
Stress migration evaluation method
The present invention provides a method for accurately and objectively evaluating stress migration effects on long term reliability of integrated circuits. A sample containing a conductive runner is f... Read More
Inventors: Ryan, Vivian W.;, Assignee: Lucent Technologies (Murray Hill, NJ) |
Reduced electromigration and stressed induced migration of Cu wires by surface coating
Having thus described our invention, what we claim as new and desire to secure by Letters Patent is: 1. A structure comprising: a layer of dielectric on a substrate, at least one trench formed in said... Read More
Inventors: Hu, Chao-Kun; Rosenberg, Robert; Rubino, Judith Marie; Sambucetti, Carlos Juan; Stamper, Anthony Kendall;, Assignee: International Business Machines Corporation (Armonk, NY) |
Method of monitoring internal voltage and controlling a parameter of an integrated circuit
The present invention addresses these problems by adding a sensor point on an integrated circuit (IC) die. In one embodiment, the sensor point is centrally located on the IC die and a dedicated sensor... Read More
Inventors: Elward, John S.;, Assignee: Xilinx, Inc (San Jose, CA) |
Method for fabricating a semiconductor device having contacts self-aligned with a gate electrode thereof
An object of the present invention is providing a highly reliable semiconductor device and a method for fabricating the same by protecting a gate electrode using a silicon nitride film even when the g... Read More
Inventors: Uehara, Takashi; Kanazawa, Masato;, Assignee: Matsushita Electric Industrial Co., LTD (JP) |
Method of fabricating polysilicon film by nickel/copper induced lateral crystallization
Accordingly, the present invention is directed to a method of fabricating polysilicon film that substantially obviates one or more of the problems due to limitations and disadvantages of the related a... Read More
Inventors: Lee, Si-Chen; Hsuch, Wei-Chieh; Chen, Chi-Chieh;, Assignee: National Taiwan University (Taipei, TW) |
MEMS 
