Magnetic spin transistor device, logic gate & method of operation
An object of the present invention therefore is to provide an improved magnetic spin transistor that can be used as a logic gate for performing digital combinational tasks, as well as in all other env... Read More
Inventors: Johnson, Mark B.;, Assignee: |
Method of controlling a super conductor
Accordingly, it is an object of this invention to provide a variable weak link. It is a further object of the present invention to produce a weak link that may be strongly modulated and provide a high... Read More
Inventors: Osofsky, Michael; Soulen, Jr., Robert J.; Auyeung, Raymond; Horwitz, James S.; Chrisey, Doug B.; Johnson, Mark;, Assignee: The United States of America as represented by the Secretary of the Navy (Washington, DC) |
All-metal, giant magnetoresistive, solid-state component
The present invention provides an all-metal, solid-state component the operation of which is based on the phenomenon of giant magnetoresistance. The described structure, the "transpinnor", may be empl... Read More
Inventors: Torok, E. James; Spitzer, Richard;, Assignee: Integrated Magnetoelectronics (Berkeley, CA) |
Method for fabricating ferroelectric random access memory device with merged-top electrode-plateline capacitor
OF THE INVENTION Other objects and aspects of the invention will become apparent from the following description of the embodiments with reference to the accompanying drawings, which is set forth here... Read More
Inventors: Oh, Sang-Hyun; Bang, Kyu-Hyun; Jang, In-Woo; Seong, Jin-Yong; Kim, Jin-Gu; Park, Song-Hee; Yang, Young-Ho; Lee, Kye-Nam; Hong, Suk-Kyoung;, Assignee: Hynix Semiconductor Inc. (KR) |
Storage element and SRAM cell structures using vertical FETS controlled by adjacent junction bias through shallow trench isolation
A principal object of the present invention is to provide an effective and very manufacturable memory device and method of fabrication thereof. A further object of the present invention is to provide ... Read More
Inventors: Chi, Min-Hwa;, Assignee: Taiwan Semiconductor Manufacturing Company (Hsin-chu, TW) |
Surface-mount flat package semiconductor device
It is an object of the present invention to overcome these drawbacks of the prior art by providing a package that is compact and avoids short circuits between terminals. A further object of the presen... Read More
Inventors: Aono, Tsutomu; Nishi, Takayoshi;, Assignee: Sanyo Electric Co., Ltd. (Osaka, JP) |
Plural semiconductor die housed in common package with split heat sink
OF THE INVENTION Referring first to FIG. 1A, there is shown a known surface mount package 1 in which the main pad area of the lead frame forms a single heat sink from which in-line pins 2A and 2B ext... Read More
Inventors: Woodworth, Arthur; Pearson, George; Ewer, Peter Richard;, Assignee: International Rectifier Corp. (El Segundo, CA) |
Methods of making thin integrated circuit device packages with improved thermal performance and substrates for making the packages
Similar features in the various figures are identified using the same reference numbers, and redundant discussion is omitted. FIG. 1 depicts an embodiment of a package 10 within the present invention... Read More
Inventors: Fusaro, James M.; Darveaux, Robert F.; Rodriguez, Pablo;, Assignee: Amkor Technology, Inc. (Chandler, AZ) |
Integrated circuit packaging for optical sensor devices
An optical device packaging technique involves an optical sensor that is formed on a first substrate and flip chip bonded to a second substrate. The second substrate includes a through hole or a trans... Read More
Inventors: Kelly, Michael G.; Chang, James-Yu; Sasser, Gary Dean; Hunter, Andrew Arthur; Chang, Cheng-Cheng;, Assignee: Agilent Technologies, Inc. (Palo Alto, CA) |
Two-mask trench schottky diode
The present invention now will be described more fully hereinafter with reference to the accompanying drawings, in which a preferred embodiment of the invention is shown. This invention may, however,... Read More
Inventors: Tsui, Yan Man; Hshieh, Fwu-Iuan; So, Koon Chong;, Assignee: General Semiconductor, Inc. (Melville, NY) |
Optical component and method manufacturing the same
A first object of the present invention is to provide an optical component and a manufacturing method thereof free from the above-described problem of the conventional art, i.e., an optical component ... Read More
Inventors: Fujinawa, Jun; Nakada, Junji;, Assignee: Fuji Photo Film Co., Ltd. (Kanagawa, JP) |
Printed circuit board with opposed bonding shelves for semiconductor chip wire bonding at different levels
The printed circuit board for mounting semiconductor chips in this invention is a printed circuit board having conductive traces on both sides. The circuit traces are formed by copper or other electri... Read More
Inventors: Hirakawa, Tadashi;, Assignee: Fuji Machinery Mfg. & Electronics Co., Ltd. (Osaka, JP) |
Semiconductor device
It is a general object of the present invention to provide a semiconductor device, in which the above problems are eliminated. Another and a more specific object of the present invention is to provide... Read More
Inventors: Ozawa, Kaname; Okuda, Hayato; Hiraoka, Tetsuya; Sato, Mitsutaka; Akashi, Yuji; Okada, Akira; Harayama, Masahiko;, Assignee: Fujitsu Limited (Kawasaki, JP) |
Photodiode for ultra high speed optical communication and fabrication method therefor
The present invention overcomes the above-described problems, and provides additional advantages, by providing a photodiode used in an ultra high-speed optical communication and its fabrication method... Read More
Inventors: Yang, Seung-Kee;, Assignee: Samsung Electronics Co. Ltd. (Suwon-si, KR) |
Method of forming a color filter on a substrate having pixel driving elements
The object of the present invention is to provide a method of forming a color filter on a substrate having pixel driving elements. Another object of the present invention is to provide a method of app... Read More
Inventors: Chen, Chih-Chiang; Chuang, Ching-Sang; Chang, Jiun-Jye;, Assignee: |
Field emission cathode apparatus
Accordingly, it is an object of the invention to provide a field emission cathode apparatus which has uniform density of electron emission over a whole emissive area of the apparatus, and means to mod... Read More
Inventors: Kuriyama, Toshihide; Makishima, Hideo;, Assignee: NEC Corporation (Tokyo, JP) |
Emissive display including field emitters on a transparent substrate
It is an object of this invention to provide an apparatus in accordance with claim 1. Advantageously this invention overcomes prior existing limitations in the size, structure, brightness and efficien... Read More
Inventors: Troxell, John Richard;, Assignee: General Motors Corporation (Detroit, MI) |
Method of manufacturing high aspect-ratio field emitters for flat panel displays
It is a principle object of this invention to provide a new and improved method for manufacturing a gated self-aligned field emitter structure on a cathode with reduced capacitance between the cathode... Read More
Inventors: Lin, Ching-Yuan; Chao-Chi, Peng; Chang, Kyan-Lun; Wang, Jermmy J. M.;, Assignee: Industrial Technology Research Institute (Hsin-Chu, TW) |
Multilayer pillar structure for improved field emission devices
This description is divided into three parts. Part I describes an improved electron emission device using multilayer pillars. Part II describes considerations in pillar design, and Part III describes... Read More
Inventors: Jin, Sungho; Kochanski, Gregory Peter; Zhu, Wei;, Assignee: Lucent Technologies Inc. (Murray Hill, NJ) |
Method for making improved pillar structure for field emission devices
The pillars in the field emission flat panel displays mechanically support the anode layer above the pillars, and electrically separate the cathode and anode. Therefore, mechanical strength as well a... Read More
Inventors: Chandross, Edwin Arthur; Jin, Sungho; Kochanski, Gregory Peter; Thomson, Jr., John; Zhu, Wei;, Assignee: Lucent Technologies Inc. (Murray Hill, NJ) |
Field emitter device with a current limiter structure
These and other problems are resolved by a field emission device that includes a column conductor deposited on an insulating substrate. The column conductor is a very wide stripe of material that prov... Read More
Inventors: Jones, Gary W.; Jones, Susan K.; Marino, Jeffrey; Ho, Joseph K.; Boysel, R. Mark; Zimmerman, Steven M.; Liu, Yachin; Costa, Michael J.; Silvernail, Jeffrey A.;, Assignee: FED Corporation (Hopewell Junction, NY) |
Matrix addressable display with electrostatic discharge protection
A field emission display includes an electrostatic discharge ("ESD") circuit coupled to discharge statically induced charge, thereby reducing damage to the field emission display. In one embodiment of... Read More
Inventors: Cathey, David A.; Hush, Glen E.; Ma, Manny K. F.; Dunham, Craig M.; Zimlich, David A.;, Assignee: Micron Technology, Inc. (Boise, ID) |
Field emitter fabrication using open circuit electrochemical lift off
We claim: 1. In a field emitter structure having a cavity formed into an insulating layer overlying at least a portion of a first electrically conductive layer, and a second electrically conductive la... Read More
Inventors: Porter, John D.; Chakarova, Gabriela S.; Knall, N. Johan; Spindt, Christopher J.;, Assignee: Candescent Technologies Corporation (San Jose, CA) |
Fabrication of volcano-shaped field emitters by chemical-mechanical polishing (CMP)
The present invention is directed to a process for producing field emission devices, particularly large arrays of such devices. Utilizing chemical-mechanical polishing (CMP) steps as components of the... Read More
Inventors: Busta, Heinz H.;, Assignee: American Energy Services (Columbus, OH) |
Two-part field emission structure
It is therefore an object of this invention is to provide a field emitting structure with a low operating voltage. It is a further object of this invention to provide a field emitting structure using ... Read More
Inventors: Huang, Jammy Chin-Ming; Liu, David Nan-Chou;, Assignee: Industrial Technology Research Institute (Hsin-Chu, TW) |
Fabrication of volcano-shaped field emitters by chemical-mechanical polishing (CMP)
The present invention is directed to a process for producing field emission devices, particularly large arrays of such devices. Utilizing chemical-mechanical polishing (CMP) steps as components of the... Read More
Inventors: Busta, Heinz H.;, Assignee: American Energy Services, Inc. (Columbus, OH) |
Miniature x-ray unit
An object of the present invention is to provide an electronic x-ray unit. A further object is to provide an electronic x-ray unit for vascular brachytherapy. Briefly, according to the present inventi... Read More
Inventors: Shefer, Ruth; Klinkowstein, Robert E.; Hughey, Barbara J.;, Assignee: Newton Scientific, Inc. (Cambridge, MA) |
Field emitter arrays with gate insulator and cathode formed from single layer of polysilicon
The above mentioned problems with field emitter arrays and other problems are addressed by the present invention and will be understood by reading and studying the following specification. A structure... Read More
Inventors: Forbes, Leonard; Ahn, Kie Y.;, Assignee: Micron Technology, Inc. (Boise, ID) |
Matrix addressable display with electrostatic discharge protection
A field emission display includes an electrostatic discharge ("ESD") circuit coupled to discharge statically induced charge, thereby reducing damage to the field emission display. In one embodiment of... Read More
Inventors: Cathey, David A.; Hush, Glen E.; Ma, Manny K. F.; Dunham, Craig M.; Zimlich, David A.;, Assignee: Micron Technology, Inc. (Boise, ID) |
Composite self-aligned extraction grid and in-plane focusing ring, and method of manufacture
The present invention overcomes the limitations of the prior art by providing a flat panel display structure having a focus ring which lies in substantially the same plane as the extraction grid. The ... Read More
Inventors: Tjaden, Kevin W.; Williams, Terry N.;, Assignee: Micron Technology, Inc. (Boise, ID) |
MEMS 
