Method of visualizing minute particles
What is claimed is: 1. A method of determining the geometric dimension of a minute particle disposed on the top surface of a substrate, comprising: generating a plurality of coincident light beams arr... Read More
Inventors: Goshorn, Lawrence A.; Trozzi, Thomas O.; Ayoub, George T.; Newberg, Nicholas A.;, Assignee: Machine Vision Products, Inc. (Carlsbad, CA) |
Charge coupled device/charge super sweep image system and method for making
I claim: 1. A method for processing an image for a charge coupled device (CCD) image system comprising: sensing said image on an array of photosites, each of said photosites accumulating charge in res... Read More
Inventors: Hynecek, Jaroslav;, Assignee: |
Method for fabricating a radiation-emitting semiconductor chip based on III-V nitride semiconductor
It is accordingly an object of the invention to provide a method for fabricating a radiation-emitting semiconductor chip based on III V nitride semiconductor that overcomes the above-mentioned disadva... Read More
Inventors: Bader, Stefan; Fehrer, Michael; Hahn, Berthold; Harle, Volker; Lugauer, Hans-Ju;, Assignee: Osram GmbH (Regensburg, DE) |
Solid state CMOS imager using silicon-on-insulator or bulk silicon
Having thus described our invention, what we claim as new and desire to secure by Letters Patent is: 1. An apparatus for detecting an image comprising: an array of detector cells for sensing radiant e... Read More
Inventors: Dennard, Robert Heath; Wong, Hon-sum Philip;, Assignee: International Business Machines Corporation (Armonk, NY) |
Image sensor and method for fabricating the same
OF THE INVENTION FIG. 3 is a plane view showing a complementary metal-oxide semiconductor device (hereinafter referred as to CMOS) image sensor in accordance with a first preferred embodiment of the ... Read More
Inventors: Lee, Won-Ho;, Assignee: Hynix Semiconductor Inc. (Kyoungki-do, KR) |
Semiconductor device with upper portion of plugs contacting source and drain regions being a first self-aligned silicide
Accordingly, it is an object of the present invention to solve the aforementioned problem of the conventional techniques, and to provide a semiconductor device capable of simultaneously decreasing the... Read More
Inventors: Kajiyama, Takeshi;, Assignee: Kabushiki Kaisha Toshiba (Tokyo, JP) |
Aligning method of liquid crystal, process for producing liquid crystal device, and liquid crystal device produced by the process
In view of the above-mentioned circumstances, an object of the present invention is to provide an aligning method of a(chiral)smectic liquid crystal capable of alleviating a (layer) compression irregu... Read More
Inventors: Asao, Yasufumi; Hanyu, Yukio; Sato, Koichi; Terada, Masahiro; Noguchi, Koji;, Assignee: Canon Kabushiki Kaisha (Tokyo, JP) |
Transistor and semiconductor device
What is claimed is: 1. A transistor comprising: a transparent channel layer using any one of zinc oxide ZnO, zinc magnesium oxide Mg.sub.x Zn.sub.1-x O, zinc cadmium oxide Cd.sub.x Zn.sub.1-x O and ca... Read More
Inventors: Kawasaki, Masashi; Ohno, Hideo;, Assignee: Japan Science and Technology Corporation (Saitama, JP) |
Semiconductor circuit and method of fabricating the same
In view of the above-mentioned problems, an object of the present invention is to provide a forming method for a channel forming region from a crystalline semiconductor film with uniform crystallinity... Read More
Inventors: Kato, Kiyoshi; Atsumi, Tomoaki; Isobe, Atsuo;, Assignee: Semiconductor Energy Laboratory Co., Ltd. (Kanagawa-ken, JP) |
In-line wafer surface mapping
FIG. 2 is a plan view that illustrates an uneven substrate surface of an exemplary substrate. Alternatively stated, the substrate surface has a non-uniform topography. The topography of the uneven su... Read More
Inventors: Yang, Wan-Cheng;, Assignee: Taiwan Semiconductor Manufacturing Company (Hsin-Chu, TW) |
Light reflecting micromachined cantilever
The present invention is directed to overcoming one or more of the problems set forth above. Briefly summarized, according to one aspect of the present invention there is provided a radiation reflecto... Read More
Inventors: Furlani, Edward P.; Grande, William J.; Ghosh, Syamal K.;, Assignee: Eastman Kodak Company (Rochester, NY) |
Micro-electro mechanical device made from mono-crystalline silicon and method of manufacture therefore
It is therefore one object of the present invention to provide an improved micro-electro-mechanical device and method of manufacture therefore with a monolithic unitary structure of micro-sensors and ... Read More
Inventors: Wan, Chang-Feng;, Assignee: C.F. Wan Incorporated () |
Integrated optoelectronic devices having pop-up mirrors therein and methods of forming and operating same
It is therefore an object of the present invention to provide improved optoelectronic devices and methods of forming and operating same. It is another object of the present invention to provide optoel... Read More
Inventors: Wood, Robert L.; Hill, Edward A.;, Assignee: JDS Uniphase Corporation (San Jose, CA) |
Mechanical landing pad formed on the underside of a MEMS device
Although the following detailed description contains many specifics for the purposes of illustration, anyone of ordinary skill in the art will appreciate that many variations and alterations to the f... Read More
Inventors: Daneman, Michael J.; Behin, Behrang; Kiang, Meng-Hsiung;, Assignee: Onix Microsystems, Inc. (Fremont, CA) |
MEMS device and fabrication method thereof
In an effort to solve the above problems, it is a feature of an embodiment of the present invention to provide a MEMS device having enhanced reliability and a stable driving capability and a fabricati... Read More
Inventors: Lee, Eun-sung; Kim, Chung-woo; Song, In-sang; Kim, Jong-seok; Lee, Moon-chul;, Assignee: Samsung Electronics Co., Ltd. (Kyungki-do, KR) |
Differential interferometric light modulator and image display device
An aspect of the invention provides a novel light modulator, a scanner and projection optics as a system for displaying images to an observer. The system has several desirable features including high... Read More
Inventors: Bloom, David M.;, Assignee: Alces Technology, Inc. (Jackson, WY) |
MEMS with flexible portions made of novel materials
Micromechanical Structure Fabrication: Processes for microfabricating a MEMS device such as a movable micromirror and mirror array are disclosed in U.S. Pat. Nos. 5,835,256 and 6,046,840 both to Huib... Read More
Inventors: Reid, Jason S.;, Assignee: Reflectivity, INC (Sunnyvale, CA) |
Solid-state image pickup device and fabrication method thereof
An object of the present invention is to provide a solid-state image pickup device intended to increase the accumulated charge capacity, increase the area of a light receiving portion, and prevent a r... Read More
Inventors: Yamane, Junji; Hikichi, Kunihiko;, Assignee: Sony Corporation (Tokyo, JP) |
Optical component package
The invention is an optical package including an optical component assembly comprising a substrate and an optical component bonded to a major surface of the substrate. The substrate includes at least ... Read More
Inventors: Butrie, Timothy; Dautartas, Mindaugas Fernand; Scrak, Shaun P.;, Assignee: Lucent Technologies Inc. (Murray Hill, NJ) |
Method of fabricating a microelectronic device package with an integral window
OF THE INVENTION The present invention relates to a method of fabricating a package having an integral window, for packaging at least one microelectronic device. The present invention also relates to... Read More
Inventors: Peterson, Kenneth A.; Watson, Robert D.;, Assignee: Sandia Corporation (Albuquerque, NM) |
Circuitry for image sensors with avalanche photodiodes
An first object of the present invention is a in-pixel circuit architecture for APDs operating in the linear regime that takes advantage of a large number of in-pixel CMOS devices without loss of Fill... Read More
Inventors: Augusto, Carlos J. R. P.; Diniz, Pedro N. C.;, Assignee: Quantum Semiconductor LLC (San Jose, CA) |
Process for fabricating stiction control bumps on optical membrane via conformal coating of etch holes
One chronic problem associated with micro electromechanical system (MEMS) membranes in general is stiction. Specifically, if deflected sufficiently to contact an adjoining surface, the membranes can a... Read More
Inventors: Miller, Michael F.; Schmidt, Martin A.;, Assignee: Axsun Technologies, Inc. (Billerica, MA) |
Apparatus and method for forming a battery in an integrated circuit
The present invention provides an electrochemical structure within an integrated circuit, comprising: a semiconductor wafer; a layer of electronic devices on the semiconductor wafer, wherein the layer... Read More
Inventors: Ballantine, Arne W.; Groves, Robert A.; Lund, Jennifer L.; Nakos, James S.; Rice, Michael B.; Stamper, Anthony K.;, Assignee: International Business Machines Corporation (Armonk, NY) |
Single-poly 2-transistor based fuse element
The present invention achieves technical advantages as an electrically programmable transistor fuse having a source and drain disposed in a semiconductor substrate and further having a double-gate arr... Read More
Inventors: Kothandaraman, Chandrasekharan; Shum, Danny;, Assignee: Infineon Technologies AG (Munich, DE) |
Image sensor using a thin film photodiode above active CMOS circuitry
An image sensor comprising a first conductive layer, which is part of a circuitry of an integrated circuit device. A light sensing device is disposed vertically atop the first conductive layer and the... Read More
Inventors: Uppal, Jack S.; Fraser, David B.; Gospe, Stephen Bradford; Connolly, Kevin M.;, Assignee: Intel Corporation (Santa Clara, CA) |
Method for fabricating a semiconductor device
A means for solving the problems described above will now be explained with reference to FIG. 1. A translucent, insulating thermal conductive layer 2 is provided in close contact with the main surface... Read More
Inventors: Yamazaki, Shunpei; Arai, Yasuyuki;, Assignee: Semiconductor Energy Laboratory Co., Ltd. (Kanagawa-ken, JP) |
Manufacture method of pixel structure
The invention provides a manufacture method of pixel structure to improve the conventional method about the issue of increase of contact impedance between the pixel electrode and the drain electrode d... Read More
Inventors: Kao, Chin-Tzu; Su, Ta-Jung; Lin, Fu-Liang;, Assignee: Chunghwa Picture Tubes, LTD. (Taipei, TW) |
Zero-crossing triac and method
OF THE DRAWINGS FIG. 1 schematically illustrates a portion of a circuit suitable for implementing a zero-crossing triac 100. Triac 100 includes a gating section 113 and an output section having subst... Read More
Inventors: Heminger, David M.; Alonas, Paul G.; Coppock, William M.;, Assignee: Motorola, Inc. (Schaumburg, IL) |
Process for producing nitride semiconductor light-emitting device
Therefore, the present invention has been made in view of the above problems, and it is an object of the present invention to provide a process for producing a nitride semiconductor light-emitting dev... Read More
Inventors: Cho, Dong Hyun; Koike, Masayoshi; Hahm, Hun Joo;, Assignee: Samsung Electro-Mechanics Co., Ltd. (Kyungki-do, KR) |
Optical mirror system with multi-axis rotational control
An optical mirror system with multi-axis rotational control is disclosed. The mirror system includes an optical surface assembly, and at least one leg assembly coupled to the optical surface assembly.... Read More
Inventors: Hagelin, Paul Merritt; Fling, John J.;, Assignee: C Speed Corporation (Santa Clara, CA) |
MEMS 
