Composite self-aligned extraction grid and in-plane focusing ring, and method of manufacture
The present invention overcomes the limitations of the prior art by providing a flat panel display structure having a focus ring which lies in substantially the same plane as the extraction grid. The ... Read More
Inventors: Tjaden, Kevin W.; Williams, Terry N.;, Assignee: Micron Technology, Inc. (Boise, ID) |
Molecular memory & logic
Accordingly, the present invention is directed to a microelectronic device in which a closed cage molecule is used. These molecules are nanometers in size. That is, the molecules have specific sizes. ... Read More
Inventors: Bethune, Donald Stimson; Tiwari, Sandip;, Assignee: International Business Machines Corporation (Armonk, NY) |
Flexible metal foil substrate display and method for forming same
The present invention describes a method and process for the fabrication of displays on robust substrates made of metal foils. The invention describes the use of metal foil substrates for the fabricat... Read More
Inventors: Voutsas, Apostolos T.;, Assignee: Sharp Laboratories of America, Inc. (Camas, WA) |
Methods and apparatuses for monitoring and controlling mechanical or chemical-mechanical planarization of microelectronic substrate assemblies
The present invention is directed toward mechanical and/or chemical-mechanical planarization of semiconductor wafers, field emission displays and other microelectronic substrate assemblies. One method... Read More
Inventors: Hofmann, Jim; Sabde, Gundu M.; Kramer, Stephen J.; Moore, Scott E.;, Assignee: Micron Technology, Inc. (Boise, ID) |
Semiconductor device having a light transparent window and a method of producing same
An object of the present invention is to provide a semiconductor device having a light transparent window and a method for producing the device that is capable of suppressing a reduction in the yield ... Read More
Inventors: Yamawaki, Masao; Kondo, Takashi;, Assignee: Mitsubishi Denki Kabushiki Kaisha (Tokyo, JP) |
Paddleless molded plastic semiconductor chip package
According to the present invention, an improved plastic chip package has been developed, whereby the non-active back side of a packaged semiconductor chip is exposed and facing outside of the package.... Read More
Inventors: Hamburgen, William Riis; Fitch, John Stuart; Dordi, Yezdi Naval;, Assignee: |
Methods of forming thermo-mechanical sensor
With the foregoing in mind, the present invention advantageously provides an integrated CMOS sensor and associated methods for sensing temperature variations in a surrounding environment. The present ... Read More
Inventors: Chan, Tsiu Chiu; DeSilva, Melvin Joseph;, Assignee: STMicroelectronics, Inc. (Carrollton, TX) |
Semiconductor device with a protective sheet to affix a semiconductor chip
The present invention has been made in view of the above problems. An object of the present invention is to provide a semiconductor chip covered with a protective cap and capable of being manufactured... Read More
Inventors: Yoshihara, Shinji; Inomata, Sumitomo; Atsumi, Kinya; Sakai, Minekazu; Shimoyama, Yasuki; Fujii, Tetsuo;, Assignee: Denso Corporation (Kariya, JP) |
Image sensor having integrated thin film infrared filter
The present invention relates to an image sensor that has an integrated IR filter. In the following description, numerous specific details are provided to provide a thorough understanding of the embo... Read More
Inventors: Yamamoto, Katsumi;, Assignee: OmniVision International Holding Ltd (Cayman Islands, KN) |
Method of bonding metals, and method and apparatus for producing semiconductor integrated circuit device using said method of bonding metals
The TAB system and the flip chip system as mentioned above involve the following problems. First, the TAB system has been pointed out to have the problem of the increased manufacturing cost of TAB pac... Read More
Inventors: Nakao, Takashi; Emoto, Yoshiaki; Sekiguchi, Koichiro; Iketani, Masayuki; Sahara, Kunizo; Yoshida, Ikuo; Kohno, Akiomi; Horino, Masaya; Kamohara, Hideaki; Irie, Shouichi; Akasaki, Hiroshi; Otsuka, Kanji;, Assignee: Hitachi Ltd. (Tokyo, JP); Hitachi VLSI Engineering Corp. (Tokyo, JP) |
Packaging of high power semiconductor lasers
OF THE INVENTION It will be understood that the drawings are illustrative of the invention and are useful in the description thereof, but are not necessarily intended to depict the entire invention o... Read More
Inventors: Hall, Douglas W.; Jakobson, Paul A.; Sharps, Julia Alyson; Bartholomew, Roger F.;, Assignee: Corning Incorporated (Corning, NY) |
Flat diffraction grating light valve
A diffraction grating light valve modulates an incident beam of light. A plurality of elongated elements each have a reflective surface. The elongated elements are suspended with their respective ends... Read More
Inventors: Bloom, David M.; Corbin, Dave B.; Banyai, William C.; Straker, Bryan P.;, Assignee: Silicon Light Machines (Sunnyvale, CA) |
Chemically stabilized light selective element for imaging applications
An imaging system is disclosed. The imaging system has an imaging sensor providing sensor signals in response to incident light and control signals, control circuitry configured to generate control si... Read More
Inventors: Bawolek, Edward J.; Sengupta, Kabul;, Assignee: Intel Corporation (Santa Clara, CA) |
Tungsten coating for improved wear resistance and reliability of microelectromechanical devices
The present invention relates to a wear-resistant coating formed on at least one semiconductor surface of a moveable member in a microelectromechanical (MEM) device, comprising a 5-50-nanometer-thick ... Read More
Inventors: Fleming, James G.; Mani, Seethambal S.; Sniegowski, Jeffry J.; Blewer, Robert S.;, Assignee: Sandia Corporation (Albuquerque, NM) |
Semiconductor process
According to a First aspect of the present invention there is provided a method of making a photonic band gap material, the method comprising the steps of; (a) growing an epitaxial layer of a first se... Read More
Inventors: Pabla, Arbinder S;, Assignee: British Telecommunications (London, GB) |
Optical device having sensing TGTs and switching TFTs with different active layer thickness
Accordingly, the present invention is directed to a TFT type optical detecting sensor that substantially obviates one or more of problems due to limitations and disadvantages of the prior art. An obje... Read More
Inventors: Joo, In-Su;, Assignee: LG. Philips LCD Co., Ltd. (Seoul, KR) |
Infrared bolometer and method for manufacturing same
It is, therefore, an object of the present invention to provide a three-level infrared bolometer having an increased fill factor and an improved absorbance and a manufacturing method thereof. In accor... Read More
Inventors: Yong, Yoon-Joong;, Assignee: Daewoo Electronics Co., Ltd. (Seoul, KR) |
Solution processed devices
OF THE INVENTION Preferred fabrication methods described herein permit the fabrication of an all-organic, solution-processed thin-film transistor, in which none of the layers is converted or cross-li... Read More
Inventors: Sirringhaus, Henning; Kawase, Takeo; Friend, Richard Henry;, Assignee: Plastic Logic Limited (Cambridge, GB) |
Method for fabricating a microelectromechanical bearing
It is therefore an object of the present invention to provide improved electromechanical devices and methods. It is another object of the present invention to provide an electromechanical rotating pla... Read More
Inventors: Dhuler, Vijayakumar R.; Koester, David A.; Walters, Mark D.; Markus, Karen W.;, Assignee: MCNC (Research Triangle Park, NC) |
Three dimensional thin film devices and methods of fabrication
It is a general object of the invention to provide methods of manufacturing devices of three-dimensional shapes using two-dimensional micro-electro-mechanical techniques. Another object is to provide ... Read More
Inventors: Gupta, Vikas; Johnson, A. David; Menchaca, Letecia; Martynov, Valery;, Assignee: TiNi Alloy Company (San Leandro, CA) |
Process for fabricating a high quality CMOS image sensor
It is an object of this invention to fabricate an image sensor cell with a high S/N ratio, and low dark current generation. It is another object of this invention to form the N type element, of the ph... Read More
Inventors: Chiang, An-Min; Lee, Chi-Hsiang; Yeh, Wei-Kun; Yang, Hua-Yu;, Assignee: Taiwan Semiconductor Manufacturing Company (Hsin-Chu, TW) |
Method for manufacturing semiconductor laser device
The present invention has been made to overcome the above-described drawbacks and disadvantages of the related art. It is an object of the present invention to provide a method for manufacturing a sem... Read More
Inventors: Takiguchi, Tohru;, Assignee: Mitsubishi Denki Kabushiki Kaisha (Tokyo, JP) |
Electrical devices comprising conductive polymers
I have now found that electrical devices which exhibit PTC behavior, have low inrush characteristics, have resistance stability, and can be designed to produce uniform power distribution over the surf... Read More
Inventors: Friel, Kevin J.;, Assignee: Raychem Corporation (Menlo Park, CA) |
Semiconductor memory devices having dummy active regions
A purpose of the present invention is to provide a semiconductor device forming process that is suitable for repeatably forming reliable active regions. Another purpose of the present invention is to ... Read More
Inventors: Kim, Hong-Soo; Choi, Jung-Dal; Sel, Jong-Sun; Choi, Yong-Joon;, Assignee: Samsung Electronics Co., Ltd. (Suwon, KR) |
Linear array image sensor with thin-film light emission element light source
It is therefore an object of the present invention to provide a low cost linear array image sensor with a very small dimension. Another object of the present invention is to provide a linear array ima... Read More
Inventors: Codama, Mitsufumi; Arai, Michio;, Assignee: TDK Corporation (Tokyo, JP); Semiconductor Energy Laboratory Co., Ltd. (Kanagawa, JP) |
Projection type display device with image pickup function and communication system
An object of the present invention is, in a lecture using an OHP as a means for providing data, to provide a method other than the foregoing methods (1) to (3) as means for recording the content of th... Read More
Inventors: Yamazaki, Shunpei;, Assignee: Semiconductor Energy Laboratory Co., Ltd. (Kanagawa-ken, JP) |
Optical sensor
The present invention has been made in view of the above, and the present invention provides an entirely novel structure with a higher level of photosensitivity and operation rate by skillfully combin... Read More
Inventors: Zhang, Hongyong; Sakakura, Masayuki;, Assignee: Semiconductor Energy Laboratory Co., Ltd. (Kanagawa-ken, JP) |
Electronic display device having an active matrix display panel
An object of the present invention is to overcome the foregoing problems, and to provide a display device using a novel semiconductor device which includes a pixel matrix, an image sensor, and a perip... Read More
Inventors: Zhang, Hongyong; Sakakura, Masayuki; Kuwabara, Hideaki;, Assignee: Semiconductor Energy Laboratory Co., Ltd. (Kanagawa-ken, JP) |
Active matrix display device having a common substrate and method of manufacturing the same
An object of the present invention is to provide an intelligent display device which can solve the above problems and has an image pick-up function and a display function by providing an image sensor ... Read More
Inventors: Zhang, Hongyong; Sakakura, Masayuki;, Assignee: Semiconductor Energy Laboratory Co., Ltd. (Kanagawa, JP) |
Solar cell substrate with thin film polysilicon
It is an object of the invention to provide a novel solar cell substrate with thin film polysilicon. By having a patternable thermal conducting layer and at least two different thermal conducting laye... Read More
Inventors: Huang, Chorng-Jye; Kuo, Lee Ching; Yeh, Jyi Tyan; Huang, Chien Sheng; Liau, Leo C. K.; Lin, Shih-Chen; Chen, Cheng-Ting; Jeng, Feng-Cheng;, Assignee: Industrial Technology Research Institute (Hsinchu, TW) |
MEMS 
