Monolithic in-based III-V compound semiconductor focal plane array cell with single stage CCD output
OF THE PREFERRED EMBODIMENTS FIG. 1 illustrates a focal plane cell embodying the present invention. Photons entering through a photogate 1 generate charge which is collected in a potential well under... Read More
Inventors: Fossum, Eric R.; Cunningham, Thomas J.; Krabach, Timothy N.; Staller, Craig O.;, Assignee: The United States of America as represented by the Administrator of the (Washington, DC) |
Cross-talk free, low-noise optical amplifier
It is an object of the present invention to use a segmented transverse lasing field to reduce crosstalk in optical amplifiers in wavelength divison multiplexed systems. it is another object of the inv... Read More
Inventors: Dijaili, Sol P.; Patterson, Frank G.; Deri, Robert J.;, Assignee: The Regents of the University of California (Oakland, CA) |
Grating coupled vertical cavity optoelectronic devices
A semiconductor laser or detector has been invented which is a vertical cavity device constructed with a dual dielectric top Distributed Bragg Reflector (DBR) mirror wherein a diffraction grating in t... Read More
Inventors: Taylor, Geoff W.;, Assignee: Taylor; Geoff W. (Glastonbury, CT) |
Multibeam semiconductor laser, semiconductor light-emitting device and semiconductor device
What is claimed is: 1. A multi-beam semiconductor laser including nitride III-V compound semiconductor layers formed over one major surface of a substrate to form a laser structure, and including an a... Read More
Inventors: Tojo, Tsuyoshi; Yabuki, Yoshifumi; Ansai, Shinichi; Hino, Tomonori; Goto, Osamu; Fujimoto, Tsuyoshi; Matsumoto, Osamu; Takeya, Motonobu; Oofuji, Yoshio;, Assignee: |
Method for manufacturing CMOS image sensor
OF THE PREFERRED EMBODIMENT Reference will now be made in detail to embodiments of the invention, examples of which are illustrated in the accompanying drawings. Wherever possible, the same reference... Read More
Inventors: Lim, Keun Hyuk;, Assignee: Dongbu Electronics Co., Ltd. (Seoul, KR) |
Airbag system using three-dimensional acceleration sensor
The present invention relates to a three-dimensional acceleration sensor which can be used for an airbag actuated in the event of a collision of such a moving body as an automobile and for an active s... Read More
Inventors: Yokota, Yoshihiro; Koide, Akira; Matsumoto, Masahiro; Hayashi, Masahide;, Assignee: Hitachi, Ltd. (JP) |
Method for fabricating a head/slider assembly integrated with a track-following micro actuator
It is, therefore, a primary object of the present invention to provide a head/slider assembly integrated therein a track-following micro actuator to allow it to be used in a HDD system of a very high ... Read More
Inventors: Lee, Hyo-Jung; Seong, Woo-Kyeong;, Assignee: Institute for Advanced Engineering (Seoul, KR) |
Low voltage micro-mirror array light beam switch
OF PREFERRED EMBODIMENTS OF THE INVENTION FIG. 1a discloses a sample array of 16 micro-mirrors 6 with actuators 1a on silicon substrate 5. FIG. 1b is an isometric view of the array of FIG. 1a. FIG. 1... Read More
Inventors: Kane, Jonathan S.; Hughes, Gareth A.;, Assignee: Computer Optics Inc (Hudson, NH) |
Long-wavelength semiconductor light emitting device and its manufacturing method
It is therefore an object of the present invention to provide a long-wavelength semiconductor light emitting device having excellent characteristics and a long lifetime, as well as its manufacturing m... Read More
Inventors: Hino, Tomonori; Narui, Hironobu; Mitomo, Jugo;, Assignee: Sony Corporation (Tokyo, JP) |
Method of producing a diaphragm on a substrate
We claim: 1. A method of producing on a substrate a diaphragm which is electrically isolated from the substrate, comprising the steps of: (a) obtaining a substrate having thereon a diaphragm comprisin... Read More
Inventors: Evans, Alan G. R.; Farooqui, Mohammed M.;, Assignee: Spectrol Reliance Limited (Swindon, GB2) |
MEMS sensor structure and microfabrication process therefor
The present invention provides a micro-electro-mechanical sensor structure with an improved design comprising rigid interdigitated projections forming capacitive plate elements and, in a preferred emb... Read More
Inventors: Christenson, John Carl; Staller, Steven Edward; Freeman, John Emmett; Chase, Troy Allan; Healton, Robert Lawrence; Rich, David Boyd;, Assignee: Delphi Technologies, Inc. (Troy, MI) |
Electromechanical memory array using nanotube ribbons and method for making same
Preferred embodiments of the invention provide new electromechanical memory arrays and methods for making same. In particular, electromechanical memory cells are created that operate analogously to t... Read More
Inventors: Segal, Brent M.; Brock, Darren K.; Rueckes, Thomas;, Assignee: Nantero, Inc. (Woburn, MA) |
Silicon light emitting device and a method of making the device
OF THE INVENTION Referring to the Figures, a light emitting device 10 comprises a substrate 12 having first and second major surfaces 14 and 16 respectively; a region 18 of opposite conductivity type... Read More
Inventors: Pankove, Jacques I.; Wu, Chung P.;, Assignee: RCA Corporation (Princeton, NJ) |
Trench isolation method
Therefore, it is an object of the present invention to provide a trench isolation method which avoids the need for a densification process for densifying the insulating layer formed in the trench. Acc... Read More
Inventors: Lee, Han-Sin; Park, Moon-Han;, Assignee: Samsung Electronics Co., Ltd. (KR) |
Optical device, optical module, semiconductor apparatus and its manufacturing method, and electronic apparatus
It is an object of the invention to provide a method of achieving an electrical connection between stacked semiconductor substrates with ease and high reliability as well as attaining miniaturization.... Read More
Inventors: Imaoka, Norio;, Assignee: Seiko Epson Corporation (Tokyo, JP) |
Method for producing a radiation-emitting semiconductor chip
It is accordingly an object of the invention to provide a method for producing a radiation-emitting semiconductor chip that overcomes the above-mentioned disadvantages of the prior art devices and met... Read More
Inventors: Eisert, Dominik; rle, Volker; Frank (Mü, nchen, DE); Zehnder, Ulrich;, Assignee: Osram GmbH (Munich, DE) |
Manufacture of MEMS structures in sealed cavity using dry-release MEMS device encapsulation
In general, the invention disclosed refers to gas phase release of any number of microstructure layers whose movement is independent or coupled and which are encapsulated in the thin film seal layer.... Read More
Inventors: Carley, L. Richard;, Assignee: IC Mechanics, Inc. (Pittsburgh, PA) |
Magnetoresistive element and magnetic memory device
OF THE INVENTION Basic structures of magnetoresistive elements according to the present invention will be described hereinafter, referring to FIGS. 1 to 4. FIG. 1 shows a first magnetoresistive eleme... Read More
Inventors: Inomata, Koichiro; Nakajima, Kentaro; Saito, Yoshiaki; Sagoi, Masayuki; Kishi, Tatsuya;, Assignee: Kabushiki Kaisha Toshiba (Kawasaki, JP) |
Method of fabricating DRAM capacitor
It is therefore the object of the invention to provide an improved and simplified method of fabricating DRAM capacitors. This method uses tungsten nitride as the MIM capacitor structure. The invention... Read More
Inventors: Huang, Kuo-Tai; Hsieh, Wen-Yi; Yew, Tri-Rung;, Assignee: United Microelectronics Corp. (Hsinchu, TW) |
8-beam bridge-type silicon acceleration sensor and the fabricating method thereof
OF THE PREFERRED EMBODIMENT For a better understanding of the present invention, together with other and further objects, advantages and capabilities thereof, reference is made to the following discl... Read More
Inventors: Lee, Jong H.;, Assignee: Kyung Pook National University Sensor Technology Research Center (both of, KR); Mando Machinery Corporation (both of, KR) |
Transducer having a resonating silicon beam and method for forming same
The invention provides apparatus including a force transducer having a resonating beam that is formed in a silicon wafer and which apparatus is of relatively simple and inexpensive construction. As us... Read More
Inventors: Seefeldt, James D.; Mattes, Michael F.;, Assignee: SSI Technologies, Inc. (Janesville, WI) |
Method of manufacturing an electronic part having an air-bridge interconnection
In view of the aforementioned problems, an object of the present invention is to provide an electronic part having an air-bridge interconnection in which an air-bridge interconnection body is flat, ha... Read More
Inventors: Nakagawara, Osamu; Kobayashi, Masato; Yoshino, Yukio;, Assignee: Murata Manufacturing Co., Ltd. (JP) |
High frequency semiconductor device
A high frequency semiconductor device of the present invention includes: a substrate having a substantially flat principal surface, with a predetermined circuit pattern including at least an input lin... Read More
Inventors: Maeda, Masahiro; Nakamura, Morio; Yoshida, Takayuki; Yamazaki, Masazumi;, Assignee: Matsushita Electric Industrial Co., Ltd. (Osaka, JP) |
Method for manufacturing an SOI wafer
The present invention, in one aspect, provides a method for manufacturing SOI wafers, which exploits the intrinsic advantages of microfabrication technologies, but at competitive costs. This method ca... Read More
Inventors: Barlocchi, Gabriele; Villa, Flavio Francesco;, Assignee: STMicroelectronics S.R.L. (Agrate Brianza, IT) |
Polymer based tunneling sensor
The present invention includes a process for fabricating a polymer based micro-machine by the following steps. A mold of a design is formed through a lithography process. The design is transferred to ... Read More
Inventors: Cui, Tianhong; Wang, Jing; Zhao, Yongjun;, Assignee: Louisiana Tech University Foundation, Inc. (Ruston, LA) |
Solid-state imaging device
It is an object of the present invention to provide a highly sensitive solid-state imaging device and a method for manufacturing such a highly sensitive solid-state imaging device In order to attain t... Read More
Inventors: Kuriyama, Toshihiro; Tanaka, Syouji;, Assignee: Matsushita Electronics Corporation (Osaka, JP) |
Process for making light waveguide element
Accordingly, it is an object of the invention to provide a process for making a light waveguide element enabling precise optical axis alignment. According to the invention there is provided a process ... Read More
Inventors: Uno, Yutaka;, Assignee: Oki Electric Industry, Co., Ltd. (Tokyo, JP) |
Focal plane arrays in type II-superlattices
OF THE DRAWINGS The active layers of photovoltaic and photoconductive type-II detectors of the subject invention are made from superlattices with a type-II band alignment which in turn can be formed ... Read More
Inventors: Razeghi, Manijeh;, Assignee: MP Technologies, LLC (Wilmette, IL) |
Method for determining a preceding wafer, method for determining a measuring wafer, and method for adjusting the number of wafers
The first object of the present invention is determining a preceding wafer so that by using the preceding wafer the processing results of a process are within specifications for a majority of inner-lo... Read More
Inventors: Ishizuka, Hiroaki; Matsumoto, Shigeru;, Assignee: Matsushita Electric Industrial Co., Ltd. (Osaka, JP) |
Thin film actuated mirror array in an optical projection system
Accordingly, considering the conventional problems as described above, it is an object of the present invention to provide a thin film actuated mirror array in an optical projection system effectively... Read More
Inventors: Hwang, Kyu-Ho;, Assignee: Daewoo Electronics Co., Ltd. (Seoul, KR) |
MEMS 
