Mechanical grating device
It is an object of the present invention to provide a mechanical grating device which has equal actuation conditions for the deformable elements in order to improve the diffraction efficiency of the d... Read More
Inventors: Hawkins, Gilbert A.; Lebens, John A.; Anagnostopoulos, Constantine N.; Brazas, Jr., John C.; Kruschwitz, Brian E.;, Assignee: Eastman Kodak Company (Rochester, NY) |
Reduced formation of asperities in contact micro-structures
A device, in accordance with the embodiments of the invention, comprises one or more micro-structures suspended over a substrate. The micro-structures can be, but are not limited to, cantilevers, ribb... Read More
Inventors: Hunter, James; Staker, Bryan;, Assignee: Silicon Light Machines, Inc. (Sunnyvale, CA) |
Low Cu percentages for reducing shorts in AlCu lines
One object of the present invention is to provide an AlCu metallization scheme for blanket metal deposition layers subjected to reactive ion etching that lessens or eliminates poor functional yield, a... Read More
Inventors: Iggulden, Roy C.; Shafer, Padraic; Wong, Kwong Hon; Iwatake, Michael M.; Strane, Jay W.; Goebel, Thomas; Miura, Donna D.; Dziobkowski, Chet; Robl, Werner; Hughes, Brian;, Assignee: Infineon Technologies AG (Munich, DE); International Business Machines Corporation (Armonk, NY) |
Avalanche photo diode with quantum well layer
It is an object of the present invention to provide an avalanche photodiode with a quantum well layer in which a thin film, periodic multilayer structure composed of two different semiconductors is fo... Read More
Inventors: Matsushima, Yuichi; Sakai, Kazuo; Kushiro, Yukitoshi; Akiba, Shigeyuki; Noda, Yukio; Utaka, Katsuyuki;, Assignee: Kokusai Denshin Denwa Kabushiki Kaisha (Tokyo, JP) |
Avalanche photodiode having a multiplication layer with superlattice
It is the object of the present invention to provide an avalanche photodiode in which an InAlAs/InGaAs superlattice structure is used as a multiplication layer in order to overcome the above-mentioned... Read More
Inventors: Yoo, Ji-Beom; Park, Chan-Yong; Kim, Hong-Man;, Assignee: Electronics and Telecommunications Research Institute (KR); Korea Telecommunication Authority (KR) |
Staircase avalanche photodiode
It is the principal object of the present invention to solve the above-mentioned problems and to provide a staircase APD of lower noise and faster response. A staircase APD according to the present in... Read More
Inventors: Tsuji, Masayoshi; Makita, Kikuo;, Assignee: NEC Corporation (Tokyo, JP) |
Semiconductor photo detector containing crystalline amplification layer
With the forgoing in view, the present invention has been completed. An object of the present invention is to provide a semiconductor photo detector having a high amplification factor at low driving v... Read More
Inventors: Nakamura, Takeshi; Kyozuka, Shinya; Yamada, Takayuki; Miyamoto, Yasuaki;, Assignee: Fuji Xerox Co., Ltd. (Tokyo, JP) |
Vertical optical path structure for infrared photodetection
The present invention SiGe optical path structure absorbs IR wavelength light that is normal to a silicon substrate surface and parallel to the SiGe/Si heterojunction interface, increasing the length ... Read More
Inventors: Tweet, Douglas J.; Lee, Jong-Jan; Maa, Jer-Shen; Hsu, Sheng Teng;, Assignee: Sharp Laboratories of America, Inc. (Camas, WA) |
Acoustic surface wave devices
What is claimed is: 1. An acoustic surface wave resonator device comprising, a substrate having a surface layer of piezoelectric material, a pair of spaced apart reflectors on the piezoelectric surfac... Read More
Inventors: Mitchell, Richard F.;, Assignee: U.S. Philips Corporation (New York, NY) |
Surface acoustic wave device with a resistor thin film to remove pyroelectric effect charges
It is an object of the present invention to provide a surface acoustic wave device in which generation of noise due to the pyroelectric effect of the piezoelectric substrate is suppressed. In order to... Read More
Inventors: Yamada, Yoshihiro; Yamamoto, Yasushi;, Assignee: NEC Corporation (Tokyo, JP) |
Tunable nanomasks for pattern transfer and nanocluster array formation
It should be noted that all references cited in this Detailed Description are incorporated herein by reference, in their entirety. In accordance with the present invention, we have used new methods o... Read More
Inventors: Winningham, Thomas Andrew; Douglas, Kenneth;, Assignee: The Regents of the University of Colorado (Boulder, CO) |
Flip-chip light emitting diode and fabricating method thereof
One aspect of the present invention is to provide a flip-chip LED with the superiority of the flip-chip structure, and to efficiently increase the light output intensity of the LED, the product qualit... Read More
Inventors: Tsai, Tzong-Liang; Chang, Chih-Sung; Chen, Tzer-Perng;, Assignee: Epistar Corporation (Hsinchu, TW) |
Method for photographically improving the resolution of screen printed photopolymer images
I claim: 1. The process of improving resolution of printed photopolymer patterns of low resolution because of smears at the pattern edges, comprising the steps of: printing on a substrate surface a pa... Read More
Inventors: Sullivan, Donald F.;, Assignee: |
High resolution printed circuits formed in photopolymer pattern indentations overlaying printed wiring board substrates
I claim: 1. The process of producing high resolution closely spaced printed circuits on a substrate which may have surface irregularities, comprising the steps of: forming a patterned polymer layer ov... Read More
Inventors: Sullivan, Donald F.;, Assignee: |
Method of manufacturing a three-dimensional plastic article
Briefly, according to the invention, there is provided a method for producing a three dimensional plastic article having an insert. The three dimensional plastic article is formed by exposing a medium... Read More
Inventors: Reiff, David E.; Dorinski, Dale W.; Hunt, Stephen D.;, Assignee: Motorola, Inc. (Schaumburg, IL) |
Method of forming a three-dimensional printed circuit assembly
Briefly, according to the invention, there is provided a method of making a three-dimensional printed circuit assembly. A substrate is first formed from a photoactive polymer that is capable of alteri... Read More
Inventors: Juskey, Frank J.; Suppelsa, Anthony B.; Dorinski, Dale W.;, Assignee: Motorola, Inc. (Schaumburg, IL) |
Multilayer circuit board having microporous layers and method for making same
Referring to FIG. 1, the first step in constructing a representative single-sided printed wiring board (PWB) using mass seeding is to hot-roller laminate a layer 10 of photoprocessable material appro... Read More
Inventors: Grandmont, Paul E.; Lake, Harold; Anderson, Richard A.;, Assignee: The Foxboro Company (Foxboro, MA) |
Method for mounting integrated circuit chips on a mini-board
The present invention allows an integrated circuit chip die or dice to be easily mounted onto a printed circuit board substrate. The present invention accomplishes this by mounting the chip die onto a... Read More
Inventors: Rostoker, Michael D.; Pasch, Nicholas F.;, Assignee: LSI Logic Corporation (Milpitas, CA) |
Method and apparatus for testing unpackaged semiconductor dice
In accordance with the present invention, an improved method and apparatus for testing unpackaged semiconductor dice are provided. The method includes forming an interconnect-alignment fixture for an ... Read More
Inventors: Farnworth, Warren; Akram, Salman; Hembree, David;, Assignee: Micron Technology, Inc. (Boise, ID) |
Method of combining metal and ceramic inserts into stereolithography components
In accordance with the teachings of the present invention, a stereolithography process for developing a part is disclosed in which inserts of a non-photopolymer material are included within the result... Read More
Inventors: O'Connor, Kurt Francis; Nohns, Dennis Carl; Chattin, William Allen;, Assignee: Delco Electronics Corporaiton (Kokomo, IN) |
Semiconductor device
OF THE PREFERRED EMBODIMENTS Preferred embodiments of the present invention will now be explained in detail with reference to the drawings. FIG. 1 and FIG. 2 show the configuration of a first embodim... Read More
Inventors: Ishida, Yoshihiro; Ohmori, Yoshinobu; Ikeda, Ienobu; Terashima, Kazuhiko; Toyoda, Takeshi;, Assignee: Citizen Watch Co., Ltd. (Tokyo, JP) |
Optical memory device and a method for manufacturing thereof
It is a major object of the present invention to provide a novel method of manufacturing an optical memory device, particularly such a method which is suitable for mass production of the optical memor... Read More
Inventors: Glushko, Boris;, Assignee: O.M.D. Optical Memory Devices, Ltd. (Rehovot, IL) |
Semiconductor package and manufacturing method thereof
The present invention was carried out to solve these problems. That is, an object of the present invention is to provide a semiconductor package which is thin, compact and highly reliable. Further, an... Read More
Inventors: Nakazawa, Takahito; Sugizaki, Yoshiaki;, Assignee: Kabushiki Kaisha Toshiba (Kawasaki, JP) |
Precision spray processes for direct write electronic components
OF THE INVENTION In accordance with the present invention, there are provided methods for direct material deposition on a substrate, said methods comprising: (a) passing one or more feedstocks throug... Read More
Inventors: Miller, W. Doyle; Keicher, David M.; Essien, Marcelino;, Assignee: Optomec Design Company (Albuquerque, NM) |
Multiple beams and nozzles to increase deposition rate
OF THE INVENTION A schematic of the preferred embodiment of this invention is given in FIG. 1, showing the position of the invention within a direct material deposition system. The system includes: a... Read More
Inventors: Keicher, David M.; Miller, W. Doyle;, Assignee: Optomec Design Company (Albuquerque, NM) |
Optical memory device and a method for manufacturing thereof
It is a major object of the present invention to provide a novel method of manufacturing an optical memory device, particularly such a method which is suitable for mass production of the optical memor... Read More
Inventors: Glushko, Boris; Levich, Eugene;, Assignee: TriDStore IP, L.L.C. (New Castle, DE) |
Integrated circuit structure having a flip-chip mounted photoreceiver
In accordance with the present invention, an IC package structure includes a photoreceiver flip-chip mounted to the package substrate in order to provide an IC package structure having a reduced size ... Read More
Inventors: Masumoto, Kenji;, Assignee: Texas Instruments Incorporated (Dallas, TX) |
High-density electronic package, and method for making same
What is claimed is: 1. An electronic package having contacts adapted to be attached to a substrate, said electronic package comprising: at least one electronic device, said electronic device having a ... Read More
Inventors: Chung, Kevin Kwong-Tai;, Assignee: Amerasia International Technology, Inc. (Princeton Junction, NJ) |
Forming structures from CAD solid models
The present invention pertains generally to a class of material deposition processes that use a laser to heat and, subsequently, fuse powder materials into solid layers. Since these layers can be depo... Read More
Inventors: Keicher, David M.; Bullen, James L.; Gorman, Pierrette H.; Love, James W.; Dullea, Kevin J.; Smith, Mark E.;, Assignee: Optomec Design Company (Albuquerque, NM) |
Stereolithographically fabricated conductive elements, semiconductor device components and assemblies including such conductive elements, and methods
The present invention includes stereolithographically fabricated conductive elements. Accordingly, the conductive elements of the present invention may have one or more layers of conductive material. ... Read More
Inventors: Williams, Vernon M.;, Assignee: Micron Technology, Inc. (Boise, ID) |
MEMS 
