Interposer and methods for fabricating same
OF THE INVENTION The Interposer FIGS. 1, 1A, 1B, and 2 depict an exemplary interposer 100 of the present invention. Interposer 100 includes an interposer substrate 110 with contact pads 102 on a top ... Read More
Inventors: Akram, Salman; Wood, Alan G.; Farnworth, Warren M.;, Assignee: Micron Technology, Inc. (Boise, ID) |
Energy beam patterning of protective layers for semiconductor devices
According to the present invention, a method for forming resist or other protective patterns on a substrate is disclosed using exposure of a layer of heat- or selected wavelength-sensitive protective ... Read More
Inventors: Farnworth, Warren M.;, Assignee: Micron Technology, Inc. (Boise, ID) |
Stereolithographically fabricated conductive elements, semiconductor device components and assemblies including such conductive elements, and methods
The present invention includes stereolithographically fabricated intermediate conductive elements. Accordingly, the intermediate conductive elements of the present invention may have one or more layer... Read More
Inventors: Williams, Vernon M.;, Assignee: Micron Technology, Inc. (Boise, ID) |
Multiple-gate MOSFET device with lithography independent silicon body thickness and methods for fabricating the same
The following presents a simplified summary in order to provide a basic understanding of one or more aspects of the invention. This summary presents one or more concepts of the invention in a simplifi... Read More
Inventors: Chambers, James Joseph;, Assignee: Texas Instruments Incorporated (Dallas, TX) |
Quantum efficiency improvements in active pixel sensors
The present invention describes a technique that improves quantum efficiency in a CMOS sensor. This is done according to the present invention using different techniques. A first technique describes i... Read More
Inventors: Fossum, Eric R.;, Assignee: Photobit Corporation (Pasadena, CA) |
Pixel cell with high storage capacitance for a CMOS imager
The present invention provides a source follower gate with improved storage capacitance formed in a semiconductor substrate. The source follower gate has a large gate area to increase the storage capa... Read More
Inventors: Rhodes, Howard E.;, Assignee: Micron Technology Inc. (Boise, ID) |
Image scanning circuitry with row and column addressing for use in electronic cameras
OF A PREFERRED EMBODIMENT Those of ordinary skill in the art will realize that the following description of the present invention is illustrative only and not in any way limiting. Other embodiments o... Read More
Inventors: Lyon, Richard F.; Turner, Richard M.; Merrill, Richard B.;, Assignee: Foveon, Inc. (Santa Clara, CA) |
Method for manufacturing an optical module and optical module
The present invention provides for an improved method for manufacturing an optical module as claimed in the independent claims. Preferred embodiments of the invention are set forth in the dependent cl... Read More
Inventors: Kabs, Joachim; Karla, Ingo;, Assignee: Avanex Corporation (Fremont, CA) |
Masking layer having narrow isolated spacings and the method for forming said masking layer and the method for forming narrow isolated trenches defined by said masking layer
This invention utilizes a primary mask of photoresist, created using conventional photolithography, to create the inorganic mask of the invention, having a vertical film layer segment defining narrow ... Read More
Inventors: Roberts, Ceredig; Reinberg, Alan R.;, Assignee: Micron Technology, Inc. (Boise, ID) |
Process for manufacture of microoptomechanical structures
Inherent thin film properties of materials limit many surface micromachining processes. For example, variability of materials properties in polysilicon thin films (such as, for example, Young's modulu... Read More
Inventors: Kubby, Joel A.; Chen, Jingkuang; Tran, Alex T.;, Assignee: Xerox Corporation (Stamford, CT) |
Piezoelectric on semiconductor-on-insulator microelectromechanical resonators
Embodiments of the present invention provide piezoelectric resonators. Briefly described, one embodiment of the piezoelectric resonator, among others, includes a resonating member having a bi-directio... Read More
Inventors: Ayazi, Farrokh; Piazza, Gianluca; Abdolvand, Reza; Ho, Gavin Kar-Fai; Humad, Shweta;, Assignee: Georgia Tech Research Corporation (Atlanta, GA) |
Replication of surface features from a master model to an amorphous metallic article
The present invention provides a method for replicating surfaces and replicas prepared by this approach, and in particular for replicating fine-scale features of a size of one micrometer or smaller. T... Read More
Inventors: Johnson, William L.; Bakke, Eric; Peker, Atakan;, Assignee: Amorphous Technologies International (Laguna Niguel, CA); California Institute of Technology (Pasadena, CA) |
MEMS optical cross-connect switch
The present invention provides for a microelectromechanical structure capable of switching optical fibers from an input fiber to one of two or more output fibers. In one embodiment, the MEMS optical c... Read More
Inventors: Wood, Robert L.; Hill, Edward A.; Mahadevan, Ramaswamy;, Assignee: JDS Uniphase Corporation (San Jose, CA) |
Fluid-encapsulated MEMS optical switch
The present invention addresses the needs discussed above. A movable MEMS mirror is disposed in a trench that is filled with a non-conducting, low-viscosity, index-matching fluid. The index-matching f... Read More
Inventors: Edwards, Victoria Ann; Eid, Bernard; Brophy, Christopher Philip; Chamberlain, Darol;, Assignee: Corning Incorporated (Corning, NY) |
MEMS optical switch with a notched latching apparatus for improved mirror positioning and method of fabrication thereof
OF PREFERRED EMBODIMENTS OF THE INVENTION The present invention is embodied in a notched latching mechanism apparatus and a method of fabricating the same. In one embodiment, the invention includes a... Read More
Inventors: Fan, Li;, Assignee: OMM, Inc. (San Diego, CA) |
Processes for hermetically packaging wafer level microscopic structures
The present invention is directed generally to a process for packaging a microscopic structure to yield a cavity-containing microstructure such as, for example, a microelectromechanical system (MEMS) ... Read More
Inventors: Cheung, Kin P.;, Assignee: Rutgers, The State University of New Jersey (New Brunswick, NJ) |
Method for forming LED by a substrate removal process
Some sample embodiments of the invention will now be described in greater detail. Nevertheless, it should be recognized that present invention can be practiced in a wide range of other embodiments be... Read More
Inventors: Guo, Jan-Der; Tsai, Wen-Chung; Chen, Tsung-Yu; Huang, Shao-Hua;, Assignee: Advanced Epitaxy Technology (Hukou, TW) |
Method of fabricating a surface shape recognition sensor
The present invention has been made to solve the above problem, and has as its object to reliably perform stable, high-sensitivity surface shape detection without causing damage due to static electric... Read More
Inventors: Machida, Katsuyuki; Shigematsu, Satoshi; Morimura, Hiroki; Hirata, Akihiko;, Assignee: Nippon Telegraph and Telephone Corporation (Tokyo, JP) |
Surface shape recognition apparatus
It is an object of the present invention to improve the reliability of a surface shape recognition apparatus for recognizing a small surface shape such as a three-dimensional pattern on a finger skin ... Read More
Inventors: Morimura, Hiroki; Shigematsu, Satoshi; Machida, Katsuyuki; Kyuragi, Hakaru;, Assignee: Nippon Telegraph and Telephone Corporation (Tokyo, JP) |
Magnetic random access memory having digit lines and bit lines with shape and induced anisotropy ferromagnetic cladding layer and method of manufacture
OF THE DRAWING FIGURES FIG. 1 illustrates a top view of a portion of a micromachined magneto-electronic component 100, and FIG. 2 illustrates a cross-sectional view of a portion of micromachined magn... Read More
Inventors: Rizzo, Nicholas D.;, Assignee: Motorola, Inc. (Schaumburg, IL) |
Flip chip optical semiconductor on a PCB
The present invention provides semiconductor devices and methods for making semiconductor devices. In one embodiment, a semiconductor device includes a PCB, a optical semiconductor, underfill material... Read More
Inventors: Mostafazadeh, Shahram; Smith, Joseph O.; Penry, Matthew D.;, Assignee: National Semiconductor Corporation (Santa Clara, CA) |
Multicolor-color sensor
What is claimed is: 1. A four-contact multicolor sensor comprising: a transparent front contact turned toward an incident light source; a first diode function of microcrystalline or amorphous silicon ... Read More
Inventors: Stiebig, Helmut; Knipp, Dietmar; Folsch, Joachim; Wagner, Heribert;, Assignee: Forschungszentrum Julich GmbH (Julich, DE) |
Laminated polyolefin films and methods of production thereof by coextrusion
It is therefore an object of the present invention to provide a method of not only producing a laminated polyolefin film by coextrusion but also providing it with superior and durable antistatic and a... Read More
Inventors: Itaya, Yukiyasu; Hiei, Michiya; Kamei, Toshiya;, Assignee: Takemoto Yushi Kabushiki Kaisha (Aichi, JP) |
Microelectromechanical accelerometer for automotive applications
Process For Making a Microelectromechanical Accelerometer In one embodiment of the invention, capacitance-based accelerometers are fabricated utilizing a modified version of the process known as Sing... Read More
Inventors: Galvin, Gregory J.; Davis, Timothy J.; MacDonald, Noel C.;, Assignee: Cornell Research Foundation Inc. (Ithaca, NY); Kionix, Inc. (Ithaca, NY) |
Light-emitting diode and the manufacturing method of the same
To solve the problems in the existing manufacturing procedures, the invention provides an LED and the manufacturing method thereof. A GaN thick film with a slant surface is formed on a substrate surfa... Read More
Inventors: Pan, Shyi-Ming; Tsay, Jenq-Dar; Tu, Ru-Chin; Hsu, Jung-Tsung;, Assignee: Industrial Technology Research Institute (Hsinchu Hsien, TW) |
Integrated ambient sensing devices and methods of manufacture
We have devised a method for forming multi-element probes on a single monolithic substrate such as a silicon planar device using photolithographic techniques to pattern the multiplicity of chemically ... Read More
Inventors: Lauks, Imants R.; Van der Spiegel, Jan;, Assignee: Integrated Ionics, Inc. (Dayton, NJ) |
Fabrication of a multi-structure ion sensitive field effect transistor with a pH sensing layer of a tin oxide thin film
Therefore, the present invention seeks to solve the problems described in the prior art with one kind of sensing membrane material, tin oxide (SnO.sub.2). The sensing characteristics of tin oxide is c... Read More
Inventors: Chou, Jung-Chuan; Chung, Wen-Yaw; Hsiung, Shen-Kan; Sun, Tai-Ping; Liao, Hung-Kwei;, Assignee: National Science Council (Taipei, TW) |
Method for controlling of thermal donor formation in high resistivity CZ silicon
Among the features of the present invention, therefore, is the provision of a single crystal silicon wafer, and a process for the preparation thereof, which has at least a high resistivity surface lay... Read More
Inventors: Binns, Martin J.; Falster, Robert J.; Libbert, Jeffrey L.;, Assignee: MEMC Electronic Materials, Inc. (St. Peters, MO) |
Anti-reflection colored film-coated glass products and plasma display panel optical filters
What is claimed is: 1. An anti-reflection colored film-coated glass product prepared by forming on a transparent glass substrate with a refractive index of 1.47-1.53, a high refractive index film with... Read More
Inventors: Nakamura, Koichiro; Tsujino, Toshifumi;, Assignee: Nippon Sheet Glass Co., Ltd. (JP) |
Resin composition for aqueous paints
We claim: 1. A cationic electrodeposition coating composition (V) comprising as a main component a mixture of a cationizable resin (U) having a primary hydroxyl group and a hardening agent (H), wherei... Read More
Inventors: Fujibayashi, Toshio; Nagaoka, Haruo;, Assignee: Kansai Paint Co., Ltd. (Hyogo, JP) |
MEMS 
