Cold-cathode ion source with a controlled position of ion beam
We claim: 1. A method for controlling position of an ion beam on the surface of an object to be treated with said ion beam, comprising: providing a cold-cathode ion source with crossed electrical and ... Read More
Inventors: Maishev, Yuri; Ritter, James; Velikov, Leonid; Shkolnik, Alexander;, Assignee: Advanced Ion Technology, Inc. (Fremont, CA) |
Cryogenic annealing of sputtering targets
The present invention is directed to a method for cryogenically annealing a sputtering target to provide a uniformly dense molecular target structure. This method relieves residual stresses in the tar... Read More
Inventors: Hunt, Thomas J.; Gilman, Paul S.; Joyce, James E.; Lo, Chi-Fung; Draper, Darryl;, Assignee: Praxair S.T. Technology, Inc. (North Haven, CT) |
Method of forming robust metal, metal oxide, and metal alloy layers on ion-conductive polymer membranes
What we claim is: 1. A dual beam assisted deposition process for the purpose of an ion-conducting membrane provided with a thin metal or metal oxide film comprising subjecting the ion-conductive membr... Read More
Inventors: Allen, Robert J.; Giallombardo, James R.;, Assignee: De Nora S.p.A. (IT) |
Method for deposition of diamond-like carbon and silicon-doped diamond-like carbon coatings from a hall-current ion source
OF THE INVENTION A detailed description of the Hall-Current ion source of the present invention, its operation, and embodiments are set forth in U.S. Pat. No. 5,973,447, the detailed description of w... Read More
Inventors: Mahoney, Leonard Joseph; Brown, David Ward; Petrmichl, Rudolph Hugo;, Assignee: Diamonex, Incorporated (Allentown, PA) |
Polymer electrolyte fuel cell
OF THE PREFERRED EMBODIMENTS Referring to FIG. 3, there are shown relationships between the water transportation amount J.sub.M, the maximum water supply amount J.sub.A(MAX) at the anode side and the... Read More
Inventors: Hirano, Shinichi; Fujikawa, Futoshi;, Assignee: Mazda Motor Corporation (Hiroshima-ken, JP) |
Cold-cathode ion source with propagation of ions in the electron drift plane
OF THE INVENTION The invention will be now described in more detail with reference to different embodiments which differ from each other by mutual locations and configurations of magnets, anodes, cat... Read More
Inventors: Maishev, Yuri; Ritter, James; Terentiev, Yuri; Velikov, Leonid;, Assignee: Advanced Ion Technology, Inc (Freemont, CA) |
Apparatus for inductively-coupled-plasma-enhanced ionized physical-vapor deposition
The present invention provides an apparatus and method for processing a substrate such as a semiconductor wafer using physical-vapor deposition (PVD) (particularly plasma sputtering) that substantiall... Read More
Inventors: Moslehi, Mehrdad M.;, Assignee: CVC Products, Inc. (Rochester, NY) |
Universal cold-cathode type ion source with closed-loop electron drifting and adjustable ionization gap
OF THE INVENTION FIGS. 4 to 8----Ion-Beam Source with Anode Moveable with Respect to Cathode FIG. 4 is a sectional side view of an ion-beam source according to an embodiment of the invention in which... Read More
Inventors: Maishev, Yuri; Ritter, James; Velikuv, Leonid;, Assignee: |
Supercapacitor structure
What is claimed is: 1. A supercapacitor structure formed as a unitary flexible laminate structure comprising: a) a first electrode member of first polarity, comprising a flexible polymeric matrix memb... Read More
Inventors: Amatucci, Glenn G.; DuPasquier, Aurelien; Tarascon, Jean-Marie;, Assignee: Telcordia Technologies, Inc. (Morristown, NJ) |
Photovoltaic device, manufacturing method of photovoltaic device, photovoltaic device integrated with building material and power-generating apparatus
In view of the circumstances described above, an object of the present invention is to provide a photovoltaic device having excellent collective performance, that is, a photovoltaic device which is ca... Read More
Inventors: Shiozaki, Atsushi;, Assignee: Canon Kabushiki Kaisha (Tokyo, JP) |
Battery system for implantable medical device
The present battery system provides a dual battery system for use within an implantable medical device. The battery housings of the system share a common wall. The shared common wall of the dual batte... Read More
Inventors: Maile, Keith R.; Warren, Jay A.;, Assignee: Cardiac Pacemakers, Inc. (St. Paul, MN) |
Electrochemical device
Accordingly, one object of the invention is to provide a means for increasing the durability of multilayer electrochemical systems capable of reversibly inserting ions, most particularly electrochromi... Read More
Inventors: Giron, Jean-Christophe;, Assignee: Saint-Gobain Vitrage (Courbevoie, FR) |
Integrated thin-film solar battery
In view of the aforementioned related art, one object of the present invention is to provide a sputtering-deposition method capable of preventing a conducive layer from being charged up and thus disch... Read More
Inventors: Kondo, Masataka; Suzuki, Takayuki;, Assignee: Kaneka Corporation (Osaka, JP) |
Selectively activatable solar cells for integrated circuit analysis
The present invention is exemplified in a number of implementations and applications, some of which are summarized below. In connection with the post-manufacturing analysis of integrated circuit devic... Read More
Inventors: Goruganthu, Rama R.; Birdsley, Jeffrey D.; Bruce, Michael R.; Davis, Brennan V.; Ring, Rosalinda M.;, Assignee: Advanced Micro Devices, Inc. (Sunnyvale, CA) |
Apparatus and method for fabricating a microbattery
In one embodiment, a set of four Si wafers is used to form the planar microbattery structure. The two exterior Si wafers or frames are used to enclose and seal the anode and cathode of the microbatter... Read More
Inventors: Shul, Randy J.; Kravitz, Stanley H.; Christenson, Todd R.; Zipperian, Thomas E.; Ingersoll, David;, Assignee: Sandia Corporation (Albuquerque, NM) |
Structure of thin-film lithium microbatteries
The highest capacity thin film cathode layers (LiCoO.sub.2) typically require an annealing step of 700.degree. C. Since this high temperature is not compatible with silicon device technology or flexib... Read More
Inventors: Whitacre, Jay F.; Bugga, Ratnakumar V.; West, William C.;, Assignee: The United States of America as represented by the Administrator of the (Washington, DC) |
Method for improving electrical conductivity of a metal oxide layer on a substrate utilizing high energy beam mixing
It would therefore, be highly desirable to provide a new and improved method for enhancing the electrical conductivity of metals, metal alloys and metal oxides which does not require additional heat t... Read More
Inventors: Muffoletto, Barry C.; Shah, Ashish; Stephenson, Donald H.;, Assignee: Wilson Greatbatch Ltd. (Clarence, NY) |
Ship self-defense missile weapon system
A preferred embodiment of the present invention provides a ship self-defense missile (SSDM) weapon system for launching a plurality of light weight missiles from an existing vertical tube launch infra... Read More
Inventors: Crabtree, Daniel;, Assignee: The United States of America as represented by the Secretary of the Navy (Washington, DC) |
Thin film solid oxide fuel cell and method for forming
OF THE INVENTION It is preferred to fabricate a TFSOFC with a thin electrolyte layer to reduce the resistive loss in the electrolyte. The electrolyte layer should be dense and pore-free to prevent ga... Read More
Inventors: Chen, Xin; Wu, Naijuan; Ignatiev, Alex;, Assignee: University of Houston (Houston, TX) |
Fabrication of three-dimensional architecture for solid state radiation detectors
U.S. Patent No. 5,889,313 provided a three-dimensional solid-state radiation detector fabricated on a substrate formed of a material doped with a first conductivity type dopant, whose first and second... Read More
Inventors: Parker, Sherwood; Kenney, Christopher J.;, Assignee: University of Hawai'i (Honolulu, HI) |
Solid state imaging device, method of making the same and imaging unit including the same
According to one aspect of the invention, a solid state imaging device includes a package substrate; and a solid state imaging element mounted on the package substrate. The package substrate has a mou... Read More
Inventors: Miyazaki, Keishi; Kudo, Yasuhito; Sasaki, Kimihide;, Assignee: Sharp Kabushiki Kaisha (Tokyo, JP) |
Arrays of stacked metal coordination compounds
This invention pertains to a novel process for preparing arrays of metal coordination compounds useful in photosensitive elements. The layers of the array are arranged such that the metal atoms are st... Read More
Inventors: Bulkowski, John E.;, Assignee: University of Delaware (Newark, DE) |
Micro-machined electromechanical system (MEMS) accelerometer device having arcuately shaped flexures
The present invention overcomes limitations of the prior art for providing proof mass suspension in a force sensor, which is critical to isolating the accelerometer mechanism from in-plane force input... Read More
Inventors: Eskridge, Mark H.;, Assignee: Honeywell International, Inc. (Morristown, NJ) |
Semiconductor device and method of fabricating same
It is an object of the present invention to provide a method of fabricating TFTs in which the foregoing problems have been mitigated. One embodiment of the present invention lies in a device comprisin... Read More
Inventors: Yamazaki, Shunpei;, Assignee: Semiconductor Energy Laboratory Co., Ltd. (Kanagawa-ken, JP) |
Trench isolation for micromechanical devices
In order to achieve the foregoing and to overcome the problems inherent in prior electrical isolation schemes, the present invention is directed to a beam-level isolation technique in which insulating... Read More
Inventors: Adams, Scott G.; Shaw, Kevin A.; Webb, Russell Y.; Reed, Bryan W.; MacDonald, Noel C.; Davis, Timothy J.;, Assignee: Kionix, Inc. (Ithaca, NY); Cornell Research Foundation Inc. (Ithaca, NY) |
Method of making diode having reflective layer
OF THE INVENTION Reference will now be made in detail to the present invention, examples of which are illustrated in the accompanying drawings. In order to fabricate GaN-based light emitting diodes (... Read More
Inventors: Yoo, Myung Cheol;, Assignee: Oriol, Inc. (Santa Clara, CA) |
Electrode structures
The method is based on the enhancement of material removal rates that are obtained when materials are exposed to a directed ion beam at oblique ion incidence. The enhanced erosion rate allows the pref... Read More
Inventors: Syms, Richard;, Assignee: Microsaic Systems Limited (London, GB) |
Wafer bonding hermetic encapsulation
One object of the present invention is to provide a method for encapsulation which does not rely on encapsulation of an electronic device in a resin. Another object of the present invention is to prov... Read More
Inventors: Enquist, Paul M.; Tong, Qin-Yi; Fountain, Jr., Gaius Gillman; Markunas, Robert;, Assignee: Ziptronix (Research Triangle Park, NC) |
Etch control seal for dissolved wafer micromachining process
An embodiment of the present invention modifies a dissolved wafer micromachining process by providing an etch control seal around the perimeter of a heavily doped micromechanical structure formed on t... Read More
Inventors: Hays, Kenneth M.;, Assignee: Rockwell International Corporation (Seal Beach, CA) |
Dry etch process control using electrically biased stop junctions
Microelectromechanical systems (MEMS) are microdevices widely used as advanced sensors, microfluidic controls, or micromachines. Advanced MEMS sensors can be found in automobiles, medical instrumentat... Read More
Inventors: Peeters, Eric; Kubby, Joel A.;, Assignee: Xerox Corporation (Stamford, CT) |
MEMS 
