Coated ceramic substrates for mounting integrated circuits

DETAILED DESCRIPTION Accordingly, it is one object of the present invention to provide improved ceramic surfaces for mounting or containing integrated circuits.
Another object of the present invention is to provide a ceramic substrate or surface, useful for mounting or containing integrated circuit chips, which obviates the problem of alpha-particles coming into contact with a thereon mounted integrated circuit chip.
A further object of this invention is to provide a ceramic substrate, useful for mounting integrated circuits, having increased surface smoothness and controlled surface texture.
A still further object of the present invention is to provide an integrated circuit comprising a ceramic substrate or enclosure which exhibits reduced soft error rates.
These and other objects are accomplished herein by providing a ceramic substrate or container, having coated on at least a portion of at least one surface thereof a layer of a substance free from alpha particle emission.
Integrated circuit modules comprised of said coated ceramic substrate or container having at least one integrated circuit chip mounted thereon or within and methods for the production thereof are also described herein.
Moreover, methods for providing modified ceramic surfaces having controlled surface texture are also provided herein, said methods involving coating a ceramic surface with a layer of a substance which may or may not emit alpha-particles.