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Copper foil for printed wiring board having excellent chemical resistance and heat resistance
| Details |
Inventors: Fujiwara, Kazuhisa; Tan, Hiroshi; Fujii, Mitsuo; Tsushima, Masanobu;
Assignee: Mitsui Mining & Smelting Co., Ltd. (JP)
Primary Examiner: Jones; Deborah
Assistant Examiner: McNeil; Jennifer
Attorney, Agent or Firm: Jenkens & Gilchrist
This invention provides a copper foil for a printed wiring board, which comprises a copper foil, an alloy layer (A) comprising copper, zinc, tin and nickel which is formed on a surface of the copper foil, said surface to be brought into contact with a substrate for a printed wiring board, and a chromate layer which is formed on a surface of the alloy layer (A,. The copper foil for a printed wiring board has the following features: even if a printed wiring board is produced using a long-term stored copper foil, the interface between the copper foil and the substrate is only slightly corroded with chemicals; even if the copper foil contacts a varnish containing an organic acid, e.g., a varnish for an acrylic resin, in the formation of a copper-clad laminate, the bond strength is sufficient. Even if a printed circuit board made by using the copper foil is placed in a high temperature environment, e.g., in an engine room of an automobile, for a long period of time, blistering of the copper circuit from the substrate due to deterioration of the interface between the copper circuit and the substrate does not take place. |
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DETAILED DESCRIPTION The copper foil for a printed wiring board according to the invention comprises a copper foil, an alloy layer (A) comprising copper, zinc, tin and nickel which is formed on a surface of the copper foil, and a chromate layer which is formed on a surface of the alloy layer (A), said surface to be laminated with a substrate for a printed wiring board.
The alloy layer (A) is preferably obtained by heating a zinc-tin layer and a zinc-nickel layer formed on a copper foil at a temperature of 80 to 260.
degree.
C.
The copper foil according to the present invention may further have a silane coupling agent layer on a surface of the chromate layer.
The copper foil for a printed wiring board according to the invention has excellent chemical resistance after long-term storage.
Even if the copper foil is contacted with a varnish containing organic acid, such as a varnish for an acrylic resin, in the formation of a copper-clad laminate, the bond strength between the substrate and the copper foil is sufficient.
Further, after lamination and patterning of the copper, the interface between the copper pattern and the substrate shows excellent chemical resistance.
That is to say, by the use of the copper foil, corrosion of the interface between the copper (wiring) pattern and the substrate in the resulting printed wiring board by an acid solution such as a cupric chloride aqueous solution or an alkaline solution such as an ammonium persulfate aqueous solution hardly occurs, so that the bond strength between the excellent copper pattern and the substrate can be maintained.
The copper foil for a printed wiring board according to the invention exhibits excellent heat resistance.
On this account, even if a printed circuit board made by using the copper foil of the invention is placed in an engine room of an automobile and exposed to high temperature for a long time, the interface between the copper circuit and the substrate hardly suffers and hence high peel strength of the copper circuit with the substrate can be maintained
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