Method of making silicon nitride base cutting tools -II |
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Aerator |
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Low thermal expansion modified cordierites |
| OF THE INVENTION Referring now to FIG. 1, there is seen a flow sheet showing the process for ... |
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Method of manufacturing low thermal expansion modified cordierite ceramics |
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Method of protecting Si.sub.3 N.sub.4 ceramic alloy during heating |
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Automated process for solvent separation of organic/inorganic substance |
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Refractory binder |
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Apparatus and method of manufacture of articles containing controlled amounts of binder |
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Glass compositions with low dielectric losses
| Details |
Inventors: Sack, Werner;
Assignee: Schott Glaswerke (Mainz, DE)
Primary Examiner:
Assistant Examiner:
Attorney, Agent or Firm:
Alkali-free glasses with low dielectric losses, thermal expansion coefficients of 3.15 to 4.97.times.10.sup.-6 /.degree.C. in the temperature range from 20.degree. to 300.degree. C., adequate acid resistance, dielectric loss factors tan .delta. of 3.94 to 24.9.times.10.sup.-4 and processing temperatures (V.sub.A) of 1132.degree. to 1280.degree. C., have the following composition (in weight percent): 52.50-60.20 SiO.sub.2, 2.80-3.80 B.sub.2 O.sub.3, 8-14 Al.sub.2 O.sub.3, 6.0-20.20 PbO, 2.0-13.5 CaO, 0-3.5 MgO, 0-8 ZnO, 0-4.7 BaO, .SIGMA.PbO, CaO, MgO, ZnO, BaO 21.10-34.0, 0-1.0 F, 0.20-0.50 Sb.sub.2 O.sub.3. |
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DETAILED DESCRIPTION What is claimed is: 1. A glass consisting essentially of, in analysis oxide weight percent, SiO. sub. 2 : 52. 50 to 60. 20 B. sub. 2 O. sub. 3 : 2. 80 to 3. 80 Al. sub. 2 O. sub. 3 : 8. 00 to 14. 00 PbO: 6. 00 to 20. 20 CaO: 2. 00 to 13. 50 MgO: 0 to 3. 50 ZnO: 0 to 8. 00 BaO: 0 to 4. 70 PbO+CaO+MgO+ZnO+BaO: 21. 10 to 34. 00 F: 0 to 1. 00 Sb. sub. 2 O. sub. 3 : 0. 20 to 0. 50 wherein 100 wt. % is exclusive of Sb. sub. 2 O. sub. 3, and being essentially alkali metal-free and having the following properties: a thermal expansion coefficient in the temperature range from 20. degree. to 300. degree. C. of 3. 15 to 4. 97. times. 10. sup. -6 /. degree. C. , an acid resistance whereby the glass falls within the third class or better in the acid-resistance table according to DIN 12116, a water stability whereby the glass falls within the first class or better in the water stability table according to DIN 12111, a T. sub. k100 value of >500. degree. C. , a dielectric constant (. epsilon. )--measured at 50 and 500 Hz in each case at 20. degree. and 70. degree. C. --of 5. 95 to 7. 02, a dielectric loss factor (tan . delta. )--also measured at 50 and 500 Hz at 20. degree. and 70. degree. C. in each case--of 3. 94 to 24. 9. times. 10. sup. -4, a transformation temperature (Tg) of 622. degree. to 663. degree. C. , a softening temperature (Ew) of 849. degree. to 898. degree. C. , a processing temperature (V. sub. A) of 1132. degree. to 1280. degree. C. , and a density (D) of 2. 69 to 2. 992 g/cm. sup. 3. 2. A glass of claim 1 consisting essentially of, in analysis oxide weight percent, SiO. sub. 2 : 52. 50 to 55. 70 B. sub. 2 O. sub. 3 : 3. 00 to 3. 80 Al. sub. 2 O. sub. 3 : 8. 00 to 14. 00 PbO: 13. 50 to 20. 20 CaO: 2. 00 to 13. 50 MgO: 0 to 3. 50 ZnO: 0 to 8. 00 BaO: 0 to 4. 70 PbO+CaO+MgO+ZnO+BaO: 30. 50 to 34. 00 Sb. sub. 2 O. sub. 3 : 0. 20 to 0. 50 and being essentially alkali metal- and fluorine-free and having the following properties: a thermal expansion coefficient of 3. 37-4. 97. times. 10. sup. -6 /. degree. C. in the temperature range from 20. degree. -300. degree. C. , a dielectric constant (
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