DETAILED DESCRIPTION What is claimed is: 1.
A blend of 2,2-bis[4-(3,4-dicarboxyphenoxy)phenyl]propane/bis(4-aminophenyl) sulfone polyetherimide and 3,3', 4,4'-tetracarboxybiphenyl/bis(4-aminophenyl) sulfone polyimide.
Description:
CROSS REFERENCE TO RELATED APPLICATION Reference is also made to applications Ser.
No.
07/303,988, now U.
S.
Pat.
No.
4,965,337; Ser.
No.
07/546,963, now U.
S.
Pat.
No.
5,157,589; and Ser.
No.
07/546,965, now U.
S.
Pat.
No.
5,338,975.
BACKGROUND OF THE INVENTION The present invention relates to the employment of solutions or uniform blends of polyimide having condensed units selected from, ##STR1## a mixture thereof, referred to hereinafter as "SDAN" units or bis(4-aminophenylsulfonyl) units and "DAPI" units, or diaminophenylindane units.
More particularly, the present invention relates to certain polyimide compositions useful for providing chip adhesives, or laminating or film adhesives for making multi-chip high density interconnect (HDI) integrated circuit packaging configurations.
Prior to the present invention as shown by Eichelberger et al, U.
S.
Pat.
No.
4,783,695, various resins, such as Ultem.
RTM.
polyetherimide and epoxy resins were used to bond chips to various substrate, such as ceramic, alumina, metal, glass or plastic.
In this HDI approach, successive layers of dielectric and patterned metal are fabricated over the bare chips on a ceramic substrate to provide a completed electronic device.
In addition to bonding chips, thermoplastic adhesives have been used to bond films, such as Kapton.
RTM.
resin to the applied chips.
When fabricating HDI configurations, polymers with different Tg's or softening points are required, because the temperature for bonding films over the substrate and chips must be kept below the Tg of the chip adhesive to prevent inadvertent chip movement during manufacture.
Other important characteristics needed by polymers used in HDI applications are good adhesion to electronic components and metal, appropriate optical absorption for laser fabrication of via holes, and the ability to be easily removed
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Manufacturing Materials 
