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Method-for-mounting-a-wafer-loading-device-to-a-process-machine

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Method for mounting a wafer loading device to a process machine

Details

Inventors: Chen, Shie Home;
Assignee: Taiwan Semiconductor Manufacturing Co. Ltd. (Hsin-Chu, TW)
Primary Examiner: Graybill; David
Assistant Examiner:
Attorney, Agent or Firm: Tung & Associates

The present invention discloses a method for mounting a peripheral device, such as a wafer loading device, to a semiconductor process tool that includes sensor means in the mounting surface of the peripheral device such that improper mounting between the two components can be detected and a signal can be sent out to a host computer to disable the peripheral device and to stop its motion and thus prevent any damages to the components or the substrates it carries. The peripheral device may further include spring means mounted in its mounting surface to enable the peripheral device to be pushed away from the process tool to provide a visual indication to a machine operator when the two components are not properly mounted together.

DETAILED DESCRIPTION In accordance with the present invention, a method for mounting a wafer loading device to a semiconductor process tool is provided by installing a sensor means in the mounting surface of the loading device such that an improper mating of the mounting surface of the device to a corresponding mounting surface on the process tool can be detected and then a signal can be sent to a controller for disabling the loading device.
In a preferred embodiment, a method for mounting a peripheral device to a semiconductor process tool can be carried out by first providing a semiconductor process tool that has a first mounting surface, then providing a peripheral device that has a second mounting surface adopted for mating intimately to the first mounting surface, the second mounting surface is equipped with sensor means capable of sending a first signal when the first and the second mounting surfaces are not mated properly, and then transmitting the first signal to a controller to disable the peripheral device.
In another embodiment, a method for mounting a wafer loading device to a semiconductor process tool can be carried out by first providing a semiconductor process tool that has a first mounting surface, then providing a wafer loading machine that has a second mounting surface adopted for mating intimately to the first mounting surface, the second mounting surface is equipped with sensor means that is capable of sending a first signal when the first and second mounting surfaces are not mated intimately, and then transmitting the first signal into a controller to disable the wafer loading device.
The sensor means can be at least one microswitch that is capable of detecting a separation of the first mounting surface from the second mounting surface and then sending a signal to a controller or host computer when such detection is made.
The second mounting surface may optionally be equipped with spring means that is capable of separating the first and the second mounting surfaces when they are not securely fastened together by mechanical means

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