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| Apparatus for heating purge gas and transmitting microwave energy for desiccant regeneration |
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Photosensitive composition
| Details |
Inventors: Fukutani, Hideo; Miura, Konoe; Takahashi, Yoshihiro; Torige, Kazuo;
Assignee: Mitsubishi Chemical Industries, Ltd. (Tokyo, JA)
Primary Examiner: Brammer; Jack P.
Assistant Examiner:
Attorney, Agent or Firm: Oblon, Fisher, Spivak, McClelland & Maier
A photosensitive composition is prepared from a mixture of a photosensitive resin containing radicals having the formula ##STR1## wherein X and Y represent hydrogen, halogen, cyano or nitro, Ar represents an aryl radical or a substituted aryl radical, and n represents 1 or 2, and a solvent having the formula ##STR2## wherein R and R" represent a lower alkyl radical and R' represents a lower alkylene radical. |
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DETAILED DESCRIPTION What is claimed as new and intended to be covered by Letters Patent of the United States is: 1.
A photosensitive composition which consists essentially of: a photosensitive amount of a photosensitive resin containing units of the formulas: ##STR8## wherein Ar is phenyl in an amount of 4-methoxy-4-methylpentanone -2, 4-ethoxy-butanone-2 or 4-ethoxy-4-methylpentanone-2 sufficient to dissolve said photosensitive resin, to maintain an acceptable sensitivity of said composition, to stabilize said resin upon storage and to permit a uniform thin membrane to form when said composition is coated.
2.
The photosensitive composition of claim 1 which can be used as a photoresist or for photographic printing plates.
3.
The photosensitive composition of claim 1, which further consists essentially of a sensitizer.
Description:
BACKGROUND OF THE INVENTION 1.
Field of the Invention This invention relates to photosensitive compositions.
More particularly, the invention relates to photosensitive compositions which have a high resolving power and high reproducibility and which are suitable for use in the formation of relief images and in photo-etching processes.
2.
Description of the Prior Art Many systems are known in which a photosensitive synthetic resin is coated on a suitable support or substrate as a thin layer, and then the coated layer is exposed to light through a mask whereby the unexposed portion of the coated layer is removed by dissolution in a solvent leaving the exposed material behind.
This type of procedure has been found useful in many industrial processes such as printing, precision processing, printed circuits, the manufacture of integrated circuits (IC) and the like.
However, the conventional photosensitive resin systems have several disadvantages when used in these applications, and a number of improvements have been proposed to overcome these disadvantages.
These improvements have been particularly applicable to processes in which fine line patterns must be reproduced such as in the photofabrication field, the electronics field, and particularly in the manufacture of integrated circuits, and LSI
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Manufacturing Materials 
