DETAILED DESCRIPTION OF PREFERRED EMBODIMENTS The process according to the invention for depositing a layer containing boron (B) and nitrogen (N) on a substrate is characterized in that a layer containing B and N is deposited by decomposing a compound of the general formula (I), (II) or (III) ##STR2## wherein R.
sup.
1, R.
sup.
2 and R.
sup.
3 may be identical or different and represent: linear or branched alkyl with 1 to 12 C atoms; linear or branched alkyl, substituted by one or more substituents selected from the group consisting of halogen, lower alkoxy, di-lower alkylamine, and the adduct thereof with BH.
sub.
3 ; linear or branched alkyl, substituted by one or more aryl radicals, in particular phenyl; linear or branched alkyl, substituted by one or more aryl radicals, which themselves are substituted by one or more substituents selected from the group consisting of halogen, lower alkyl, and halogenated lower alkyl; cycloalkyl, cycloalkenyl or cycloalkadienyl with a C4 to C7 carbon ring; cycloalkyl, cycloalkenyl or cycloalkadienyl with a C4 to C7 carbon ring, substituted by lower alkyl; aryl, in particular phenyl, toluyl, aryl with one or more condensed rings, in particular naphthyl; aryl, in particular phenyl, substituted by one or more substituents selected from the group consisting of halogen, lower alkyl; lower alkyl substituted by halogen; lower alkoxy; di-lower alkylamine; phenyl; cycloalkyl with C4 to C7 carbon ring; alkenyl with 2 to 4 C atoms; tri-lower alkyl silyl; and halogen, preferably fluorine.
As used herein the term "lower alkyl" refers to C1 to C3 alkyl.
R.
sup.
1, R.
sup.
2 and R.
sup.
3 may, for example, each individually represent a methyl, ethyl, n-propyl, i-propyl, n-butyl, isobutyl, sec-butyl, t-butyl, CH.
sub.
2 --CF.
sub.
3, CH.
sub.
2 --CH.
sub.
2 Cl, CH.
sub.
2 --CCl.
sub.
3, CH.
sub.
2 --CH.
sub.
2 Br, CH.
sub.
2 --CH.
dbd.
CH.
sub.
2, (CH.
sub.
2).
sub.
3 --Cl, (CH.
sub.
2).
sub.
3 --OCH.
sub.
3, (CH.
sub.
2).
sub.
3 --N(CH.
sub.
3).
sub.
2, (CH.
sub.
2).
sub.
3 --N(CH.
sub.
3).
sub.
2.
BH.
sub.
3, phenyl, C.
sub.
6 F
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Manufacturing Materials 
