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Process for the production of a coated copper alloy
| Details |
Inventors: Sugawara, Akira; Hana, Yoshitake; Endo, Takayoshi; Sugiyama, Osamu;
Assignee: Dowa Mining Co., Ltd. (Tokyo, JP); Yazaki Corporation (Tokyo, JP)
Primary Examiner: Thibodeau; Paul
Assistant Examiner: Rickman; Holly
Attorney, Agent or Firm: Frishauf, Holtz, Goodman, Langer & Chick, P.C.
The invention provides a process for producing a coated Cu alloy having a surface which has a low coefficient of friction and a high resistance to abrasion and is suitable for fabricating connectors, charging-sockets of electric automobiles etc. The coated Cu alloy is produced by coating the surface of a copper alloy with Sn and heat treating the coated Cu alloy at a temperature in the range of 100-450.degree. C. for 0.5-24 hours. The Cu alloy which is coated with Sn consists of 1-41 wt % Zn with the balance being Cu and incidental impurities. By using the coated Cu alloy, the force of insertion, resistance to abrasion and resistance to corrosion of connectors can be significantly improved. |
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DETAILED DESCRIPTION The present invention has been accomplished to solve the above-mentioned problems, and provides a copper alloy and a process for the production thereof.
The process of the invention comprises the steps of coating the surface of a copper alloy material with Sn or an Sn-alloy coating followed by applying heat treatment to the coated surface, thereby forming in the surface treated layer on said material a very hard coating containing Cu--Sn system intermetallic compounds (Cu.
sub.
3 Sn, Cu.
sub.
4 Sn etc.
) and Cu--Sn--Zn system lntermetallic compounds.
By doing this, the present invention provides a copper alloy having a surface which is suitable when used as a connector or as a charging-socket of an electric automobile because of its having a low coefficient of friction and high resistance to abrasion.
The present invention has been accomplished based on the finding that the surface hardness can be increased greatly by having a specified thickness of an Sn layer coated on a Cu alloy having a specified composition and also utilizing specified heat treating conditions.
This enables formation of Cu--Sn system intermetallic compounds (Cu.
sub.
3 Sn, Cu.
sub.
4 Sn etc.
) and Cu--Sn--Zn system intermetallic compounds, whereby the Vickers hardness (Hv) of the coated surface can be increased to 300 or more, preferably 400 or more, which is remarkably higher than the hardness of Sn-plated surfaces (60 to 120) or that of matrix (80 to 250); thus the invention provides a copper alloy and a process for the production of the alloy which has electrical and working characteristics suitable for making connectors of an automobile and charging-sockets of an electric automobile, having a surface with a low coefficient of friction and superior resistance to abrasion.
In one aspect, the invention provides a coated copper alloy having a surface coating of Sn wherein said copper alloy consists essentially of 1-41 wt % Zn with the balance being Cu and incidental impurities, said surface coating is formed by surface treating said copper alloy with Sn, followed by heat treating the Sn coated copper alloy to cause heat diffusion so as to form a surface coating consisting essentially of Cu and Sn, said surface coating extending to the depth which includes at least the interface between said Sn layer and said copper alloy
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