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Ceramic circuit board
| Details |
Inventors: Naba, Takayuki;
Assignee: Kabushiki Kaisha Toshiba (Kawasaki, JP)
Primary Examiner: Lam; Cathy F.
Assistant Examiner:
Attorney, Agent or Firm: Oblon, Spivak, McClelland, Maier & Neustadt, P.C.
A ceramic circuit board is characterized by being constituted by bonding a ceramic substrate 2 and a metal circuit plate 3 to each other through a silver-copper-based brazing material layer 5 containing at least one active metal selected from Ti, Zr, Hf, V, Nb and Ta, and wherein the Vickers hardness of a reaction product layer 6 generated by causing the silver-copper-based brazing material layer 5 and the ceramic substrate 2 to react with each other is 1,100 or more. At least one element selected from In, Zn, Cd, and Sn is preferably contained in the silver-copper-based brazing material layer 5. Further, 0.1 to 10.0 wt % of carbon powder is preferably contained in the brazing material layer 5. According to the above arrangement, there can be provided a ceramic circuit board in which cracks are effectively suppressed from being formed even after a thermal cycle is repeatedly applied for a long period of time, i.e., a ceramic circuit board having so-called excellent heat-cycle resistance characteristics and high reliability. |
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DETAILED DESCRIPTION I claim: 1.
A ceramic circuit board, which comprises a ceramic substrate and a metal circuit plate bonded to each other through a silver-copper-based brazing material layer containing silver as a main component, carbon in an amount of 0.
1 to 10 wt %, and at least one active metal selected from the group consisting of Ti, Zr, Hf, V, Nb, and Ta, and wherein the Vickers hardness of a reaction product layer generated by causing the silver-copper-based brazing material layer and the ceramic substrate to react with each other is not less than 1100.
2.
A ceramic circuit board, which comprises a ceramic substrate and a metal circuit plate bonded to each other through a silver-copper-based brazing material layer containing silver as a main component, carbon in an amount of 0.
1 to 10 wt %, and at least one active metal selected from the group consisting of Ti, Zr, Hf, V, Nb and Ta, and wherein the silver-copper-based brazing material layer contains not less than 5 wt % and less than 20 wt % of at least one element selected from the group consisting of In, Zn, Cd and Sn.
3.
The ceramic circuit board of claim 1 or claim 2, wherein the silver-copper-based brazing material layer is a Ag-Cu-In-Ti-based brazing material layer.
4.
The ceramic circuit board of claim 1 or claim 2 which further comprises a metal plate bonded through a silver-copper-based material layer, to a ceramic substrate surface reverse to the surface to which the metal circuit plate is bonded.
5.
The ceramic circuit board of claim 1 or claim 2, wherein said carbon is in a form of carbon powder.
6.
The ceramic circuit board of claim 5, wherein the carbon powder content in the silver-copper-based brazing material layer is about 0.
1 to 5.
0 wt %.
7.
The ceramic circuit board of claim 5, wherein the active metal content in the silver-copper-based brazing material layer is about 0.
5 to 10 wt %.
8.
The ceramic circuit board of claim 5, wherein the silver-copper-based brazing material layer further contains at least one element selected from the group consisting of In, Zn, Cd, and Sn
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Metal Working 
