Home | Links | Contact Us | More About Intellectual Property | Bookmark
Search patents:
Home Metal Working Circuit-board-assembly-and-method-of-fabricating-same

 Golf driving mat
Accordingly, it is a principle object of the invention to provide a golf practice mat comprised of ...


 Turfing systems for stadia
In accordance with this invention a plurality of turf units for forming a continuous natural grass ...


 Process of laying synthetic grass
OF PREFERRED EMBODIMENTS With reference to FIG. 1, the invention relates to a synthetic grass turf ...


 Synthetic turf
It is the purpose of the present invention to provide an improved synthetic grass sports surface ...


 Synthetic turf game surface
FIG. 1 schematically illustrates a fragment of a synthetic turf pile carpet 10. The carpet has ...


 Method of making a ceramic capacitor
Accordingly, a principal object of the present invention is to provide a ceramic capacitor which ...


 Ion mobility spectrometer drift chamber
Therefore it is the object of the invention to improve a drift chamber of the kind mentioned above ...


 Miniaturized ion mobility spectrometer sensor cell
To accomplish the above and other objectives, the present invention provides for an improved ion ...


 Flexboard reflector
To this end, a novel technique utilizing the precision of printed circuit board design and the ...


 Methods of making composite ultrasonic transducers
Therefore, it is an object of the invention to provide a reliable and not excessively expensive ...


 Circuit board assembly and method of fabricating same

Details
Inventors: Morales, Jorge; Avitia, Cesar;
Assignee: Visteon Global Technologies, Inc. (Dearborn, MI)
Primary Examiner: Cuneo; Kamand
Assistant Examiner: Vigushin; John B.
Attorney, Agent or Firm: Brinks Hofer Gilson & Lione

A circuit board assembly and method of fabricating an assembly are provided. The assembly preferably comprises a first circuit board defining an aperture and a second circuit board having an edge. The first circuit board has at least one conductive feature proximate the aperture, and the second circuit board has at least one conductive feature proximate the edge. Each board has at least one circuit trace in electrical communication with its respective conductive feature. The conductive features of the boards are placed in electrical communication with each other by way of the edge of the second board being disposed in the aperture of the first board. A solder joint can be disposed on the assembly so as to connect the first and second boards.

DETAILED DESCRIPTION The present invention provides a circuit board assembly that defines structural features that allow for improved stability in the connection between two boards.
In one embodiment, the assembly comprises a first circuit board defining an aperture and a second circuit board having an edge.
The first circuit board has at least one conductive feature proximate the aperture, and the second circuit board has at least one conductive feature proximate the edge.
Each board has at least one circuit trace in electrical communication with its respective conductive feature.
The conductive features of the boards are placed in electrical communication with each other by way of the edge of the second board being disposed in the aperture of the first board.
This relationship places the circuit traces of the first board in electrical communication with the circuit traces of the second board.
The second board defines a hole proximate the edge.
Preferably, the hole extends through the entire thickness of the second board, i.
e.
, from a first side to a second side.
When the edge of the second board is disposed in the aperture of the first board, the hole is positioned near a surface of the main board.
As such, the hole is particularly well-suited for receiving a portion of a.
solder joint.
In a preferred embodiment, the assembly further comprises a solder joint connecting the two boards.
Preferably, the solder joint includes a first portion disposed in the hole and second and this portions disposed on the first board.
A fourth portion of the solder joint can be disposed within a void region defined by the first board proximate the aperture.
The present invention also provides a method of fabricating a circuit board assembly.
In a preferred embodiment, the method comprises providing a first circuit board; creating an aperture in the first circuit board; disposing a first conductive feature on the first circuit board proximate the aperture; providing a second circuit board having an edge, a second conductive feature proximate the edge, and defining a hole proximate the edge; disposing the edge of the second circuit board within the aperture of the first circuit board such that the conductive features of the two boards are in electrical communication with each other; and disposing a solder joint on the first and second circuit boards



Related patents
  Module substrate and method of producing the same
Accordingly, it is an object of the present invention to provide a module substrate of which the end-face electrodes can be securely connected to a mother board even if ...
  Method of attaching a fastening element to a panel
The improved method of attaching a fastening element to a panel of this invention is particularly, but not exclusively adapted for permanent installation of fastening ...
  Self-riveting fastening element
As described above, the improved self-riveting fastening element of this invention is designed for permanent attachment to a metal panel or plate within a panel opening ...
  Solid electrolytic capacitor and method for manufacturing the same
In order to address these problems, according to the present invention, a method for manufacturing a solid electrolytic capacitor including an anode conductor that is ...
  Void free, silicon filled trenches in semiconductors
One or more embodiments of the present invention provide methods of forming substantially void free trench structures in semiconductor devices. In accordance with one ...
  Electronic-component mounting system
It is therefore an object of the present invention to provide an electronic-component (EC) mounting system which includes a plurality of EC mounting units and mount ECs ...
  Method of measuring accuracy of electric-component mounting system
The present invention provides an accuracy measuring method, an accuracy-measuring-program recording medium, and an electric-component mounting system which have one or ...
  Artificial turf-like product
Accordingly, the primary and principal object of the present invention is to provide a synthetic turf-like product which provides a game playing surface having game ...
  Top dressed plating surface with resilient underpad
OF THE PREFERRED EMBODIMENTS The drawing figure comprises a sectional view through a playing surface according to the present invention. The playing surface 1 starts ...
  Synthetic grass playing field surface
Referring to the drawings, the playing field surface 10 comprises a stabilized base or support surface 11 covered by an underpad 12, upon which a synthetic grass-like, ...

0.014

Archive: All patents - Links

Copyright (c)2006 Eipa-patents.org - All rights reserved