Contact assembly

DETAILED DESCRIPTION In accordance with one embodiment of the present invention, a contact apparatus is provided to facilitate high contact densities, while minimizing crosstalk and inductances, and which can facilitate control of impedance.
The apparatus can include a frame of dielectric material having a plurality of cavities that each hold an extendable contact assembly.
Each contact assembly includes at least one probe projecting through a hole in the frame to project from a face of the frame, the probe being deflectable when a contact pad is pressed thereagainst.
A spring device that biases the probe is preferably formed of dielectric material to minimize inductance and allow for a small diameter contact assembly.
The contact assembly can include two probes with tips that project from opposite faces of the frame, with the two probes being permanently slideably engaged.
The contact apparatus can include a body with plated-through holes and end wall structure with bushing portions that fit into the holes.
The length and dielectric constant of the bushing portions can control the characteristic impedance of each coaxial conductor formed by a contact assembly in the hole and the grounded plating that lines the hole.
The novel features of the invention are set forth with particularity in the appended claims.
The invention will be best understood from the following description when read in conjunction with the accompanying drawings.